Abstract: A semiconductor device includes a stack structure including first electrodes and insulating layers alternately stacked on each other, a second electrode passing through the stack structure, and variable resistance patterns each interposed between the second electrode and a corresponding one of the first electrodes. Each of the first electrodes includes a first sidewall facing the second electrode, and each of the insulating layers includes a second sidewall facing the second electrode. At least a part of each of the variable resistance patterns protrudes farther towards the second electrode than the second sidewall.

Abstract: Provided is a wire rod having high strength and high toughness, which suppresses the generation of surface oxide and has superior surface properties through uniform oxide formation, and to a method for manufacturing same. For this purpose, a wire rod comprising 0.005˜ to 0.02 wt. % of Sb, having superior surface properties, high strength and high toughness, and a method for manufacturing same are provided.

Abstract: An ultra-high-strength steel wire rod having excellent resistance to delayed fracture includes, by wt %, 0.7-1.2% C, 0.25-0.5% Si, 0.5-0.8% Mn, 0.02-0.1% V and a balance of Fe and inevitable impurities. The method includes the steps of heating the above steel composition to 1100° C. or lower and hot rolling at a temperature of 900-1000° C., followed by cooling to 600-650° C. at a prescribed rate, followed by cold drawing at a reduction ratio of 60-80%.

Abstract: Provided are a high-strength, high-toughness steel wire rod and a method of manufacturing the same. The steel wire rod has a composition including 0.07 wt % to 0.14 wt % of aluminum (Al) and nitrogen (N) wherein Al:N (where Al and N denote wt % of each element) is in a range of 15:1 to 25:1. Since a steel wire rod having sufficient strength and toughness improvement effects can be obtained with a simple alloy component, a steel wire rod capable of allowing processing such as cold forging to be performed without an additional heat treatment may be provided.