Patents by Inventor Hyung Gi HA

Hyung Gi HA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board
    Patent number: 10104767
    Abstract: A printed circuit board includes: a strip substrate sectioned into unit areas; electronic components respectively installed in each of the unit areas; and a separation space disposed between the unit areas.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: October 16, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyung-Gi Ha, Jong-Myeon Lee, Jong-Rip Kim
  • PRINTED CIRCUIT BOARD
    Publication number: 20170079143
    Abstract: A printed circuit board includes: a strip substrate sectioned into unit areas; electronic components respectively installed in each of the unit areas; and a separation space disposed between the unit areas.
    Type: Application
    Filed: March 28, 2016
    Publication date: March 16, 2017
    Applicant: Samsung Electro-Mechanic Co., Ltd.
    Inventors: Hyung-Gi HA, Jong-Myeon LEE, Jong-Rip KIM
  • Printed circuit board and method for manufacturing the same
    Patent number: 9526169
    Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a granular structure formed on the first surface roughness.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: December 20, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyung Gi Ha, Jae Won Jung, Yong Hwan Kim, Jong Jin Lee, Ja Ho Koo, Young Hwan Shin, Dong Kyu Lee
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160270233
    Abstract: Disclosed is a printed circuit board in which an electronic component may be embedded and a method of manufacturing the same. The printed circuit board may include a core layer including a cavity having a supporting part, an electronic component seated on the supporting part, a first and a second insulating layers to cover an upper and a lower portions of the core layer, and vias connecting circuits formed in the core layer and on the insulating layers to each other, whereby a process of manufacturing a printed circuit board having an electronic component embedded therein may be simplified.
    Type: Application
    Filed: December 11, 2015
    Publication date: September 15, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Hyung Gi HA
  • PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20150382461
    Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness.
    Type: Application
    Filed: September 9, 2015
    Publication date: December 31, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyung Gi HA, Jae Won JUNG, Yong Hwan KIM, Jong Jin LEE, Ja Ho KOO, Young Hwan SHIN, Dong Kyu LEE
  • CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE
    Publication number: 20150296620
    Abstract: A circuit board includes an insulating material; a conductive pattern formed on at least one surface of the insulating material; and a connection pin adapted for electrical connection with an external apparatus, attached to the one surface, and made of a metal.
    Type: Application
    Filed: August 15, 2014
    Publication date: October 15, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Doo Hwan LEE, Hyung Gi Ha
  • Printed circuit board and method for manufacturing the same
    Patent number: 9161460
    Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: October 13, 2015
    Assignees: SAMSUNG ELECTRO-MECHANICS CO., LTD., KOREA E & S CO., LTD.
    Inventors: Hyung Gi Ha, Jae Won Jung, Yong Hwan Kim, Jong Jin Lee, Ja Ho Koo, Young Hwan Shin, Dong Kyu Lee
  • PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20120168212
    Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness.
    Type: Application
    Filed: November 30, 2011
    Publication date: July 5, 2012
    Applicants: KOREA E&S CO., LTD., SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Gi HA, Jae Won JUNG, Yong Hwan KIM, Jong Jin LEE, Ja Ho KOO, Young Hwan SHIN, Dong Kyu LEE