Abstract: The present invention provides a polyamic acid aqueous solution composition capable of polymerizing polyamic acid in water rather than in an organic solvent, as well as achieving a high imidization rate during low-temperature curing.

Abstract: A reel-to-reel circuit board manufacturing apparatus according to an embodiment of the present disclosure includes: a material which is moved while being wound and unwound by an uncoiler and a recoiler, and a clamp that is arranged so that a width direction of the material matches a lengthwise direction thereof, and is configured to fix the material, wherein the clamp includes a first clamp and a second clamp formed on opposite ends thereof, and a first-and-second clamp linkage formed between the first and second clamps.

Abstract: A pharmaceutical composition comprising udenafil is disclosed.

Abstract: A leakage detection system includes a sensing unit that contacts a leakage liquid, a resistance measuring unit configured to measure an electrical resistance of the sensing unit by applying a direct current to the sensing unit, and a determination unit configured to determine whether the leakage liquid is a dangerous solution or a safe solution based on a first graph showing a change over time of the electrical resistance measured by the resistance measuring unit, wherein the dangerous solution is an acidic solution or an alkaline solution and the safety solution is water.

Abstract: Provided is an electric wire structure including a copper (Cu) electric wire extending in a direction; and a graphene coating layer formed on an outer portion of the Cu electric wire to surround the Cu electric wire, wherein the Cu electric wire includes Cu having a purity of 99.9% or greater.

Abstract: A leakage detection system includes a sensing unit that contacts a leakage liquid, a resistance measuring unit configured to measure an electrical resistance of the sensing unit by applying a direct current to the sensing unit, and a determination unit configured to determine whether the leakage liquid is a dangerous solution or a safe solution based on a first graph showing a change over time of the electrical resistance measured by the resistance measuring unit, wherein the dangerous solution is an acidic solution or an alkaline solution and the safety solution is water.

Abstract: Provided is an electric wire structure including a copper (Cu) electric wire extending in a direction; and a graphene coating layer formed on an outer portion of the Cu electric wire to surround the Cu electric wire, wherein the Cu electric wire includes Cu having a purity of 99.9% or greater.

Abstract: A photoresist composition and method of forming a pattern using the same are provided. The photoresist composition includes a 60 to 90 wt % novolac resin, a diazide compound, an organic solvent, and an anticorrosive agent.

Abstract: Provided are a semiconductor memory device having a post package repair control circuit and a post package repair method. In the semiconductor memory device and the post package repair method, in a post package repair mode, a second memory bank is used as a fail bit map memory for storing failed bit information regarding a first memory bank, and the first memory bank is used as a fail bit map memory for storing failed bit information regarding the second memory bank.

Abstract: Provided are a semiconductor memory device having a post package repair control circuit and a post package repair method. In the semiconductor memory device and the post package repair method, in a post package repair mode, a second memory bank is used as a fail bit map memory for storing failed bit information regarding a first memory bank, and the first memory bank is used as a fail bit map memory for storing failed bit information regarding the second memory bank.