Patents by Inventor Hyung-Kyu JIN

Hyung-Kyu JIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of controlling a temperature of a chemical mechanical polishing process, temperature control, and CMP apparatus including the temperature control
    Patent number: 10821572
    Abstract: A method of controlling a chemical mechanical polishing (CMP) process, a temperature control, and a CMP apparatus, the method including measuring actual temperatures of at least two regions in a platen in real time during the CMP process in which a polishing pad attached to the platen polishes a substrate held by a polishing head using slurry and deionized water; receiving the measured actual temperatures of the regions; and individually controlling the actual temperatures of the regions in real time during the CMP process to provide the regions with a predetermined set CMP process temperature.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: November 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Suk-Hoon Jeong, Sang-Hak Lee, Geun-Kyu Choi, Chang-Sun Hwang, Tae-Young Kwon, Young-Sang Kim, Hyung-Kyu Jin, Jeong-Nam Han
  • METHOD OF CONTROLLING A TEMPERATURE OF A CHEMICAL MECHANICAL POLISHING PROCESS, TEMPERATURE CONTROL, AND CMP APPARATUS INCLUDING THE TEMPERATURE CONTROL
    Publication number: 20190091828
    Abstract: A method of controlling a chemical mechanical polishing (CMP) process, a temperature control, and a CMP apparatus, the method including measuring actual temperatures of at least two regions in a platen in real time during the CMP process in which a polishing pad attached to the platen polishes a substrate held by a polishing head using slurry and deionized water; receiving the measured actual temperatures of the regions; and individually controlling the actual temperatures of the regions in real time during the CMP process to provide the regions with a predetermined set CMP process temperature.
    Type: Application
    Filed: March 20, 2018
    Publication date: March 28, 2019
    Inventors: Suk-Hoon JEONG, Sang-Hak LEE, Geun-Kyu CHOI, Chang-Sun HWANG, Tae-Young KWON, Young-Sang KIM, Hyung-Kyu JIN, Jeong-Nam HAN