Patents by Inventor Hyung Geun JI

Hyung Geun JI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11532894
    Abstract: An antenna apparatus includes a patch antenna pattern; a feed via electrically connected to the patch antenna pattern at a point offset in a first direction from a center of the patch antenna pattern; a first side coupling pattern spaced apart from the patch antenna pattern along a second direction and a second side coupling pattern spaced apart from the patch antenna pattern along the second direction and opposite to the first side coupling pattern; and a first side ground pattern spaced apart from the patch antenna pattern along the first direction and a second side ground pattern spaced apart from the patch antenna pattern along the first direction and opposite to the first side ground pattern. The patch antenna pattern and the first and second side coupling patterns are disposed between the first and second side ground patterns with respect to the first direction.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: December 20, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Hyun Kim, Hyung Geun Ji, Se Min Jin, Won Cheol Lee
  • Publication number: 20210036432
    Abstract: An antenna apparatus includes a patch antenna pattern; a feed via electrically connected to the patch antenna pattern at a point offset in a first direction from a center of the patch antenna pattern; a first side coupling pattern spaced apart from the patch antenna pattern along a second direction and a second side coupling pattern spaced apart from the patch antenna pattern along the second direction and opposite to the first side coupling pattern; and a first side ground pattern spaced apart from the patch antenna pattern along the first direction and a second side ground pattern spaced apart from the patch antenna pattern along the first direction and opposite to the first side ground pattern. The patch antenna pattern and the first and second side coupling patterns are disposed between the first and second side ground patterns with respect to the first direction.
    Type: Application
    Filed: January 7, 2020
    Publication date: February 4, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Hyun KIM, Hyung Geun JI, Se Min JIN, Won Cheol LEE
  • Publication number: 20200293988
    Abstract: Disclosed embodiments provide systems and methods related to providing delivery offers for use with a user interface. A method for providing delivery offers comprises receiving, from a mobile device, a request for one or more delivery tasks including a geographical area and a time frame, accessing a database storing delivery tasks, each delivery task associated with a status of fully assigned, partially assigned, or not assigned based on a comparison of a number of workers assigned to the task and a number of workers necessary to complete the task, determining which of the stored delivery tasks needing assignment have a delivery route in the received geographical area and time frame, selecting one or more delivery offers if a status of each determined delivery offers is equal to partially assigned or not assigned, and responding to the received request by transmitting the one or more selected delivery offers to the mobile device.
    Type: Application
    Filed: March 12, 2019
    Publication date: September 17, 2020
    Inventors: Erik REHN, Yoo Suk KIM, Yul Hee LEE, Hye Leen CHOI, Han Jun LEE, Hyung Geun JI
  • Patent number: 9923261
    Abstract: Disclosed is a mounting module, an antenna apparatus, and a method of manufacturing a mounting module. The mounting module includes a board; an antenna mounted on a first surface of the board, an RF circuit unit mounted on a second surface of the board, and a feeding line to electrically connect the RF circuit unit and the antenna through the board, thereby reducing a loss of signal power.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: March 20, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Se Min Jin, Min Hoon Kim, Eun Kyoung Kim, Seung Goo Jang, Hyung Geun Ji, Jae Hyun Chang
  • Publication number: 20160276734
    Abstract: Disclosed is a mounting module, an antenna apparatus, and a method of manufacturing a mounting module. The mounting module includes a board; an antenna mounted on a first surface of the board, an RF circuit unit mounted on a second surface of the board, and a feeding line to electrically connect the RF circuit unit and the antenna through the board, thereby reducing a loss of signal power.
    Type: Application
    Filed: January 11, 2016
    Publication date: September 22, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Se Min JIN, Min Hoon KIM, Eun Kyoung KIM, Seung Goo JANG, Hyung Geun JI, Jae Hyun CHANG
  • Publication number: 20160104934
    Abstract: An antenna includes: a board including layers; a main antenna pattern formed on a layer among the layers, and including two main patterns spaced apart from each other; and dummy patterns formed in the board and insulated from the main antenna pattern.
    Type: Application
    Filed: October 9, 2015
    Publication date: April 14, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Goo JANG, Se Min JIN, Eun Kyoung KIM, Min Hoon KIM, Hyung Geun JI, Jae Hyun CHANG
  • Patent number: RE49261
    Abstract: Disclosed is a mounting module, an antenna apparatus, and a method of manufacturing a mounting module. The mounting module includes a board; an antenna mounted on a first surface of the board, an RF circuit unit mounted on a second surface of the board, and a feeding line to electrically connect the RF circuit unit and the antenna through the board, thereby reducing a loss of signal power.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: October 25, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Se Min Jin, Min Hoon Kim, Eun Kyoung Kim, Seung Goo Jang, Hyung Geun Ji, Jae Hyun Chang