Patents by Inventor Hyun Sub Shin

Hyun Sub Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8659131
    Abstract: The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: February 25, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Ji Yun Kim, Hyun Sub Shin, Sung Won Lee, Hyung Eui Lee, Yeong Uk Seo, Sung Wuk Ryu, Hyuk Soo Lee
  • Publication number: 20110227208
    Abstract: The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.
    Type: Application
    Filed: September 25, 2009
    Publication date: September 22, 2011
    Inventors: Ji Yun Kim, Hyun Sub Shin, Sung Won Lee, Hyung Eui Lee, Yeong Uk Seo, Sung Wuk Ryu, Hyuk Soo Lee