Patents by Inventor Hyun Tak KO

Hyun Tak KO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240083384
    Abstract: A vehicle seat reinforcement device includes a leg portion mounted on a floor panel, a seat cushion frame slidably mounted on the leg portion, and a load reinforcing structure connected between the leg portion and the seat cushion frame, wherein when a seat belt anchorage load is transferred to the seat cushion frame, the seat cushion frame is locked to the leg portion by the load reinforcing structure.
    Type: Application
    Filed: February 3, 2023
    Publication date: March 14, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, Daechang Seat Co.,LTD-Dongtan, Hyundai Transys Inc.
    Inventors: Sang Soo LEE, Chan Ho JUNG, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Deok Soo LIM, Sang Do PARK, In Sun BAEK, Sin Chan YANG, Chan Ki CHO, Myung Soo LEE, Jae Yong JANG, Jun Sik HWANG, Ho Sung KANG, Hae Dong KWAK, Hyun Tak KO
  • Publication number: 20240034200
    Abstract: Disclosed is a seat adjustment apparatus for a mobility vehicle, in which a seat cushion slides in a forward/rearward direction while moving upward or downward when the seat cushion is tilted, thereby allowing an occupant to take a stable posture. In one aspect, the seat apparatus comprises 1) a fixing bracket fixed to a floor surface; 2) a setting bracket disposed above the fixing bracket and connected to a back frame so that the back frame is rotatable; 3) a guide unit disposed at a front end of the fixing bracket and a front end of the setting bracket; 4) a guide part disposed at a rear end of the fixing bracket and a rear end of the setting bracket; and 5) a drive unit connected to the guide unit.
    Type: Application
    Filed: January 24, 2023
    Publication date: February 1, 2024
    Inventors: Sang Soo Lee, Chan Ho Jung, Mu Young Kim, Sang Hark Lee, Ho Suk Jung, Deok Soo Lim, Sang Do Park, Jae Yong Jang, Hyun Tak Ko, Ho Sung Kang, Hae Dong Kwak, In Sun Baek, Sin Chan Yang, Jun Sik Hwang, Chan Ki Cho, Myung Soo Lee
  • Publication number: 20210358726
    Abstract: The present disclosure provides an electrostatic chuck, in which a heat transfer layer using a heat transfer fluid is disposed between a chuck main body disposed at an upper side of the electrostatic chuck and a chuck base disposed at a lower side of the electrostatic chuck, and the chuck main body is simply placed on the chuck base so as to be physically in contact with the heat transfer layer, such that heat may be stably transferred without damage even in a condition in which the heat transfer layer is at a high temperature, and the chuck main body may be easily separated from the chuck base for maintenance.
    Type: Application
    Filed: May 12, 2021
    Publication date: November 18, 2021
    Applicant: SEMES CO., LTD.
    Inventors: Hyun Tak KO, Sang Kee LEE