Patents by Inventor Hyung Dae Kang

Hyung Dae Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of surface modification of polyimide film using ethyleneimines coupling agent, manufacturing method of flexible copper clad laminate and its product thereby
    Patent number: 8419918
    Abstract: A method of surface modifying a polyimide film, a method of manufacturing a flexible copper clad laminate using the same, and a flexible copper clad laminate (FCCL) having a two-layer structure manufactured thereby. The method of surface modifying a polyimide film is conducted by modifying the surface of a polyimide film through a first plasma treatment, dipping the polyimide film into a solution containing an ethyleneimine-based silane coupling agent prepared by mixing the compound of Formula 1 and the compound of Formula 2 at a molar ratio of with 0.25˜1, and then modifying the surface of the polyimide film through a second plasma treatment. The method of surface modifying a polyimide film is advantageous because it may be substituted for a conventional surface treatment processes using ion beams.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: April 16, 2013
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Young-Taik Hong, Hyung Dae Kang, Seog Je Kim, Jae Heung Lee
  • METHOD OF SURFACE MODIFICATION OF POLYIMIDE FILM USING ETHYLENEIMINES COUPLING AGENT, MANUFACTURING METHOD OF FLEXIBLE COPPER CLAD LAMINATE AND ITS PRODUCT THEREBY
    Publication number: 20090023010
    Abstract: A method of surface modifying a polyimide film, a method of manufacturing a flexible copper clad laminate using the same, and a flexible copper clad laminate (FCCL) having a two-layer structure manufactured thereby. The method of surface modifying a polyimide film is conducted by modifying the surface of a polyimide film through a first plasma treatment, dipping the polyimide film into a solution containing an ethyleneimine-based silane coupling agent prepared by mixing the compound of Formula 1 and the compound of Formula 2 at a molar ratio of with 0.25˜1, and then modifying the surface of the polyimide film through a second plasma treatment. The method of surface modifying a polyimide film is advantageous because it may be substituted for a conventional surface treatment processes using ion beams.
    Type: Application
    Filed: May 18, 2006
    Publication date: January 22, 2009
    Applicant: Korea Research Institute of Chemical Technology
    Inventors: Young-Taik Hong, Hyung Dae Kang, Seog Je Kim, Jae Heung Lee