Patents by Inventor Hyun Young Jeong

Hyun Young Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240109987
    Abstract: The present disclosure relates to a polyethylene resin composition capable of improving transparency and moisture barrier properties without deterioration in physical properties of a film, and a film including the same, wherein the polyethylene resin composition comprises a nucleating agent and a lubricant both containing a cation of a same metal selected from Group 2 or Group 12 metals.
    Type: Application
    Filed: August 31, 2022
    Publication date: April 4, 2024
    Applicants: LG Chem, Ltd., LG Chem, Ltd.
    Inventors: Hyun Mook Jeong, Dodam Kim, Yi Young Choi, Hee Su Oh
  • Patent number: 10418227
    Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus is a powder plasma processing apparatus of a circular surface discharge plasma module, and the apparatus includes a plate-like electrode layer serving as an external surface of the circular surface discharge plasma module, an insulating layer disposed on an internal surface of the plate-like electrode layer, and a plasma generating electrode disposed on the insulating layer, wherein the circular surface discharge plasma module rotates, an alternating voltage is applied to the plasma generating electrode and the plate-like electrode layer to generate plasma around the plasma generating electrode, and a powder for plasma processing is processed by the plasma within the circular surface discharge plasma module.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: September 17, 2019
    Assignee: KOREA BASIC SCIENCE INSTITUTE
    Inventors: Dong Chan Seok, Yong Ho Jung, Hyun Young Jeong
  • Patent number: 10056234
    Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus includes: a chamber configured to perform plasma processing on a powder; a powder supply unit disposed in an upper portion of the chamber; and a plurality of plate-like surface discharge plasma modules disposed below the powder supply unit and positioned within the chamber, wherein surfaces of the surface discharge plasma modules are spaced apart from each other. According to the powder plasma processing apparatus, the powder can be uniformly processed, and the time that the powder spends in contact with the plasma can be controlled, thereby allowing efficient powder processing to be performed.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: August 21, 2018
    Assignee: KOREA BASIC SCIENCE INSTITUTE
    Inventors: Dong Chan Seok, Yong Ho Jung, Hyun Young Jeong
  • Publication number: 20180090302
    Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus includes: a chamber configured to perform plasma processing on a powder; a powder supply unit disposed in an upper portion of the chamber; and a plurality of plate-like surface discharge plasma modules disposed below the powder supply unit and positioned within the chamber, wherein surfaces of the surface discharge plasma modules are spaced apart from each other. According to the powder plasma processing apparatus, the powder can be uniformly processed, and the time that the powder spends in contact with the plasma can be controlled, thereby allowing efficient powder processing to be performed.
    Type: Application
    Filed: November 30, 2017
    Publication date: March 29, 2018
    Inventors: Dong Chan SEOK, Yong Ho JUNG, Hyun Young JEONG
  • Publication number: 20180019105
    Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus is a powder plasma processing apparatus of a circular surface discharge plasma module, and the apparatus includes a plate-like electrode layer serving as an external surface of the circular surface discharge plasma module, an insulating layer disposed on an internal surface of the plate-like electrode layer, and a plasma generating electrode disposed on the insulating layer, wherein the circular surface discharge plasma module rotates, an alternating voltage is applied to the plasma generating electrode and the plate-like electrode layer to generate plasma around the plasma generating electrode, and a powder for plasma processing is processed by the plasma within the circular surface discharge plasma module.
    Type: Application
    Filed: September 28, 2017
    Publication date: January 18, 2018
    Inventors: Dong Chan SEOK, Yong Ho JUNG, Hyun Young JEONG
  • Publication number: 20150348760
    Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus is a powder plasma processing apparatus of a circular surface discharge plasma module, and the apparatus includes a plate-like electrode layer serving as an external surface of the circular surface discharge plasma module, an insulating layer disposed on an internal surface of the plate-like electrode layer, and a plasma generating electrode disposed on the insulating layer, wherein the circular surface discharge plasma module rotates, an alternating voltage is applied to the plasma generating electrode and the plate-like electrode layer to generate plasma around the plasma generating electrode, and a powder for plasma processing is processed by the plasma within the circular surface discharge plasma module.
    Type: Application
    Filed: December 6, 2013
    Publication date: December 3, 2015
    Inventors: Dong Chan SEOK, Yong Ho JUNG, Hyun Young JEONG
  • Publication number: 20150187543
    Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus includes: a chamber configured to perform plasma processing on a powder; a powder supply unit disposed in an upper portion of the chamber; and a plurality of plate-like surface discharge plasma modules disposed below the powder supply unit and positioned within the chamber, wherein surfaces of the surface discharge plasma modules are spaced apart from each other. According to the powder plasma processing apparatus, the powder can be uniformly processed, and the time that the powder spends in contact with the plasma can be controlled, thereby allowing efficient powder processing to be performed.
    Type: Application
    Filed: December 6, 2013
    Publication date: July 2, 2015
    Inventors: Dong Chan Seok, Yong Ho Jung, Hyun Young Jeong