Abstract: A tantalum capacitor includes a sintered tantalum body including tantalum powder, a conductive polymer layer disposed on the sintered tantalum body and including a first filler, a carbon layer disposed on the conductive polymer layer; and a tantalum body including a tantalum wire penetrating through at least a portion of each of the sintered tantalum body and the conductive polymer layer in a first direction. A ratio of an area of the first filler to an area of the conductive polymer layer is greater than 0.38 in a first cross-section partially overlapping the sintered tantalum body, among cross-sections perpendicular to the first direction.

Abstract: A tantalum capacitor includes: first and second surfaces facing in a first direction, third and fourth surfaces facing in a second direction, and fifth and sixth surfaces facing in a third direction; a tantalum body having one surface through which a tantalum wire is exposed in the first direction; and a substrate on which the tantalum body is mounted, wherein the substrate may be an organic-inorganic composite substrate.

Abstract: A tantalum capacitor includes a sintered tantalum body including tantalum powder, a conductive polymer layer disposed on the sintered tantalum body and including a first filler, a carbon layer disposed on the conductive polymer layer; and a tantalum body including a tantalum wire penetrating through at least a portion of each of the sintered tantalum body and the conductive polymer layer in a first direction. A ratio of an area of the first filler to an area of the conductive polymer layer is greater than 0.38 in a first cross-section partially overlapping the sintered tantalum body, among cross-sections perpendicular to the first direction.

Abstract: A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing metal powder; and a conductive polymer layer disposed above the sintered body. A ratio (t2/t1) of a thickness (t2) of the conductive polymer layer in an edge portion of the sintered body to a thickness (t1) of the conductive polymer layer in a central portion of the sintered body satisfies 0.35?t2/t1?0.9.

Abstract: A tantalum capacitor includes: first and second surfaces facing in a first direction, third and fourth surfaces facing in a second direction, and fifth and sixth surfaces facing in a third direction; a tantalum body having one surface through which a tantalum wire is exposed in the first direction; and a substrate on which the tantalum body is mounted, wherein the substrate may be an organic-inorganic composite substrate.

Abstract: The present disclosure relates to a solid electrolytic capacitor, including a body comprising a tantalum wire disposed on one end thereof; a substrate, on which the body is disposed, comprising an insulating layer, first and second wiring layers respectively disposed on a first surface and a second surface, facing each other, of the insulating layer, and a via electrode penetrating the insulating layer to connect the first and second wiring layers to each other; and a connection portion connecting the tantalum wire to the first wiring layer.

Abstract: A tantalum capacitor includes a tantalum body, an encapsulation portion, first and second external electrodes spaced apart from each other on a lower surface of the encapsulation portion, a first plating layer disposed on one end surface of the encapsulation portion and a lower surface of the first external electrode to electrically connect the first external electrode and the tantalum body, an upper end of the first plating being comprised of a first bonding force improving portion contacting one upper edge of the encapsulation portion, and a second plating layer disposed on the other end surface of the encapsulation portion and a lower surface of the second external electrode to electrically connect the second external electrode and an exposed portion of a tantalum wire, an upper end of the second plating layer being comprised of a second bonding force improving portion contacting the other upper edge of the encapsulation portion.

Abstract: A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing metal powder; and a conductive polymer layer disposed above the sintered body. A ratio (t2/t1) of a thickness (t2) of the conductive polymer layer in an edge portion of the sintered body to a thickness (t1) of the conductive polymer layer in a central portion of the sintered body satisfies 0.35?t2/t1?0.9.

Abstract: A tantalum capacitor includes a tantalum body, an encapsulation portion, first and second external electrodes spaced apart from each other on a lower surface of the encapsulation portion, a first plating layer disposed on one end surface of the encapsulation portion and a lower surface of the first external electrode to electrically connect the first external electrode and the tantalum body, an upper end of the first plating being comprised of a first bonding force improving portion contacting one upper edge of the encapsulation portion, and a second plating layer disposed on the other end surface of the encapsulation portion and a lower surface of the second external electrode to electrically connect the second external electrode and an exposed portion of a tantalum wire, an upper end of the second plating layer being comprised of a second bonding force improving portion contacting the other upper edge of the encapsulation portion.

Abstract: There is provided a tantalum capacitor including: a tantalum capacitor body; a plurality of tantalum wires and an adhesive layer on a lower surface of the tantalum capacitor body; and a molding part enclosing the tantalum capacitor body, wherein the tantalum wire and the adhesive layer are connected to an anode lead frame and a cathode lead frame, respectively.

Abstract: A composite electronic component includes a composite body formed by combining a multilayer ceramic capacitor (MLCC) and a tantalum capacitor. The composite electronic component has an excellent acoustic noise reduction effect, low equivalent series resistance (ESR)/equivalent series inductance (ESL), enhanced DC-bias characteristics, and a reduced chip thickness.

Abstract: A composite electronic component includes a composite body having a multilayer ceramic capacitor and a tantalum capacitor coupled to each other, so as to have an excellent acoustic noise reduction effect, a low equivalent series resistance (ESR)/equivalent series inductance (ESL), improved direct current (DC)-bias characteristics, and a low chip thickness.

Abstract: A composite electronic component includes: a tantalum capacitor, a multilayer ceramic capacitor, a sealing part, an anode lead frame, and a cathode lead frame, wherein the anode lead frame includes a step portion that does not contact a first external electrode of the multilayer ceramic capacitor, and the cathode lead frame includes a step portion that does not contact a second external electrode of the multilayer ceramic capacitor.

Abstract: A tantalum capacitor includes a capacitor body containing a tantalum powder and having a tantalum wire protruding to one side surface thereof, a molding part enclosing the tantalum wire and the capacitor body so as to allow an end portion of the tantalum wire to be exposed through one side surface thereof, a positive electrode terminal extended from one side surface of the molding part to a portion of a lower surface thereof and connected to the end portion of the tantalum wire, and a negative electrode terminal extended from the other side surface of the molding part to a portion of the lower surface thereof and connected to the other side surface of the capacitor body.

Abstract: A tantalum capacitor may include two tantalum wires exposed through two surfaces of a capacitor body opposing each other, first and second positive electrode terminals, connected to the tantalum wires, respectively, and disposed on two surfaces of a molded part opposing each other, and a negative electrode terminal disposed between the first and second positive electrode terminals. The negative electrode terminal may be electrically connected to the capacitor body by a via electrode or a pad electrode disposed between the negative electrode terminal and the capacitor body.

Abstract: A multilayer ceramic electronic component includes: a board including first and second contact terminals disposed on one surface thereof to be spaced apart from each other and first and second external terminals disposed on the other surface thereof to be spaced apart from each other; a multilayer ceramic capacitor including first and second external electrodes including first and second connection portions disposed on opposite end surfaces of a ceramic body and first and second band portions extending from the first and second connection portions to portions of one surface of the ceramic body and connected to the first and second contact terminals, respectively; a sealing part enclosing the multilayer ceramic capacitor on the board while exposing one ends of the first and second contact terminals; and first and second connection terminals connecting the ends of the first and second contact terminals to the first and second external terminals, respectively.

Abstract: A tantalum capacitor includes tantalum elements having protruding anode lead wires, a sealing part enclosing the tantalum elements, an insulating member disposed below the sealing part, an anode terminal electrically connected to the anode lead wires, and a cathode terminal electrically connected to the tantalum elements. At least two tantalum elements are connected in parallel, and the cathode terminal includes a cathode terminal part disposed on a lower surface of the insulating member through a plurality of vias penetrating through the insulating member.

Abstract: A multilayer ceramic electronic component includes: a board including first and second contact terminals disposed on one surface thereof to be spaced apart from each other and first and second external terminals disposed on the other surface thereof to be spaced apart from each other; a multilayer ceramic capacitor including first and second external electrodes including first and second connection portions disposed on opposite end surfaces of a ceramic body and first and second band portions extending from the first and second connection portions to portions of one surface of the ceramic body and connected to the first and second contact terminals, respectively; a sealing part enclosing the multilayer ceramic capacitor on the board while exposing one ends of the first and second contact terminals; and first and second connection terminals connecting the ends of the first and second contact terminals to the first and second external terminals, respectively.

Abstract: A composite electronic component includes: a tantalum capacitor, a multilayer ceramic capacitor, a sealing part, an anode lead frame, and a cathode lead frame, wherein the anode lead frame includes a step portion that does not contact a first external electrode of the multilayer ceramic capacitor, and the cathode lead frame includes a step portion that does not contact a second external electrode of the multilayer ceramic capacitor.

Abstract: A tantalum capacitor includes a capacitor body containing tantalum powder and having a tantalum wire extending downwardly; a molded part enclosing the capacitor body and exposing an end portion of the tantalum wire; a positive electrode lead frame disposed on a lower surface of the molded part and connected to the end portion of the tantalum wire; a negative electrode lead frame disposed on the lower surface of the molded part; and a conductive adhesive layer disposed between the capacitor body and the negative electrode lead frame.