Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.

Abstract: A method of manufacturing a bulk acoustic wave resonator includes: forming a sacrificial layer on a substrate protection layer; forming a membrane layer on the substrate protection layer to cover the sacrificial layer; and forming a cavity by removing the sacrificial layer using a gas mixture comprising a halide-based gas and an oxygen-containing gas, wherein a mixture ratio of the halide-based gas to the oxygen-containing gas in the gas mixture is in a range from 1.5 to 2.4.

Abstract: A method of manufacturing a bulk acoustic wave resonator includes: forming a sacrificial layer on a substrate protection layer; forming a membrane layer on the substrate protection layer to cover the sacrificial layer; and forming a cavity by removing the sacrificial layer using a gas mixture comprising a halide-based gas and an oxygen-containing gas, wherein a mixture ratio of the halide-based gas to the oxygen-containing gas in the gas mixture is in a range from 1.5 to 2.4.

Abstract: A bulk acoustic wave resonator includes a substrate on which a substrate protective layer is disposed, a membrane layer forming a cavity together with the substrate, and a resonant portion disposed on the membrane layer. The cavity is formed by removing a sacrificial layer using a mixed gas obtained by mixing a halide-based gas and an oxygen gas, and at least one of the membrane layer and the substrate protective layer has a thickness difference of 170 ? or less, after the cavity is formed.

Abstract: An actuator unit includes a driving part connecting a fixing part and a support part which are disposed to be substantially coplanar; an actuator which is configured to deform the driving part to drive the support part out of the coplanar relationship with respect to the fixing part; and a sensor which is configured to measure a displacement amount or deformation of the driving part.

Abstract: Disclosed herein is a piezoresistance sensor module including: a piezoresistor, a depletion layer formed in a region of a portion of the piezoresistor, an insulator formed to cover the depletion layer and one surface of the piezoresistor, and a piezoelectric capacitor formed on the insulator so as to be opposite to the depletion layer.

Abstract: A golf tee set includes golf tees comprising a long tee including soft synthetic resin, having a tee body provided at an entire outer peripheral surface with a plurality of blades in a longitudinal direction, and provided at a lower end portion thereof with a pointed insertion member, and the short tee including soft synthetic resin. The short tee has a seating part having an upper portion on which a golf ball is placed and a support to support the seating part. The short tee has a concave middle portion. A rubber band has elasticity and links the long and short tees together. The golf tee is prevented from being flown away, easily identified and retrieved, and prevented from being lost by canceling the impact applied to the golf tee when the golf tee is struck through the rubber band to recover the golf tee to the original place thereof.

Abstract: Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensor 100 includes (A) applying a polymer 120 to a base substrate 110, (B) patterning the polymer 120 so as to form an opening part 125 in the polymer 120, (C) completing a cap 130 by forming a cavity 115 on the base substrate 110 exposed fro the opening part 125 through an etching process in a thickness direction, and (D) bonding the cap 130 to a device substrate 140 by using a polymer 120, whereby the polymer 120 is applied to the base substrate 110 in a constant thickness D3, such that the cap 130 may be easily bonded to the device substrate 140 by using the polymer 120.

Abstract: Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensor 100 includes (A) applying a polymer 120 to a base substrate 110, (B) patterning the polymer 120 so as to form an opening part 125 in the polymer 120, (C) completing a cap 130 by forming a cavity 115 on the base substrate 110 exposed fro the opening part 125 through an etching process in a thickness direction, and (D) bonding the cap 130 to a device substrate 140 by using a polymer 120, whereby the polymer 120 is applied to the base substrate 110 in a constant thickness D3, such that the cap 130 may be easily bonded to the device substrate 140 by using the polymer 120.