Patents by Inventor Hyun Yu

Hyun Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10593848
    Abstract: A light-emitting element package according to one embodiment includes first and second lead frames electrically separated from each other; a package body including a slope configured to define a cavity along with at least one of the first or second lead frame; and at least one element unit disposed in an element area of at least one of the first or second lead frame, the element unit including a light-emitting element and a protective element, wherein the package body is disposed between the protective element and the light-emitting element.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: March 17, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Dong Hyun Yu, Bong Kul Min
  • Patent number: 10540068
    Abstract: A method of operating an electronic device is provided. The method includes selecting at least one particular location in content displayed on a display, identifying text included in the at least one particular location, and executing at least one program based on the text.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: January 21, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Chul Choi, Soo-Jin Park, Hyung-Jin Park, Na-Gyeom Yoo, Bo-Hyun Yu, Jae-Woong Chun, Hyo-Sun Choi, Soo-Ji Hwang
  • Publication number: 20190375667
    Abstract: A glass forming apparatus may include a forming body positioned within an enclosure having a top panel and a pair of side panels. The forming body includes an inlet end and a trough defined by a pair of spaced apart weirs extending with an incline from the inlet end. The top panel is positioned above and extends substantially parallel to and across top surfaces of the pair of spaced apart weirs. The apparatus may also include a support plate positioned above and extending substantially parallel to and across the top panel of the enclosure and the weirs. An array of thermal elements of uniform size are suspended from the support plate and positioned above the trough of the forming body. The array of thermal elements may have bottom portions that are positioned equidistant from the top panel of the enclosure along the length of the forming body.
    Type: Application
    Filed: November 21, 2017
    Publication date: December 12, 2019
    Inventors: Olus Naili Boratav, Robert Delia, Bulent Kocatulum, Michael Yoshiya Nishimoto, Gaozhu Peng, Jae Hyun Yu
  • Publication number: 20190371332
    Abstract: A speech recognition apparatus and an operating method thereof which execute a mounted artificial intelligence (AI) algorithm and/or machine learning algorithm to perform speech recognition and communicate with different electronic apparatuses and external servers in a 5G communication environment are disclosed.
    Type: Application
    Filed: August 15, 2019
    Publication date: December 5, 2019
    Applicant: LG ELECTRONICS INC.
    Inventors: Hyun Yu, Byeong Ha Kim
  • Publication number: 20190328090
    Abstract: Provided is a gel nail sticker including: a lower laminated part which is a part directly attached to a nail or a toenail, and has a color or a pattern, and is formed of a flexible material to correspond to a curved surface of the nail or the toenail; and an upper laminated part which is a transparent coated layer positioned on the lower laminated part and providing glossiness to a color or a pattern of the lower laminated part, and is in a flexible semi-solid state to correspond to the curved surface of the nail or the toenail before being attached to the nail or the toenail, and is cured to a solid state while maintaining a form attached to the nail or the toenail when an ultraviolet ray is irradiated to the upper laminated part after the upper laminated part is attached to the nail or the toenail.
    Type: Application
    Filed: June 21, 2019
    Publication date: October 31, 2019
    Applicant: GLLUGA INC.
    Inventors: Gi Hyun YU, Tae Gyu YOO, Jae Bak AHN
  • Patent number: 10461233
    Abstract: A light emitting device package of an embodiment including a first lead frame; a light emitting device mounted on the first lead frame; a second lead frame spaced apart from the first lead frame in a first direction; a protective device mounted on the second lead frame; and a body coupled to the first and second lead frames, wherein the first lead frame includes a first stepped portion disposed along an edge of a lower surface thereof, and the second lead frame includes a third stepped portion disposed along an edge of a lower surface thereof, a mounting region of the protective device which is not overlapped in a vertical direction and spaced apart from the third stepped portion, and a second wire recess portion which is partially overlapped with the third stepped portion in the vertical direction.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: October 29, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Dong Hyun Yu, Kyung Ho Kang, Nae Sang Yun, Meen Soo Choe
  • Patent number: 10424704
    Abstract: A light-emitting device package according to an embodiment includes first and second lead frames, a package body exposing a portion of a front surface of at least one of the first or second lead frame, a light-emitting device, a protecting device, and at least one wire configured to electrically connect the exposed front surface of at least one of the first or second lead frame to at least one of the light-emitting device or the protecting device, wherein the exposed front surface of at least one of the first or second lead frame includes at least one bonding area connected to the at least one wire, wherein the at least one bonding area has a planar shape in which the at least one bonding area is disposed so as to contact a corner of the exposed front surface of at least one of the first or second lead frame.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: September 24, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Dong Hyun Yu, Bong Kul Min
  • Publication number: 20190284648
    Abstract: The present invention relates to a method for effectively recovering a sugar solution containing glucose and saccharogenic residues after saccharification using an acid or a saccharification enzyme of a wood-based or algae biomass, and a device for implementing the method. More specifically, the present invention relates to a method capable of recovering a sugar solution using minimal equipment and water after aggregating fine particles by adding a protein suspension to a suspension of glucose and saccharogenic residues which are produced by saccharifying cellulose by adding an acid or saccharification enzyme to the biomass, while capable of minimizing an amount of saccharide lost in the residues, and a device for implementing the method.
    Type: Application
    Filed: July 24, 2017
    Publication date: September 19, 2019
    Inventors: Ju-Hyun YU, In-Yong EOM, Kyung-Sik HONG
  • Publication number: 20190259929
    Abstract: A light-emitting device package includes a first lead frame; a second lead frame separated from the first lead frame in a first direction; a package body having a cavity exposing a portion of the second lead frame. Further, the cavity includes an inclined inner surface inclining with respect to an upper surface of the second lead frame; a light-emitting diode disposed on the exposed portion of the second lead frame; a hole in the inclined inner surface of the cavity and exposing a portion of the first lead frame; a protection device disposed in the hole and on the exposed portion of the first lead frame; a first wire having a first end connected to the light-emitting diode, and a second end connected to the first lead frame; a second wire having a first end connected to the light-emitting diode, and a second end connected to the second lead frame; and a third wire having a first end connected to the protection device, and a second end connected to the exposed portion of the second lead frame.
    Type: Application
    Filed: March 15, 2019
    Publication date: August 22, 2019
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Dong Hyun YU, Bong Kul MIN
  • Patent number: 10376024
    Abstract: Provided is a gel nail sticker including: a lower laminated part which is a part directly attached to a nail or a toenail, and has a color or a pattern, and is formed of a flexible material to correspond to a curved surface of the nail or the toenail; and an upper laminated part which is a transparent coated layer positioned on the lower laminated part and providing glossiness to a color or a pattern of the lower laminated part, and is in a flexible semi-solid state to correspond to the curved surface of the nail or the toenail before being attached to the nail or the toenail, and is cured to a solid state while maintaining a form attached to the nail or the toenail when an ultraviolet ray is irradiated to the upper laminated part after the upper laminated part is attached to the nail or the toenail.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: August 13, 2019
    Assignee: GLLUGA Inc.
    Inventors: Gi Hyun Yu, Tae Gyu Yoo, Jae Bak Ahn
  • Patent number: 10329589
    Abstract: The present invention relates to a method for preparing bioethanol from lignocellulosic biomass. The method of the present invention is capable of: minimizing the impurity content of an enzymatic saccharification raw material, by extracting biomass using hot water, before pretreatment, and removing extractable substances such as inorganic salts; suppressing, to the greatest extent, the production of overdecomposition products of sugar, by pretreating the biomass, from which the hot water extractable substances have been removed, in a condition for maximizing xylan yield; preparing fermentable sugar at a low cost, without washing a pretreated solid obtained from subsequent solid-liquid separation, but by only concentrating a sugar solution obtained after enzymatic saccharification, using a separation film; and preparing bioethanol therefrom in high yield.
    Type: Grant
    Filed: June 9, 2014
    Date of Patent: June 25, 2019
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Ju Hyun Yu, Chan Duck Jung, In Yong Eom, Seung Hwan Lee, Kyung Sik Hong, In-Chul Kim, Jong Geon Jegal, Bong Keun Song
  • Publication number: 20190032094
    Abstract: The present invention relates to a method for preparing bioethanol from lignocellulosic biomass. The method of the present invention is capable of: minimizing the impurity content of an enzymatic saccharification raw material, by extracting biomass using hot water, before pretreatment, and removing extractable substances such as inorganic salts; suppressing, to the greatest extent, the production of overdecomposition products of sugar, by pretreating the biomass, from which the hot water extractable substances have been removed, in a condition for maximizing xylan yield; preparing fermentable sugar at a low cost, without washing a pretreated solid obtained from subsequent solid-liquid separation, but by only concentrating a sugar solution obtained after enzymatic saccharification, using a separation film; and preparing bioethanol therefrom in high yield.
    Type: Application
    Filed: October 3, 2018
    Publication date: January 31, 2019
    Inventors: Ju Hyun YU, Chan Duck JUNG, In Yong EOM, Seung Hwan LEE, Kyung Sik HONG, In Chul KIM, Jong Geon JEGAL, Bong Keun SONG
  • Publication number: 20190010588
    Abstract: Disclosed is an austenitic stainless steel with increased workability. The austenitic stainless steel includes, based on % by weight, silicon (Si): 0.1 to 0.65%, manganese (Mn): 0.2 to 3.0%, nickel (Ni): 6.5 to 10.0%, chromium (Cr): 16.5 to 20.0%, copper (Cu): 6.0% or less (excluding 0), the sum of carbon (C) and nitrogen (N): 0.08% or less (excluding 0), and the remainder being Fe and unavoidable impurities, wherein the austenitic stainless steel has a work hardening rate of 1500 MPa or less within a true strain range of 0.15 to 0.4. Therefore, when a sink bowl and the like are processed using the austenitic stainless steel, the true strain and work hardening rate of which are controlled, the occurrence of delayed fracture in a molded corner thereof, which has been subjected to a large amount of processing, can be prevented.
    Type: Application
    Filed: December 21, 2016
    Publication date: January 10, 2019
    Inventors: Hyung Gu KANG, Jeom Yong CHOI, Dong Chul CHAE, Jee Hyun YU, Gyu Jin JO
  • Publication number: 20180358523
    Abstract: Embodiments relate to a light emitting device package and a lighting device.
    Type: Application
    Filed: November 28, 2016
    Publication date: December 13, 2018
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Dong Hyun YU, Kyung Ho KANG, Nae Sang YUN, Meen Soo CHOE
  • Publication number: 20180327298
    Abstract: Apparatuses for making a laminated glass ribbon may include an upper forming body including an outer forming surface bounded by a pair of upper dams, and a lower forming body disposed downstream of the upper forming body and including an outer forming surface spaced from the outer forming surface of the upper forming body by an interior gap. An edge guide may be disposed along an interior upper dam wall and spaced apart in the interior gap from the lower forming body. Surfaces exterior to the outer forming surfaces of the upper and lower forming bodies may abut and be joined. A formed glass ribbon having a core glass layer and a pair of clad glass layers may include inner and outer portions that have substantially equal thickness ratios based on a glass core layer thickness compared to a combined glass cladding layer thickness in each portion.
    Type: Application
    Filed: November 17, 2016
    Publication date: November 15, 2018
    Inventors: Frank Coppola, Vladislav Yuryevich Golyatin, Monica Jo Mashewske, Jae Hyun Yu
  • Patent number: 10103303
    Abstract: A light emitting package includes a first lead frame; a second lead frame spaced apart from the first lead frame in a first direction; a body coupled to the first lead frame and the second lead frame; and a light emitting element on the first lead frame. The first lead frame includes first to fourth side parts, the first side part includes a first protrusion that protrudes outwards from one side surface of the body, and a first contact part disposed at the end of the first protrusion. The second lead frame includes fifth to eighth side parts, the fifth side part includes a second protrusion that protrudes outwards from a side surface of the body, which is symmetrical to the one side surface of the body, and a second contact part disposed at the end of the second protrusion. Each of the first contact part and the second contact part includes a second layer and first layer covers the second layer.
    Type: Grant
    Filed: November 25, 2016
    Date of Patent: October 16, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Dong Hyun Yu, Choong Youl Kim
  • Patent number: D839299
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: January 29, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hoyoung Lee, Nari Choi, Hoik Hwang, Daehong Ki, June-Seok Kim, Seock Hyun Yu, Soojin Jeong Lim, Junho Choi
  • Patent number: D839914
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: February 5, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hoyoung Lee, Nari Choi, Hoik Hwang, Daehong Ki, June-Seok Kim, Seock Hyun Yu, Soojin Jeong Lim, Junho Choi, Jinho Choi, Kyoung Soo Yoon, Jaehan Lee
  • Patent number: D857736
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: August 27, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hoyoung Lee, Nari Choi, Hoik Hwang, Daehong Ki, June-Seok Kim, Seock Hyun Yu, Soojin Jeong Lim, Junho Choi
  • Patent number: D865779
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: November 5, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hoyoung Lee, Seock Hyun Yu, Taewon Eom, Jiyeon Sung