Abstract: An analog buffer, display device having the same and a method of driving the same are provided. The analog buffer applies an analog voltage to a load. The analog buffer includes a comparator and a transistor. The comparator is configured to compare an input voltage provided from an external device with the analog voltage applied to the load. The transistor is turned on to electrically charge the load when the analog voltage is lower than the input voltage or turned on to electrically discharge the load when the analog voltage is higher than the input voltage, and turned off when the analog voltage becomes substantially the same as the input voltage.

Abstract: An analog buffer, display device having the same and a method of drving the same are provided. The analog buffer applies an analog voltage to a load. The analog buffer includes a comparator and a transistor. The comparator is configured to compare an input voltage provided from an external device with the analog voltage applied to the load. The transistor is turned on to electrically charge the load when the analog voltage is lower than the input voltage or turned on to electrically discharge the load when the analog voltage is higher than the input voltage, and turned off when the analog voltage becomes substantially the same as the input voltage.

Abstract: The present invention relates to the impurity ion segregation precluding layer, the fabrication method thereof, the isolation structure for the semiconductor device using the segregation precluding layer and the fabrication method thereof, which are provided to prevent impurity ions from segregating into a device isolation region in a semiconductor substrate and eventually restrain decrease in a threshold voltage due to the segregation of impurity ion, particularly, boron ions in the semiconductor substrate. The isolation structure of the semiconductor device is fabricated by forming a trench in a portion of the semiconductor substrate; placing the semiconductor substrate into a high-temperature furnace; annealing the semiconductor substrate flowing a nitride gas at about 20 l/min into the furnace; and filling an insulator in the trench.

Abstract: The present invention relates to the impurity ion segregation precluding layer, the fabrication method thereof, the isolation structure for the semiconductor device using the segregation precluding layer and the fabrication method thereof, which are provided to prevent impurity ions from segregating into a device isolation region in a semiconductor substrate and eventually restrain decrease in a threshold voltage due to the segregation of impurity ion, particularly, boron ions in the semiconductor substrate. The isolation structure of the semiconductor device is fabricated by forming a trench in a portion of the semiconductor substrate; placing the semiconductor substrate into a high-temperature furnace; annealing the semiconductor substrate flowing a nitride gas at about 20 l/min into the furnace; and filling an insulator in the trench.