Abstract: A power-generating apparatus according to an embodiment of the present invention comprises: a housing in which a fluid flows along the interior thereof and at least a portion of the wall surface thereof includes a flat surface formed of metal; a thermoelectric module disposed on the flat surface of the housing; and an insulating member disposed on the flat surface of the housing so as to be beside the thermoelectric module.

Abstract: A thermoelectric element according to one embodiment of the present disclosure includes a first substrate, a first resin layer disposed on the first substrate, a first electrode disposed on the first resin layer, a P-type thermoelectric leg and an N-type thermoelectric leg disposed on the first electrode, a second electrode disposed on the P-type thermoelectric leg and the N-type thermoelectric leg, a second resin layer disposed on the second electrode, and a second substrate disposed on the second resin layer, wherein at least one of the first electrode and the second electrode includes a copper layer, first plated layers disposed on both surfaces of the copper layer, and second plated layers disposed between both surfaces of the copper layer and the first plated layers, materials of the first plated layer and the second plated layer are different from each other, and the first plated layer has a melting point greater than or equal to 300° C.

Abstract: A thermoelectric device is disclosed. The thermoelectric device comprises: a body part comprising a hollow in which a semiconductor device is disposed; a plurality of connecting parts protruding on the lateral sides of the body part and comprising connecting holes; and a plurality of electrode parts connected to the semiconductor device and extending to the connecting holes of the connecting parts.

Abstract: A thermoelectric device is disclosed. The thermoelectric device comprises: a body part comprising a hollow in which a semiconductor device is disposed; a plurality of connecting parts protruding on the lateral sides of the body part and comprising connecting holes; and a plurality of electrode parts connected to the semiconductor device and extending to the connecting holes of the connecting parts.

Abstract: Provided are an elastomer composition including epoxy resin, acrylate resin, an organic filler, an inorganic filler, a cross linking agent, a hardener, an initiator and a solvent, and a magnetic ferrite for a wireless power transmitting and receiving device, the magnetic ferrite being coated with the elastomater composition having an elastic restoring force not to be damaged by a physical impact applied from the outside. According to embodiments of the present invention, the magnetic ferrite having improved impact resistance can be provided by being coating with the elastomer composition having the elastic restoring force, and thus an existing problem such as a reduction in magnetic property caused by damage to the ferrite resulting from an external impact can be solved.

Abstract: Provided are an antenna for a communication terminal, and a method of manufacturing the same, the antenna including: a communication terminal case; and a radiator layer formed of a metal material in an inner curved surface part of the communication terminal case.

Abstract: Provided is an electromagnetic booster for wireless charging, comprising a magnet part having a magnetic sheet (10) and a coil part (20) disposed on the magnetic sheet, wherein the magnetic sheet is composed of a first magnetic sheet (11) member located at an edge portion and a second magnetic sheet member (12) located in a center portion on the same plane, wherein the first magnetic sheet member and the second magnetic sheet member have different permeability rates from each other.

Abstract: A structure and a device may include an electromagnetic wave generator configured to generate electromagnetic waves; a shielding structure configured to surround at least a portion of the electromagnetic wave generator; and a metal layer provided on inner surfaces of upper and side portions of the shielding structure, wherein the metal layer having a predetermined surface roughness.

Abstract: Provided is an electromagnetic booster for wireless charging, comprising a magnet part having a magnetic sheet (10) and a coil part (20) disposed on the magnetic sheet, wherein the magnetic sheet is composed of a first magnetic sheet (11) member located at an edge portion and a second magnetic sheet member (12) located in a center portion on the same plane, wherein the first magnetic sheet member and the second magnetic sheet member have different permeability rates from each other.

Abstract: Since the magnetic film of the present invention has a much thinner thickness compared to a corresponding conventional magnetic layer and radiator coil material assembly and has no adhesive layer or air layer between the magnetic layer and the radiator, permeability required at the time of charging can be improved, a loss rate can be reduced and high charging efficiency can be obtained, Furthermore, since a band width and a gain rate can be improved, the magnetic film can be very usefully applied to wireless charging products which pursue slimming in design.

Abstract: Provided is a thermoelectric material including metal oxide powder and thermoelectric powder. Thus, an internal filling rate is improved so that a Peltier effect can be maximized according to the increase of electrical conductivity and a Seebeck coefficient and the reduction of thermal conductivity, thereby enabling the improvement of the figure of merit (ZT) of a thermoelectric element.

Abstract: A structure capable of efficiently shielding electromagnetic waves from an electronic component is provided. The structure for shielding electromagnetic waves may block electromagnetic interference (EMI) leakage and may efficiently shield various electronic devices from electromagnetic waves by forming a layer for shielding electromagnetic waves therein.

Abstract: Embodiments of the present invention relate to a thermoelectric module used for cooling, and provide a thermoelectric module comprising: substrates facing each other; and a first semiconductor element and a second semiconductor element arranged between the substrates and electrically connected to each other, wherein the first semiconductor element and the second semiconductor element have mutually different volumes. The present invention has a structure allowing the cooling effect to be raised by having, in a unit cell comprising thermoelectric semiconductor elements, any one from among the semiconductor elements facing each other to have a volume greater than the other to enhance the rise in electrical conductivity.

Abstract: Provided are an elastomer composition including epoxy resin, acrylate resin, an organic filler, an inorganic filler, a cross linking agent, a hardener, an initiator and a solvent, and a magnetic ferrite for a wireless power transmitting and receiving device, the magnetic ferrite being coated with the elastomater composition having an elastic restoring force not to be damaged by a physical impact applied from the outside. According to embodiments of the present invention, the magnetic ferrite having improved impact resistance can be provided by being coating with the elastomer composition having the elastic restoring force, and thus an existing problem such as a reduction in magnetic property caused by damage to the ferrite resulting from an external impact can be solved.

Abstract: Provided is an electromagnetic booster for wireless charging, comprising a magnet part having a magnetic sheet (10) and a coil part (20) disposed on the magnetic sheet, wherein the magnetic sheet is composed of a first magnetic sheet (11) member located at an edge portion and a second magnetic sheet member (12) located in a center portion on the same plane, wherein the first magnetic sheet member and the second magnetic sheet member have different permeability rates from each other.

Abstract: Provided is a thermoelectric material including metal oxide powder and thermoelectric powder. Thus, an internal filling rate is improved so that a Peltier effect can be maximized according to the increase of electrical conductivity and a Seebeck coefficient and the reduction of thermal conductivity, thereby enabling the improvement of the figure of merit (ZT) of a thermoelectric element.

Abstract: Provided are an antenna for a communication terminal, and a method of manufacturing the same, the antenna including: a communication terminal case; and a radiator layer formed of a metal material in an inner curved surface part of the communication terminal case.

Abstract: Since the magnetic sheet of the present invention has a much thinner thickness compared to a corresponding conventional magnetic layer and radiator coil material assembly and has no adhesive layer or air layer between the magnetic layer and the radiator, permeability required at the time of charging can be improved, a loss rate can be reduced and high charging efficiency can be obtained. Furthermore, since a band width and a gain rate can be improved, the magnetic sheet can be very usefully applied to wireless charging products which pursue slimming in design.

Abstract: Since the magnetic film of the present invention has a much thinner thickness compared to a corresponding conventional magnetic layer and radiator coil material assembly and has no adhesive layer or air layer between the magnetic layer and the radiator, permeability required at the time of charging can be improved, a loss rate can be reduced and high charging efficiency can be obtained, Furthermore, since a band width and a gain rate can be improved, the magnetic film can be very usefully applied to wireless charging products which pursue slimming in design.

Abstract: The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.