Patents by Inventor Hyung Gu Jeon

Hyung Gu Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Earthing device which needs not be buried under ground
    Patent number: 7652865
    Abstract: An earthing device which needs not be buried under the ground is provided. The earthing device includes an earthing panel and a discharging device mounted inside the earthing panel. The discharging device includes at least one electrode plate, multiple discharging electrodes coupled to the electrode plate, and catalyst filled between the discharging electrodes. Since an earth electrode needs not be buried under the ground, it requires less construction costs, time and area, and environmental pollution (especially, soil pollution) does not happen. Further, the earthing device can be simply and economically installed regardless of place.
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: January 26, 2010
    Assignee: Ground Co., Ltd.
    Inventors: Jea Wook Woo, Jin Seok Huh, Seungjoon Ahn, Seong Joon Ahn, Chul Geun Park, Ho Sub Son, Jin Seok Jin, Hyung Gu Jeon
  • Earthing Device Which Needs Not Be Buried Under Ground
    Publication number: 20080002327
    Abstract: An earthing device which needs not be buried under the ground is provided. The earthing device includes an earthing panel and a discharging device mounted inside the earthing panel. The discharging device includes at least one electrode plate, multiple discharging electrodes coupled to the electrode plate, and catalyst filled between the discharging electrodes. Since an earth electrode needs not be buried under the ground, it requires less construction costs, time and area, and environmental pollution (especially, soil pollution) does not happen. Further, the earthing device can be simply and economically installed regardless of place.
    Type: Application
    Filed: July 24, 2006
    Publication date: January 3, 2008
    Applicant: GROUND CO., LTD.
    Inventors: Jea Woo, Jin Huh, Seungjoon Ahn, Seong Ahn, Chul Geun Park, Ho Sub Son, Jin Seok Jin, Hyung Gu Jeon