Abstract: A printed circuit board including a first insulating layer; a plurality of first circuit patterns respectively disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer and covering a portion of a side surface of each of the plurality of first circuit patterns; and an insulator disposed between at least one pair of adjacent first circuit patterns, among the plurality of first circuit patterns, and integrated with the first insulating layer, and a method for manufacturing a printed circuit board, are provided.

Abstract: The present invention relates to a coating composition comprising a multifunction acrylate-based oligomer, a thermoplastic polymer, and an organic solvent. The composition can be cured and thermoformed. A coating film made from the composition is capable of being thermoformed and has excellent hardness, durability, and scratch resistance. With the coating film, plastic products, which can be used instead of glass in various industries such as construction, electronic products and automobiles, are provided.

Abstract: Disclosed is an electronic device, which is connection device fastenable to a portable electronic device, comprising: a fastening part fastened to a USIM connector of the portable electronic device; a circuit board extending from the fastening part and connected to a plurality of connectors; a processor implemented on the circuit hoard; and a switching circuit unit, wherein the processor is set to supply power to an external device selected, through the switching circuit unit, from among at least one external device connected to the plurality of connectors or to transmit to and receive data from the selected external device. Additionally, various examples identified through the description are possible.

Abstract: The present invention relates to a conductive composition, and more particularly, to a conductive copper ink or paste composition for forming fine pattern which comprises a metal precursor and copper powder to increase the density of metal pattern formed during sintering and improve surface roughness, thereby being capable of achieving excellent electrical conductivity, adhesion strength to a substrate, and printability.

Abstract: The present invention relates to a conductive composition, and more particularly, to a conductive copper ink or paste composition for forming fine pattern which comprises a metal precursor and copper powder to increase the density of metal pattern formed during sintering and improve surface roughness, thereby being capable of achieving excellent electrical conductivity, adhesion strength to a substrate, and printability.

Abstract: Provided is a method of manufacturing a housing of an electronic device. The method includes manufacturing a housing body by successively stacking a composite material sheet with a plastic sheet applied to at least one surface of a top and a bottom surfaces of the composite material sheet and molding a plastic injection-molded product on the plastic sheet of the housing body through insert molding to connectively affix the composite material sheet with the housing body and the plastic sheet.

Abstract: Provided is a method of manufacturing a housing of an electronic device. The method includes manufacturing a housing body by successively stacking a composite material sheet with a plastic sheet applied to at least one surface of a top and a bottom surfaces of the composite material sheet and molding a plastic injection-molded product on the plastic sheet of the housing body through insert molding to connectively affix the composite material sheet with the housing body and the plastic sheet.