Abstract: In a liquid supplying unit liquid is supplied from a buffer vessel to an external unit by pressurizing the liquid present in the buffer vessel using gas supplied to the buffer vessel. A pressure measuring member is provided to measure the pressure inside the buffer vessel, and when the pressure inside the buffer vessel is equal to or greater than a preset reference pressure during refilling of the buffer vessel, gas is discharged from the buffer vessel through a vent line.

Abstract: An apparatus and method for cleaning debris and residue from a multitude of electrical contacts of a test probe card of an integrated circuit test probe apparatus preferably comprises a silicon wafer having a grooved surface into which the test probe card is moved into pressurized contact. The grooved surface provides a grating structure that when combined with the pressurized electrical contacts will crush any intervening or attached residue particles, which will then break into smaller particles and fall away from the probe card. Pressure and relative movement of the probe card may be controlled by a variety of measurement sensors.

Abstract: An apparatus and method for cleaning debris and residue from a multitude of electrical contacts of a test probe card of an integrated circuit test probe apparatus preferably comprises a silicon wafer having a grooved surface into which the test probe card is moved into pressurized contact. The grooved surface provides a grating structure that when combined with the pressurized electrical contacts will crush any intervening or attached residue particles, which will then break into smaller particles and fall away from the probe card. Pressure and relative movement of the probe card may be controlled by a variety of measurement sensors.

Abstract: An apparatus and method for cleaning debris and residue from a multitude of electrical contacts of a test probe card of an integrated circuit test probe apparatus preferably comprises a silicon wafer having a grooved surface into which the test probe card is moved into pressurized contact. The grooved surface provides a grating structure that when combined with the pressurized electrical contacts will crush any intervening or attached residue particles, which will then break into smaller particles and fall away from the probe card. Pressure and relative movement of the probe card may be controlled by a variety of measurement sensors.