Patents by Inventor Hyung Ho LIM

Hyung Ho LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microneedle adhesive patch based on hydrogel formulation
    Patent number: 12226535
    Abstract: Disclosed are a microneedle patch including a first hydrogel layer containing a mussel adhesive protein and hyaluronic acid, and a second hydrogel layer containing silk fibroin, and a preparation method thereof. The microneedle patch according to the present disclosure has excellent tissue adhesion, biocompatibility, and biodegradability, and is used for transdermal drug delivery to promote wound regeneration.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: February 18, 2025
    Assignee: POSTECH ACADEMY-INDUSTRY FOUNDATION
    Inventors: Hyung Joon Cha, Eun Young Jeon, Jung Ho Lee, Geun Bae Lim
  • Aerosol generating device and method of controlling the same
    Patent number: 12207687
    Abstract: A method of controlling an aerosol generating device includes measuring a temperature of a heater, selecting one of a plurality of temperature correction algorithms, based on the measured temperature, and correcting the measured temperature by applying the selected temperature correction algorithm. In addition, a method of controlling an aerosol generating device includes measuring a temperature of a heater operating in an operation section including a plurality of sections, determining, from among the plurality of sections, a current section in which the heater is operating, selecting one of a plurality of temperature correction algorithms, based on the selected current section of the heater, and correcting the measured temperature of the heater by applying the selected temperature correction algorithm.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: January 28, 2025
    Assignee: KT&G CORPORATION
    Inventors: Hyung Jin Jung, Tae Hun Kim, Hun Il Lim, Jae Sung Choi, Jung Ho Han
  • Prefabricated post assembly
    Patent number: 11608626
    Abstract: A prefabricated post assembly is proposed. The prefabricated post assembly includes a vertical post having at least one assembly surface and a horizontal post having an assembly module mounted at an end thereof to be coupled to the assembly surface, in which at least one upper insertion hole is formed at an upper portion of the assembly surface and at least one lower insertion hole is formed at a lower portion of the assembly surface.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: March 21, 2023
    Inventors: Seung Il Kim, Hyung Ho Lim
  • PREFABRICATED POST ASSEMBLY
    Publication number: 20230041026
    Abstract: A prefabricated post assembly is proposed. The prefabricated post assembly includes a vertical post having at least one assembly surface and a horizontal post having an assembly module mounted at an end thereof to be coupled to the assembly surface, in which at least one upper insertion hole is formed at an upper portion of the assembly surface and at least one lower insertion hole is formed at a lower portion of the assembly surface.
    Type: Application
    Filed: February 8, 2021
    Publication date: February 9, 2023
    Inventors: Seung Il KIM, Hyung Ho LIM