Patents by Inventor Hyung Jin Shin

Hyung Jin Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240141206
    Abstract: Disclosed are an adhesive film and a display member including the same. The adhesive film includes a matrix including a (meth)acrylic copolymer containing hydroxyl group and nanoparticles dispersed in the matrix, wherein a difference in cohesive energy between the matrix and the nanoparticles is about 20,000 J/mol or less.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Inventors: Seon Hee SHIN, Hyung Rang MOON, Il Jin KIM
  • Publication number: 20240129725
    Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 18, 2024
    Applicant: ESTORM CO., LTD.
    Inventors: Jong Hyun WOO, Tae Il LEE, Il Jin JUNG, Hee Jun SHIN, Hyung Seok JANG, Min Jae SON, Sang Heon BAEK, Seo Bin PARK, Hyo Sang KWON, Mi Ju KIM, Jung Hoon SONG, Rakhmanov DILSHOD, Dong Hee KIM, Jeon Gjin KIM
  • Publication number: 20240093401
    Abstract: A method of manufacturing a multilayer metal plate by electroplating includes a first forming operation of forming one of a first metal layer and a second metal layer on a substrate by electroplating, wherein the second metal layer is less recrystallized than the first metal layer, the second metal layer is comprised of nanometer-size grains, and the second metal layer has a higher level of tensile strength than the first metal layer; and a second forming operation of forming, by electroplating, a third metal layer not formed in the first forming operation on a surface of one of the first metal layer and the second metal layer formed in the first forming operation.
    Type: Application
    Filed: September 18, 2023
    Publication date: March 21, 2024
    Applicant: DONG-A UNIVERSITY RESEARCH FOUNDATION FOR INDUSTRY-ACADEMY COOPERATION
    Inventors: Hyun PARK, Sung Jin KIM, Han Kyun SHIN, Hyo Jong LEE, Jong Bae JEON, Jung Han KIM, An Na LEE, Tae Hyun KIM, Hyung Won CHO
  • Patent number: 11724684
    Abstract: A control apparatus for controlling a vehicle includes a driving motor configured to drive the vehicle by outputting motor torque based on a supply voltage from a battery, and an engine configured to drive the vehicle by outputting engine torque. The control apparatus may acquire driving mode data which is calculated based on traffic information from the current position to the destination of the vehicle and dimension information of the vehicle, and control the vehicle to drive to the destination according to a driving mode which is determined by applying a travelling condition of the vehicle to the acquired driving mode data, where the power distribution ratio of the motor torque to the engine torque is reflected in the driving mode data.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: August 15, 2023
    Assignee: Hyundai Kefico Corporation
    Inventors: Young-Ho Jun, Hyun-Ki Shin, Hyung-Jin Shin, Jun-Hyung Lee, Jung-Mook Choo
  • Publication number: 20230211784
    Abstract: Provided is a vehicle control method for protecting a vehicle and a driver during forward driving while in reverse gear of an electric vehicle, the vehicle control method including: detecting a gear position of a vehicle; generating a negative torque command to a motor of the vehicle by detecting the gear position as R stage; detecting a vehicle speed of the vehicle; and displaying a warning light or generating a warning sound through a cluster of the vehicle when the vehicle speed is detected as a positive vehicle speed.
    Type: Application
    Filed: November 23, 2022
    Publication date: July 6, 2023
    Inventors: Hyung Jin SHIN, Do In Kwon, Jung Mook Choo, Young Ho Jun
  • Publication number: 20230041192
    Abstract: In one aspect, an operating method of an intelligence vehicle driving control system is provided that comprises: a collecting step of collecting big data including a wheel torque and a speed for every vehicle type and traffic information; a torque calculating step of learning the big data using a predetermined machine learning model and inputs a specific desired speed profile to the machine learning model to calculate a motor torque of a driving vehicle; and an optimal speed profile deriving step of calculating an energy consumption required to generate the calculated motor torque using a predetermined dynamic programming method and a reverse vehicle dynamic model and deriving an optimal speed profile in which the energy consumption is minimized.
    Type: Application
    Filed: August 5, 2022
    Publication date: February 9, 2023
    Inventors: Young Ho Jun, Do In Kwon, Hyung Jin Shin, Jung Mook Choo
  • Publication number: 20220250609
    Abstract: A method and system for controlling an engine clutch of a P2 type parallel hybrid vehicle includes steps of: determining whether or not a learning mode entry condition is satisfied, depending on whether or not a kickdown shift occurs during performance of variable hydraulic control of an engine clutch and based on the degree to which slip of the engine clutch occurs, deriving and storing a learning hydraulic value for suppressing the slip that is to occur when the kickdown shift occurs during the performance of the variable hydraulic control in such a manner that the slip does not occur, when a vehicle state satisfies a predetermined learning mode entry condition, and computing a final hydraulic pressure by adding a hydraulic compensation value to a target hydraulic pressure, when the same kickdown shift situation occurs, and controlling the engine clutch using the computed final hydraulic pressure.
    Type: Application
    Filed: February 1, 2022
    Publication date: August 11, 2022
    Inventors: Jun-Hyung Lee, Jung-Mook Choo, Young-Ho Jun, Hyun-Ki Shin, Hyung-Jin Shin
  • Publication number: 20220165648
    Abstract: Disclosed is a semiconductor package including a semiconductor chip having a first surface adjacent to an active layer and a second surface opposite to the first surface; a conductive stud disposed on the first surface of the semiconductor chip and connected to the active layer; an adhesive layer disposed on the second surface of the semiconductor chip; a conductive post disposed outside the semiconductor chip; a first redistribution structure, which is on the first surface of the semiconductor chip and includes a first redistribution insulation layer supporting the conductive stud and the conductive post; a second redistribution structure, which is on the second surface of the semiconductor chip and includes a second redistribution insulation layer disposed on the adhesive layer; and a first molding layer disposed on the first redistribution structure and surrounding the semiconductor chip, the adhesive layer, the conductive stud, and the conductive post.
    Type: Application
    Filed: November 11, 2021
    Publication date: May 26, 2022
    Applicants: NEPES CO., LTD., NEPES LAWEH CORPORATION
    Inventors: Byung Cheol KIM, Yong Tae KWON, Hyo Gi JO, Dong Hoon OH, Jae Cheon LEE, Hyung Jin SHIN, Mary Maye Melgo Galimba
  • Publication number: 20220148993
    Abstract: Provided is a semiconductor package including a first semiconductor chip having a bottom surface adjacent to a first active layer and an top surface opposite to the bottom surface; a first adhesive layer disposed on the top surface of the first semiconductor chip; a first conductive stud disposed on the bottom surface of the first semiconductor chip and electrically connected to the first active layer; a first conductive post disposed outside the first semiconductor chip; a redistribution structure disposed under the first semiconductor chip and including a redistribution pattern connected to the first conductive stud and the first conductive post and a redistribution insulation layer surrounding the redistribution pattern; and a molding layer surrounding the first semiconductor chip, the first adhesive layer, the first conductive stud, and the first conductive post on the redistribution structure.
    Type: Application
    Filed: November 11, 2021
    Publication date: May 12, 2022
    Applicants: NEPES CO., LTD., NEPES LAWEH CORPORATION
    Inventors: Byung Cheol KIM, Yong Tae KWON, Hyo Gi JO, Dong Hoon OH, Jae Cheon LEE, Hyung Jin SHIN, Mary Maye Melgo Galimba
  • Publication number: 20220032899
    Abstract: A control apparatus for controlling a vehicle includes a driving motor configured to drive the vehicle by outputting motor torque based on a supply voltage from a battery, and an engine configured to drive the vehicle by outputting engine torque. The control apparatus may acquire driving mode data which is calculated based on traffic information from the current position to the destination of the vehicle and dimension information of the vehicle, and control the vehicle to drive to the destination according to a driving mode which is determined by applying a travelling condition of the vehicle to the acquired driving mode data, where the power distribution ratio of the motor torque to the engine torque is reflected in the driving mode data.
    Type: Application
    Filed: July 28, 2021
    Publication date: February 3, 2022
    Inventors: Young-Ho Jun, Hyun-Ki Shin, Hyung-Jin Shin, Jun-Hyung Lee, Jung-Mook Choo
  • Patent number: 9818908
    Abstract: Disclosed is an apparatus for forming an encapsulation material for a light emitting device. The apparatus for forming an encapsulation material comprises: an upper mold on which is mounted a substrate having a plurality of optical semiconductors; a lower mold arranged opposite the upper mold; a resin-capture space for capturing a resin between the upper mold and the lower mold; and an ejector pin for dividing the resin-capture space into a plurality of spaces at the position where the encapsulating material is formed, thereby dividing the encapsulation material into a plurality of parts formed on the substrate.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: November 14, 2017
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Hyung Jin Shin, Gi Won Hong, Young Dae Baek
  • Publication number: 20150034984
    Abstract: Disclosed is an apparatus for forming an encapsulation material for a light emitting device. The apparatus for forming an encapsulation material comprises: an upper mold on which is mounted a substrate having a plurality of optical semiconductors; a lower mold arranged opposite the upper mold; a resin-capture space for capturing a resin between the upper mold and the lower mold; and an ejector pin for dividing the resin-capture space into a plurality of spaces at the position where the encapsulating material is formed, thereby dividing the encapsulation material into a plurality of parts formed on the substrate.
    Type: Application
    Filed: May 25, 2012
    Publication date: February 5, 2015
    Applicant: Seoul Semiconductor Co., Ltd.
    Inventors: Hyung Jin Shin, Gi Won Hong, Young Dae Baek