Patents by Inventor Hyun-Young ROH

Hyun-Young ROH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20210329107
    Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.
    Type: Application
    Filed: June 29, 2021
    Publication date: October 21, 2021
    Inventors: Seong-Hyeon KIM, Hyo-Sung KANG, Min-Yong KIM, Hyun-Young ROH, Jung-Bae PARK, Tae-Young BAE, Hyo-Won SEO, Hae-Won SUNG, Gyung-Hoon LEE, Bit-Na KIM, Byung-Joon LEE
  • Electronic device with resin integrated housing
    Patent number: 11082545
    Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: August 3, 2021
    Inventors: Seong-Hyeon Kim, Hyo-Sung Kang, Min-Yong Kim, Hyun-Young Roh, Jung-Bae Park, Tae-Young Bae, Hyo-Won Seo, Hae-Won Sung, Gyung-Hoon Lee, Bit-Na Kim, Byung-Joon Lee
  • ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20200412851
    Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.
    Type: Application
    Filed: September 14, 2020
    Publication date: December 31, 2020
    Inventors: Seong-Hyeon Kim, Hyo-Sung Kang, Min-Yong Kim, Hyun-Young Roh, Jung-Bae Park, Tae-Young Bae, Hyo-Won Seo, Hae-Won Sung, Gyung-Hoon Lee, Bit-Na Kim, Byung-Joon Lee
  • Electronic device and manufacturing method thereof
    Patent number: 10778819
    Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: September 15, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Seong-Hyeon Kim, Hyo-Sung Kang, Min-Yong Kim, Hyun-Young Roh, Jung-Bae Park, Tae-Young Bae, Hyo-Won Seo, Hae-Won Sung, Gyung-Hoon Lee, Bit-Na Kim, Byung-Joon Lee
  • ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20180343332
    Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.
    Type: Application
    Filed: August 7, 2018
    Publication date: November 29, 2018
    Inventors: Seong-Hyeon KIM, Hyo-Sung KANG, Min-Yong KIM, Hyun-Young ROH, Jung-Bae PARK, Tae-Young BAE, Hyo-Won SEO, Hae-Won SUNG, Gyung-Hoon LEE, Bit-Na KIM, Byung-Joon LEE