Abstract: Disclosed is a UWB antenna module arranged in the lateral direction of a portable terminal so as to prevent deterioration of communication performance while minimizing a mounting space. The disclosed UWB antenna module comprises: a planar base substrate; a plurality of radiation patterns arranged on the upper surface of the base substrate, and arranged so as to be spaced from each other; a switching element arranged on the lower surface of the base substrate and connected to the plurality of radiation patterns; and a communication chipset arranged to be spaced from the switching element on the lower surface of the base substrate, and connected to one of the plurality of radiation patterns through a switching operation of the switching element.

Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.

Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.

Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.

Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.

Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.

Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.

Abstract: An antenna module includes an integrated circuit (IC) package, a first antenna package, a second antenna package, and a connection member. The IC package includes an IC and mounting electrical connection structures. The first antenna package includes a first patch antenna pattern, a first feed via connected to the first patch antenna pattern, and a first antenna dielectric layer surrounding at least a portion of the first feed via. The second antenna package includes a second patch antenna pattern, a second feed via connected to the second patch antenna pattern, and a second antenna dielectric layer surrounding at least a portion of the second feed via, and disposed to be spaced apart from the first antenna package. The connection member, connecting the IC to the first feed via and the second feed via, connects to the mounting electrical connection structures, and having a stacked structure.

Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.

Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.

Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.

Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.

Abstract: An antenna module includes an integrated circuit (IC) package, a first antenna package, a second antenna package, and a connection member. The IC package includes an IC and mounting electrical connection structures. The first antenna package includes a first patch antenna pattern, a first feed via connected to the first patch antenna pattern, and a first antenna dielectric layer surrounding at least a portion of the first feed via. The second antenna package includes a second patch antenna pattern, a second feed via connected to the second patch antenna pattern, and a second antenna dielectric layer surrounding at least a portion of the second feed via, and disposed to be spaced apart from the first antenna package. The connection member, connecting the IC to the first feed via and the second feed via, connects to the mounting electrical connection structures, and having a stacked structure.