Abstract: A method of controlling a reference cell in a resistive memory to identify values stored in a plurality of memory cells is provided. The method includes writing a first value to the plurality of memory cells, providing, to the reference cell, monotonically increasing or monotonically decreasing reference currents. The method includes reading the plurality of memory cells as each of the reference currents is provided to the reference cell, and determining a read reference current based on an aggregation of results of the reading.

Abstract: A resistive memory device includes: a voltage generator generating a write word line voltage according to activation of a write enable signal; a switch circuit outputting one of the write word line voltage and a read word line voltage in response to the write enable signal as an output voltage; a word line power path connected to the switch circuit to receive the output voltage; and a word line driver driving a word line according to a voltage applied to the word line power path, wherein a write command starts to be received after a certain delay following the activation of the write enable signal, and a write operation is performed within an activation period of the write enable signal in response to the received write command.

Abstract: A one-time programmable (OTP) memory device includes an OTP cell array, a latch controller, a column selection circuit, and a latch circuit. The OTP cell array includes a plurality of OTP memory cells respectively connected to a plurality of bitlines. The latch controller generates a latch address signal indicating an address that is changed sequentially in an enable mode to initialize the OTP memory device. The column selection circuit electrically connects a plurality of bitline groups of the bitlines to a plurality of input-output lines sequentially based on the latch address signal in the enable mode. The latch circuit receives and stores fuse bits provided sequentially through the bitline groups and the input-output lines in the enable mode.

Abstract: A one time programmable (OTP) memory includes an OTP cell array including a plurality of OTP cells provided at locations where a plurality of word lines and a plurality of bit lines cross each other, and a write circuit configured to sequentially program the OTP cells by selecting the bit lines one at a time and program a selected OTP cell connected to the selected bit line, wherein the write circuit is further configured to detect a voltage level of the selected bit line and select another bit line when the detected voltage level indicates that the selected OTP cell is in a programmed state.

Abstract: A one-time programmable (OTP) memory device includes an OTP cell array, a latch controller, a column selection circuit, and a latch circuit. The OTP cell array includes a plurality of OTP memory cells respectively connected to a plurality of bitlines. The latch controller generates a latch address signal indicating an address that is changed sequentially in an enable mode to initialize the OTP memory device. The column selection circuit electrically connects a plurality of bitline groups of the bitlines to a plurality of input-output lines sequentially based on the latch address signal in the enable mode. The latch circuit receives and stores fuse bits provided sequentially through the bitline groups and the input-output lines in the enable mode.

Abstract: A one time programmable (OTP) memory includes an OTP cell array including a plurality of OTP cells provided at locations where a plurality of word lines and a plurality of bit lines cross each other, and a write circuit configured to sequentially program the OTP cells by selecting the bit lines one at a time and program a selected OTP cell connected to the selected bit line, wherein the write circuit is further configured to detect a voltage level of the selected bit line and select another bit line when the detected voltage level indicates that the selected OTP cell is in a programmed state.

Abstract: A semiconductor device and a method of operating the same, the semiconductor device including a sense amplifier connected between a bit line and a complementary bit line; a first power supply circuit configured to select between supplying a power supply voltage to the first node and blocking the power supply voltage from the first node in response to a first control signal; a second power supply circuit configured to select between supplying a ground voltage to the second node and blocking the ground voltage from the second node in response to a second control signal; and a first boosting circuit configured to boost a voltage at the first node in response to a third control signal.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of word lines, a plurality of bit lines including complementary pairs of bit lines, and a plurality of memory cells storing data; a sense amplifier coupled to the memory cell array and configured to sense voltage differences between the complementary pairs of bit lines and amplify the voltage differences; and at least one voltage driver configured to provide either a predetermined voltage or a first power supply voltage to the memory cell array to increase a sensing margin of the semiconductor memory device. The semiconductor memory device increases respective potential differences between complementary pairs of bit lines using a voltage isolated in the memory cell array.

Abstract: A semiconductor device and a method of operating the same, the semiconductor device including a sense amplifier connected between a bit line and a complementary bit line; a first power supply circuit configured to select between supplying a power supply voltage to the first node and blocking the power supply voltage from the first node in response to a first control signal; a second power supply circuit configured to select between supplying a ground voltage to the second node and blocking the ground voltage from the second node in response to a second control signal; and a first boosting circuit configured to boost a voltage at the first node in response to a third control signal.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of word lines, a plurality of bit lines including complementary pairs of bit lines, and a plurality of memory cells storing data; a sense amplifier coupled to the memory cell array and configured to sense voltage differences between the complementary pairs of bit lines and amplify the voltage differences; and at least one voltage driver configured to provide either a predetermined voltage or a first power supply voltage to the memory cell array to increase a sensing margin of the semiconductor memory device. The semiconductor memory device increases respective potential differences between complementary pairs of bit lines using a voltage isolated in the memory cell array.

Abstract: A semiconductor memory device includes a refresh control circuit and a memory cell array. The refresh control circuit generates an internal auto refresh control signal based on a chip select signal and an external self refresh control signal. The memory cell array is refreshed in response to the internal auto refresh control signal. Because the semiconductor memory device internally generates the internal auto refresh control signal performing auto refresh operations, the semiconductor memory device may not be required to transmit to external devices for performing the auto refresh operations, and thus pins or pads for transmitting signals may be reduced and operation time may become faster.

Abstract: A semiconductor memory device includes a refresh control circuit and a memory cell array. The refresh control circuit generates an internal auto refresh control signal based on a chip select signal and an external self refresh control signal. The memory cell array is refreshed in response to the internal auto refresh control signal. Because the semiconductor memory device internally generates the internal auto refresh control signal performing auto refresh operations, the semiconductor memory device may not be required to transmit to external devices for performing the auto refresh operations, and thus pins or pads for transmitting signals may be reduced and operation time may become faster.

Abstract: The present invention provides a memory device which comprises a memory cell array having a plurality of memory blocks; a memory controller for controlling a refresh operation with respect to the memory blocks; a refresh check bit circuit for storing refresh check bits corresponding to the memory blocks, respectively; a block select control circuit for setting refresh check bits of memory blocks to be refreshed to a checked state according to a first control of the memory controller; a using check bit circuit for storing using check bits corresponding to the memory blocks, respectively; a using check control circuit for setting refresh check bits of memory blocks to which access is requested to a checked state according to a second control of the memory controller; and a partial refresh control circuit for controlling the refresh operation such that memory blocks corresponding to checked using check bits or checked refresh check bits are refreshed according to a third control of the memory controller.

Abstract: A precharge circuit of a semiconductor memory device may include a precharge controller, a first precharge unit and a second precharge unit. The precharge controller may enable a first control signal in a precharge mode for a first operation, and may enable a second control signal in a precharge mode for a second operation. The first precharge unit may precharge a pair of I/O lines to a first voltage in response to the first control signal in the precharge mode for the first operation. The second precharge unit may precharge the pair of I/O lines to a second voltage lower than the first voltage in response to the second control signal in the precharge mode for the second operation.

Abstract: The present invention provides a memory device which comprises a memory cell array having a plurality of memory blocks; a memory controller for controlling a refresh operation with respect to the memory blocks; a refresh check bit storing part for storing refresh check bits corresponding to the memory blocks, respectively; a block select control part for setting refresh check bits of memory blocks to be refreshed to a check state according to a control of the memory controller; a using check bit storing part for storing using check bits corresponding to the memory blocks, respectively; a using check control part for setting refresh check bits of memory blocks access-requested to a check state according to a control of the memory controller; and a partial refresh control part for controlling such that memory blocks corresponding to checked using check bits or refresh check bits according to a control of the memory controller.

Abstract: A delay control circuit capable of controlling a delay time is disclosed. The delay control circuit includes a delay detecting circuit, a first pulse generator, a counter control circuit and a counter. The delay detecting circuit delays an input signal by a first time in response to an output signal and compares the input signal and the delayed input signal to generate a first signal. The first pulse generator generates a second signal in response to the input signal. The counter control circuit generates a count-up signal and a count-down signal in response to the first signal and the second signal. The counter generates the output signal in response to the count-up signal and the count-down signal to divide the first time by 2n intervals, wherein n is a positive integer.

Abstract: An integrated circuit memory device includes a plurality of memories and a refresh controller within a memory system. The refresh controller is configured to generate a refresh request signal. The plurality of memories includes a plurality of banks of memory responsive to the refresh request signal. An additional memory includes a buffer unit configured to generate a refresh indication signal to a first one of the plurality of banks of memory and to receive buffer write data addressed to the first one of the plurality of banks of memory in response to receiving a refresh-access interrupt signal from the one of the plurality of banks of memory. The plurality of banks of memory and the buffer unit may be separate DRAM chips.

Abstract: The present invention provides a memory and memory control system wherein, except for one case noted below, the main memory gives priority to read or write operations over refresh operations. On the other hand, the cache memory give priority to the refresh operations over read or write operations. The exceptional case is when a memory read signal is received when the cache refresh is enabled and the data in the cache memory is valid. In this exceptional case, the refresh of the cache memory is delayed. During certain read operations the data in the particular memory block is also written to the cache and no write back from the cache is performed. This reduces the number of write back operations and it eliminates a delay due to the refresh operation.

Abstract: A precharge circuit of a semiconductor memory device may include a precharge controller, a first precharge unit and a second precharge unit. The precharge controller may enable a first control signal in a precharge mode for a first operation, and may enable a second control signal in a precharge mode for a second operation. The first precharge unit may precharge a pair of I/O lines to a first voltage in response to the first control signal in the precharge mode for the first operation. The second precharge unit may precharge the pair of I/O lines to a second voltage lower than the first voltage in response to the second control signal in the precharge mode for the second operation.

Abstract: An arrangement for reducing delay in an operating time of a memory device caused during a DRAM hidden refresh operation, includes a memory bank having memory cells, first and second data buses connected to the memory bank, a cache memory connected to the second data bus, and a latch connected to the second data bus. In response to a memory write command, the second data bus transmits data read from the cache memory to the latch in an ith period of time (i is a natural number), and the data read from the latch to the memory bank in an (i+1)th period of time. In response to a cache write command, the second data bus transmits data read from the memory bank to the latch in an ith period of time, and the data read from the latch to the cache memory in an (i+1)th period of time.