Patents by Inventor Hyung-Jin Lee

Hyung-Jin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10819445
    Abstract: Embodiments may relate to a transceiver chip. The transceiver chip may include a substrate that has a first transceiver component and a second transceiver component positioned therein. The transceiver chip may further include a well material that is positioned between the first transceiver component and the second transceiver component. The well material may mitigate cross-talk between the first transceiver component and the second transceiver component. Other embodiments may be described or claimed.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: October 27, 2020
    Assignee: Intel Corporation
    Inventors: Telesphor Kamgaing, Georgios Dogiamis, Henning Braunisch, Hyung-Jin Lee, Richard Dischler
  • Publication number: 20200337129
    Abstract: An LED lighting apparatus capable of color temperature control includes a color temperature controller to receive a color temperature selection signal and output first and second control signals; a LED driver connected a plurality of LED groups; and a LED selection circuit including a first switch connected to a first node to which a rectified voltage is applied and receiving the first control signal, a first LED group selectively connected to the first node by the first switch, a second LED group connected in scales with the first LED group, a third LED group selectively connected to the first node by the first switch, a fourth LED group connected in series with the third LED group, and a second switch for selectively connecting the output terminal of the second LED group or the fourth LED group to the LED driver by receiving the second control signal.
    Type: Application
    Filed: June 2, 2020
    Publication date: October 22, 2020
    Inventors: Keith HOPWOOD, Sung Ho JIN, Hyung Jin LEE, Sang Wook HAN
  • Publication number: 20200313615
    Abstract: A voltage controlled oscillator (VCO) circuit is disclosed. The VCO circuit comprises a VCO tuning circuit comprising a primary inductive coil. In some embodiments, the VCO tuning circuit is configured to generate a VCO output signal at a first resonance frequency. The VCO circuit further comprises a filter circuit comprising a secondary inductive coil. In some embodiments, the filter circuit is configured to resonate at a second, different, resonance frequency, in order to filter a noise associated with the VCO tuning circuit. In some embodiments, the primary inductive coil associated with the VCO tuning circuit and the secondary inductive coil associated with the filter circuit are concentrically arranged with respect to one another. Further, in some embodiments, the primary inductive coil associated with the VCO tuning circuit and the secondary inductive coil associated with the filter circuit are magnetically decoupled with respect to one another.
    Type: Application
    Filed: March 29, 2019
    Publication date: October 1, 2020
    Inventors: Sachin Kalia, Satwik Patnaik, Hyung-Jin Lee, Ram Sadhwani
  • Patent number: 10791597
    Abstract: An LED lighting apparatus capable of color temperature control includes a color temperature controller to receive a color temperature selection signal and output first and second control signals; a LED driver connected a plurality of LED groups; and a LED selection circuit including a first switch connected to a first node to which a rectified voltage is applied and receiving the first control signal, a first LED group selectively connected to the first node by the first switch, a second LED group connected in series with the first LED group, a third LED group selectively connected to the first node by the first switch, a fourth LED group connected in series with the third LED group, and a second switch for selectively connecting the output terminal of the second LED group or the fourth LED group to the LED driver by receiving the second control signal.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: September 29, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Keith Hopwood, Sung Ho Jin, Hyung Jin Lee, Sang Wook Han
  • Patent number: 10784839
    Abstract: A high pass filter includes: a first resonant circuit including an inductor and a capacitor in parallel between first and second terminals; a second resonant circuit including an inductor and a capacitor in series between a first end of the first resonant circuit and a ground; a third resonant circuit including an inductor and a capacitor in series between a second end of the first resonant circuit and the ground; a fourth resonant circuit disposed between the first end of the first resonant circuit and the first terminal, and including a first acoustic resonator; and a fifth resonant circuit disposed between the second end of the first resonant circuit and the second terminal, and including a second acoustic resonator. Attenuation regions respectively formed by the first, second, and third resonant circuits are arranged in lower frequency regions than attenuation regions respectively formed by the fourth and fifth resonant circuits.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: September 22, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Hae Kim, Seong Jong Cheon, Hyung Jin Lee
  • Publication number: 20200294939
    Abstract: Embodiments may relate to a semiconductor package that includes a die and a package substrate. The package substrate may include one or more cavities that go through the package substrate from a first side of the package substrate that faces the die to a second side of the package substrate opposite the first side. The semiconductor package may further include a waveguide communicatively coupled with the die. The waveguide may extend through one of the one or more cavities such that the waveguide protrudes from the second side of the package substrate. Other embodiments may be described or claimed.
    Type: Application
    Filed: April 25, 2019
    Publication date: September 17, 2020
    Applicant: Intel Corporation
    Inventors: Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Gilbert W. Dewey, Hyung-Jin Lee
  • Publication number: 20200280121
    Abstract: Embodiments may relate to an semiconductor package. The semiconductor package may include a die coupled with the face of the package substrate. The semiconductor package may further include a waveguide coupled with the face of the package substrate adjacent to the die, wherein the waveguide is to receive an electromagnetic signal from the die and facilitate conveyance of the electromagnetic signal in a direction parallel to the face of the package substrate. Other embodiments may be described or claimed.
    Type: Application
    Filed: March 29, 2019
    Publication date: September 3, 2020
    Applicant: Intel Corporation
    Inventors: Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Gilbert W. Dewey, Hyung-Jin Lee
  • Publication number: 20200273824
    Abstract: Embodiments may relate to a microelectronic package that includes a package substrate and a signal interconnect coupled with the face of the package substrate. The microelectronic package may further include a ground interconnect coupled with the face of the package substrate. The ground interconnect may at least partially surround the signal interconnect. Other embodiments may be described or claimed.
    Type: Application
    Filed: March 29, 2019
    Publication date: August 27, 2020
    Applicant: Intel Corporation
    Inventors: Telesphor Kamgaing, Georgios Dogiamis, Hyung-Jin Lee, Henning Braunisch, Richard Dischler
  • Patent number: 10757781
    Abstract: A lighting apparatus including an LED circuit including a plurality of serially connected stages configured to receive a modulated rectified voltage, each of the stages including a first path including a first resistor and a first LED connected in series, and a second path connected to the first path in parallel and including a second LED configured to emit light having a color temperature different from that emitted from the first LED, and a driving current controller configured to adjust an intensity of light output from the LED circuit by adjusting currents applied to driving nodes connected to the stages, depending on a dimming signal associated with a dimming level of the rectified voltage, in which a threshold voltage of the first LED is lower than that of the second LED.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: August 25, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Keith Hopwood, Hyung Jin Lee, Sung Ho Jin, Sang Wook Han, In Seok Baek
  • Patent number: 10749493
    Abstract: A band pass filter includes: a first circuit unit including a first series LC resonant circuit disposed between a first terminal and a second terminal; a second circuit unit disposed between the first circuit unit and the second terminal, and including a first parallel LC resonant circuit; and a third circuit unit disposed between the first terminal and a ground, and including a second series LC resonant circuit, wherein a resonant frequency of the first circuit unit is in a pass band.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: August 18, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyung Jin Lee, Seong Jong Cheon, Jeong Hae Kim
  • Publication number: 20200259018
    Abstract: Disclosed herein are field-effect transistors with asymmetric gate stacks. An example transistor includes a channel material and an asymmetric gate stack, provided over a portion of the channel material between source and drain (S/D) regions. The gate stack is asymmetric in that a thickness of a gate dielectric of a portion of the gate stack closer to one of the S/D regions is different from that of a portion of the gate stack closer to the other S/D region, and in that a work function (WF) material of a portion of the gate stack closer to one of the S/D regions is different from a WF material of a portion of the gate stack closer to the other S/D region. Transistors as described herein exploit asymmetry in the gate stacks to improve the transistor performance in terms of high breakdown voltage, high gain, and/or high output resistance.
    Type: Application
    Filed: February 8, 2019
    Publication date: August 13, 2020
    Applicant: Intel Corporation
    Inventors: Said Rami, Hyung-Jin Lee, Saurabh Morarka, Guannan Liu, Qiang Yu, Bernhard Sell, Mark Armstrong
  • Publication number: 20200243655
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication. In an example, an integrated circuit structure includes a fin including silicon. A gate structure is over the fin, the gate structure having a center. A conductive source trench contact is over the fin, the conductive source trench contact having a center spaced apart from the center of the gate structure by a first distance. A conductive drain trench contact is over the fin, the conductive drain trench contact having a center spaced apart from the center of the gate structure by a second distance, the second distance greater than the first distance by a factor of three.
    Type: Application
    Filed: January 29, 2019
    Publication date: July 30, 2020
    Inventors: Said RAMI, Hyung-Jin LEE, Surej RAVIKUMAR, Kinyip PHOA
  • Patent number: 10715165
    Abstract: There is disclosed in one example a communication apparatus, including: an analog data source; a digital communication interface; and an analog-to-digital converter (ADC) circuit assembly, including: an analog sample input; an input clock to provide frequency fin; a time-interleaved front end to interleave n samples of the analog sample input; and an ADC array including n successive-approximation register (SAR) ADCs, the SAR ADCs including self-clocked comparators and configured to operate at a frequency no less than f in n .
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: July 14, 2020
    Assignee: Intel Corporation
    Inventors: Peter Tsugio Kurahashi, Cho-ying Lu, Triveni Suryakant Rane, Carlos Fernando Nieva-Lozano, Hyung-Jin Lee
  • Publication number: 20200194427
    Abstract: Embodiments disclosed herein include semiconductor devices and methods of forming such devices. In an embodiment the semiconductor device comprises a first semiconductor layer, where first transistors are fabricated in the first semiconductor layer, and a back end stack over the first transistors. In an embodiment the back end stack comprises conductive traces and vias electrically coupled to the first transistors. In an embodiment, the semiconductor device further comprises a second semiconductor layer over the back end stack, where the second semiconductor layer is a different semiconductor than the first semiconductor layer. In an embodiment, second transistors are fabricated in the second semiconductor layer.
    Type: Application
    Filed: December 14, 2018
    Publication date: June 18, 2020
    Inventors: Gilbert DEWEY, Telesphor KAMGAING, Aleksandar ALEKSOV, Gerogios DOGIAMIS, Hyung-Jin LEE
  • Publication number: 20200185622
    Abstract: The present disclosure provides a compound of following formula and an organic light emitting device and an organic light emitting display device including the compound. The compound of the present disclosure serves as a host or a dopant in an emitting material layer.
    Type: Application
    Filed: December 3, 2019
    Publication date: June 11, 2020
    Inventors: Kyung-Jin YOON, Yu-Jin BAE, Bo-Min SEO, Jeong-Eun BAEK, Joong-Hwan YANG, Chun-Ki KIM, Jung-Hyun YOON, Hyung-Won CHO, Kyu-Soon SHIN, Jeong-A SEO, Hyung-Jin LEE, Young-Sam JIN, Dong-Hyun LEE
  • Publication number: 20200169240
    Abstract: A front end module includes a base filter configured to operate as a bandpass filter passing a pass band of an input radio frequency signal; a switch connected to the base filter, and a first notch filter and a second notch filter selectively connected to the base filter through the switch, wherein a stop band of the first notch filter and a stop band of the second notch filter overlap the pass band of the base filter in a band equal to or higher than a center frequency of the pass band of the base filter.
    Type: Application
    Filed: June 7, 2019
    Publication date: May 28, 2020
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Jong CHEON, Hyung Jin LEE, Jeong Hae KIM
  • Publication number: 20200160765
    Abstract: An aging system according to an embodiment includes an aging pad inspector for inspecting an aging pad of a display device, an aging aligner for aligning the aging pad with a probe, and an aging processor for applying an aging signal to the display device through the aging pad and through the probe.
    Type: Application
    Filed: September 11, 2019
    Publication date: May 21, 2020
    Inventors: Hyun Ae KIM, Kyung Min LEE, Hyung Jin LEE
  • Publication number: 20200133062
    Abstract: There is provided a display apparatus with an improved viewing angle. The display apparatus includes a display panel configured to receive light from a light source module, wherein the display panel includes: a liquid crystal panel; a first polarizing plate positioned on a rear side of the liquid crystal panel and a second polarizing plate positioned on a front side of the liquid crystal panel; and an optical layer positioned on a front surface of the second polarizing plate, wherein the optical layer includes: a resin layer having a first refractive index, and including an accommodating groove in which a light adjusting portion is disposed, the resin layer further including a light refractive pattern protruding toward a rear direction of the display panel; and an adhesive layer having a second refractive index different from the first refractive index, and bonding the resin layer with the second polarizing plate.
    Type: Application
    Filed: October 22, 2019
    Publication date: April 30, 2020
    Inventors: Hyung Jin LEE, Wook Jae JEON, Young Chol LEE, Ju Hyun LEE, Tae Young LEE, Seung Hun CHAE, Jun Sung CHOI
  • Patent number: 10637822
    Abstract: A method and device for managing an identifier of an embedded universal integrated circuit card (eUICC) is disclosed. The eUICC receives an identifier information request, determines whether there is a network carrier profile in an enabled state, and provides a response with identifier information corresponding to the identifier information request based on the results of the determination. According to the method, it is possible to separately manage the unique identifier of the eUICC and a network carrier ICCID and to dynamically manage the identifier of the eUICC according to the state of the network carrier profile of the eUICC.
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: April 28, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myoung Hee Seo, Kwan Lae Kim, Chul Hyun Park, Jin Hyoung Lee, Hyung Jin Lee, Youn Pil Jeong
  • Patent number: 10623106
    Abstract: Embodiments herein may relate to an interconnect that includes a transceiver, where the transceiver is configured to receive a data stream, convert the data stream to a quadrature amplitude modulation (QAM) mapping/shaping signal, where the QAM mapping/shaping signal is a frequency component of the data stream, convert the QAM mapping/shaping signal to a Hilbert transform signal, where the Hilbert transform signal includes a reverse order of an in-phase component of the QAM mapping/shaping signal and a reverse order of a quadrature component of the QAM mapping/shaping signal, convert the Hilbert transform signal to a QAM mapping/shaping signal, where the QAM mapping/shaping signal is a single sideband (SSB) time domain mm wave signal, where the SSB time domain mm wave signal is the Hilbert transform signal converted to a time domain signal, and communicate the SSB time domain mm wave signal over a waveguide using a waveguide interconnect.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: April 14, 2020
    Assignee: Intel Corporation
    Inventors: Hyung-Jin Lee, Cho-ying Lu, Henning Braunisch, Telesphor Kamgaing, Georgios Dogiamis, Richard Dischler