Patents by Inventor Hyun Sik Min

Hyun Sik Min has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8680402
    Abstract: A multi-layer Flexible Printed Circuit Board (FPCB) for an electronic device, in which a plurality of components are provided alternately on a top surface and a bottom surface of a base layer and the components are removed from the other region. The multi-layer FPCB includes a base layer, a first circuit pattern provided on a side region on a top surface of the base layer, a first adhesive layer provided in the first circuit pattern, a second circuit pattern provided on a bottom surface of the base layer and in an other-side region opposite to the side region, a second adhesive layer provided in the second circuit pattern, a first insulating/protecting layer provided on a top surface of the first adhesive layer, and a second insulating/protecting layer provided on a bottom surface of the second adhesive layer.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: March 25, 2014
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jong-Hun An, Hyun-Sik Min
  • Publication number: 20120186856
    Abstract: A multi-layer Flexible Printed Circuit Board (FPCB) for an electronic device, in which a plurality of components are provided alternately on a top surface and a bottom surface of a base layer and the components are removed from the other region. The multi-layer FPCB includes a base layer, a first circuit pattern provided on a side region on a top surface of the base layer, a first adhesive layer provided in the first circuit pattern, a second circuit pattern provided on a bottom surface of the base layer and in an other-side region opposite to the side region, a second adhesive layer provided in the second circuit pattern, a first insulating/protecting layer provided on a top surface of the first adhesive layer, and a second insulating/protecting layer provided on a bottom surface of the second adhesive layer.
    Type: Application
    Filed: July 7, 2011
    Publication date: July 26, 2012
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jong-Hun AN, Hyun-Sik Min
  • Patent number: 7936994
    Abstract: Disclosed is a broadband light source (BLS) necessary to implement wavelength-locked Fabry-Perot (FP) laser diodes (LDs) applicable to an optical subscriber network The BLS is based on a method using mutual injection of low-cost FP LDs and a method using FP LDs undergoing chirping. A power level of a light emitting diodes (LED), an erbium-doped fiber amplifier (EDFA), or a super luminescent diode (SLD) used as the conventional BLS is low and its cost is high, such that the conventional BLS is inefficient. However, the present invention can easily implement a low-cost BLS using proposed FP LDs.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: May 3, 2011
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Chang-Hee Lee, Jin-serk Baik, Ki-Man Choi, Hyun-Sik Min, Keun-Youl Park
  • Patent number: 7912372
    Abstract: The present invention relates to a passive optical network, which inexpensively improves the spectral efficiency of an access network and is capable of increasing the number of subscribers per channel by using WDM in combination with Time Division Multiplexing (TDM) or SubCarrier Multiple Access (SCMA) to expand a conventional WDM passive optical network.
    Type: Grant
    Filed: June 24, 2005
    Date of Patent: March 22, 2011
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Chang Hee Lee, Jin Serk Baik, Keun Youl Park, Seung Hyun Jang, Ki Man Choi, Hyun Sik Min
  • Publication number: 20080131127
    Abstract: Disclosed is a broadband light source (BLS) necessary to implement wavelength-locked Fabry-Perot (FP) laser diodes (LDs) applicable to an optical subscriber network The BLS is based on a method using mutual injection of low-cost FP LDs and a method using FP LDs undergoing chirping. A power level of a light emitting diodes (LED), an erbium-doped fiber amplifier (EDFA), or a super luminescent diode (SLD) used as the conventional BLS is low and its cost is high, such that the conventional BLS is inefficient. However, the present invention can easily implement a low-cost BLS using proposed FP LDs.
    Type: Application
    Filed: December 22, 2004
    Publication date: June 5, 2008
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Chang-Hee Lee, Jin-Serk Baik, Ki-Man Choi, Hyun-Sik Min, Keun-Youl Park