Patents by Inventor Hyung-Jin Kwon

Hyung-Jin Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240129725
    Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 18, 2024
    Applicant: ESTORM CO., LTD.
    Inventors: Jong Hyun WOO, Tae Il LEE, Il Jin JUNG, Hee Jun SHIN, Hyung Seok JANG, Min Jae SON, Sang Heon BAEK, Seo Bin PARK, Hyo Sang KWON, Mi Ju KIM, Jung Hoon SONG, Rakhmanov DILSHOD, Dong Hee KIM, Jeon Gjin KIM
  • Publication number: 20240098894
    Abstract: A display device includes a substrate including a display area including pixels and a non-display area around the display area and including a pad area, and a circuit board attached to the pad area. Pad electrodes arranged along a first direction and a first alignment mark located at a side of the pad electrodes in the first direction and protruding more than the pad electrodes are disposed on the substrate in the pad area. The circuit board includes a base portion, and lead electrodes disposed on the base portion and respectively facing the pad electrodes. A first alignment mark hole is defined through the base portion at a side of the lead electrodes in the first direction, the first alignment mark and the first alignment mark hole have a same shape as each other, and the first alignment mark is accommodated in the first alignment mark hole.
    Type: Application
    Filed: May 10, 2023
    Publication date: March 21, 2024
    Inventors: Hyung Jin KIM, Hyang Won MOON, Hyeok Tae KWON, Si Hyung AN, Geun Yeong CHANG
  • Patent number: 11935682
    Abstract: A coil component includes a body including magnetic metal powder and an insulating resin, an insulating substrate embedded in the body, a coil portion disposed on at least one side of the insulating substrate the body, and having a lead-out pattern exposed from one of end surfaces of the body opposing each other, an external insulating layer exposing the lead-out pattern while surrounding the body, and including a magnetic ceramic, and an external electrode disposed on the body, and connected to the lead-out pattern.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Jin Jeon, Seon Woo Oh, Soon Kwang Kwon
  • Patent number: 11326806
    Abstract: A duct type air conditioning apparatus is provided with a blowing portion including a first cabinet in which a blower assembly is installed and a heat exchanging portion including a second cabinet in which a heat exchanger is installed. The air conditioning apparatus includes a partition panel arranged between the first and second cabinets and connected to facing sides of the first and second cabinet, and first and second link members separably fastened along an upper end and a lower end of the partition panel to keep an airtight seal in a connection portion between the first and second cabinets.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: May 10, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyung-jin Kwon, Min-gu Jeon, Do-yeon Kim, Hyun-ho Kim, Chul-byung Park, Bu-youn Lee
  • Patent number: 10571151
    Abstract: A duct type air conditioning apparatus is provided with a blowing portion including a first cabinet in which a blower assembly is installed and a heat exchanging portion including a second cabinet in which a heat exchanger is installed. The air conditioning apparatus includes a partition panel arranged between the first and second cabinets and connected to facing sides of the first and second cabinet, and first and second link members separably fastened along an upper end and a lower end of the partition panel to keep an airtight seal in a connection portion between the first and second cabinets.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: February 25, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyung-jin Kwon, Min-gu Jeon, Do-yeon Kim, Hyun-ho Kim, Chul-byung Park, Bu-youn Lee
  • Publication number: 20190030662
    Abstract: A duct type air conditioning apparatus is provided with a blowing portion including a first cabinet in which a blower assembly is installed and a heat exchanging portion including a second cabinet in which a heat exchanger is installed. The air conditioning apparatus includes a partition panel arranged between the first and second cabinets and connected to facing sides of the first and second cabinet, and first and second link members separably fastened along an upper end and a lower end of the partition panel to keep an airtight seal in a connection portion between the first and second cabinets.
    Type: Application
    Filed: October 4, 2018
    Publication date: January 31, 2019
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hyung-jin KWON, Min-gu JEON, Do-yeon KIM, Hyun-ho KIM, Chul-byung PARK, Bu-youn LEE
  • Patent number: 9559548
    Abstract: A cover member of an electronic device is provided. The cover member includes covers hingedly connected, wherein each cover includes a power receiving member configured to wirelessly receive power.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: January 31, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyung-Jin Kwon, Jang-Rak Kim, Sung-Sik Jung, Ji-Sang Jang
  • Publication number: 20160153457
    Abstract: A fan assembly for a centrifugal blower and an air conditioning apparatus including the same are provided. The fan assembly for the centrifugal blower includes a first support configured to receive a driving force from a driving source to rotate, a plurality of blades having one end supported by the first support and arranged with an interval in a circumferential direction of the first support, and a second support configured to support the other end of the plurality of blades and including an air inlet formed therein, wherein the plurality of blades include a first portion disposed adjacent to the air inlet, and a second portion further from the air inlet than the first portion and having a wider width than the first portion, and at least one of the first and second portions has a constant width.
    Type: Application
    Filed: October 16, 2015
    Publication date: June 2, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Keun-jeong JANG, Byung-ghun KIM, Yong-ho SEO, Hyung-jin KWON, Young-jae KIM, Hyeong-joon SEO
  • Publication number: 20160131390
    Abstract: A duct type air conditioning apparatus is provided with a blowing portion including a first cabinet in which a blower assembly is installed and a heat exchanging portion including a second cabinet in which a heat exchanger is installed. The air conditioning apparatus includes a partition panel arranged between the first and second cabinets and connected to facing sides of the first and second cabinet, and first and second link members separably fastened along an upper end and a lower end of the partition panel to keep an airtight seal in a connection portion between the first and second cabinets.
    Type: Application
    Filed: October 15, 2015
    Publication date: May 12, 2016
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hyung-jin KWON, Min-gu JEON, Do-yeon KIM, Hyun-ho KIM, Chul-byung PARK, Bu-youn LEE
  • Publication number: 20150256021
    Abstract: A cover member of an electronic device is provided. The cover member includes covers hingedly connected, wherein each cover includes a power receiving member configured to wirelessly receive power.
    Type: Application
    Filed: August 22, 2014
    Publication date: September 10, 2015
    Inventors: Hyung-Jin KWON, Jang-Rak KIM, Sung-Sik JUNG, Ji-Sang JANG
  • Publication number: 20110192177
    Abstract: Disclosed herein are an air conditioner which controls a pressure of a refrigerant of an outdoor unit by adjusting an opening degree of an outdoor expansion valve or an indoor expansion valve, and a control method thereof. The air conditioner measures a pressure of the refrigerant discharged from a compressor during a cooling operation, and raises the pressure of the refrigerant to be higher than a designated pressure by controlling an opening degree of at least one of the outdoor expansion valve and the indoor expansion valve, if the pressure of the refrigerant is lower than the designated pressure. Further, the air conditioner measures the pressure of the refrigerant inhaled into the compressor during a heating operation, and adjusts the pressure of the refrigerant to be lower than a designated pressure by controlling the opening degree of the outdoor expansion valve, if the pressure of the refrigerant is higher than the designated pressure.
    Type: Application
    Filed: February 2, 2011
    Publication date: August 11, 2011
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dong Seok BAE, Kyoung Rock Kim, Jae Gil Lee, Chang Seon Lee, Hyung Jin Kwon
  • Publication number: 20110192176
    Abstract: Disclosed herein is a water-source heat-pump type air conditioner in which a receiver is connected to a super-cooler or economizer, and a control method of the air conditioner to reduce the quantity of liquid refrigerant collected in the receiver during a cooling/heating overload operation. When a cooling/heating overload operation occurs, an electric expansion valve associated with the super-cooler or the economizer is opened by a predetermined opening degree, to bypass high-pressure liquid refrigerant collected in the receiver, thereby preventing a rapid pressure increase due to a great quantity of liquid refrigerant collected in the receiver.
    Type: Application
    Filed: January 14, 2011
    Publication date: August 11, 2011
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kyoung Rock KIM, Dong Seok Bae, Jae Gil Lee, Chang Seon Lee, Hyung Jin Kwon
  • Patent number: 7416870
    Abstract: The present invention provides methods of modifying a biological molecule by C—O bond formation utilizing a type II polyketide synthase (PKS) system from the nonactin biosynthesis gene cluster. The type II PKS responsible for biosynthesis of the macrotetralide nonactin includes polypeptides encoded by the nonJK genes. The NonJ and NonK polypeptides have been identified by the inventors as ketoacyl synthases capable of directly catalyzing C—O bond formation between substrate molecules. This invention increases the scope and diversity of chemical syntheses available for drug design and combinatorial biosynthesis.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: August 26, 2008
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Ben Shen, Hyung-Jin Kwon
  • Publication number: 20040241799
    Abstract: The present invention provides methods of modifying a biological molecule by C—O bond formation utilizing a type II polyketide synthase (PKS) system from the nonactin biosynthesis gene cluster. The type II PKS responsible for biosynthesis of the macrotetralide nonactin includes polypeptides encoded by the nonJK genes. The NonJ and NonK polypeptides have been identified by the inventors as ketoacyl synthases capable of directly catalyzing C—O bond formation between substrate molecules. This invention increases the scope and diversity of chemical syntheses available for drug design and combinatorial biosynthesis.
    Type: Application
    Filed: August 22, 2003
    Publication date: December 2, 2004
    Applicant: Wisconsin Alumni Research Foundation
    Inventors: Ben Shen, Hyung-Jin Kwon
  • Publication number: 20030213436
    Abstract: Provided is an atomic layer deposition apparatus that can prevent the degradation of a sheet resistance uniformity as well as enhance the throughput. The atomic layer deposition apparatus of this research includes: a rotary plate in the chamber, wherein a plurality of wafers positioned on the rotary plate to equal distances from the center of the rotary plate; a gas injecting means confronting the upper surface of the rotary plate at the center; and a heating plate cable of controlling the temperature of the wafers according to the location, wherein the heating plate is mounted on the bottom plate and a space is provided between the heating plate and the bottom surface of the rotary plate.
    Type: Application
    Filed: December 31, 2002
    Publication date: November 20, 2003
    Inventor: Hyung-Jin Kwon