Abstract: A circuit for designating an operating mode of a packaged semiconductor memory device includes a first fuse mounted on the device. A plurality of pads mounted on the device are accessible to a user after the device is packaged. A mode selection circuit generates a first signal when the first fuse is open and a second signal when the first fuse is closed. A first-fuse opening circuit is operably connected to the pads and opens the first fuse responsive to a predetermined first-fuse cutting signal on the pads. In another aspect of the invention, a second fuse may be opened responsive to a predetermined second-fuse cutting signal on the pads. When the second fuse opens, the first-fuse opening circuit is disabled to prevent accidental opening of the first fuse when the desired operating mode requires the first fuse to be maintained intact.

Abstract: A DRAM includes a refresh controller including a clock control section for producing a refresh mode signal in response to an external control clock signal, a refresh logic section for producing an enable signal in response to the refresh mode signal, a refresh counter for sequentially producing a first plurality of row address signals during an active period of a row address strobe signal in response to the enable signal, a row address buffer for producing a second plurality of row address signals in response to the row address signals, and a row decoder including a plurality of word line drivers which sequentially decode the second plurality of row address signals provided from the row address buffer and sequentially enables word lines corresponding to the decoded row address signals.

Abstract: An auto-program voltage generator in a nonvolatile semiconductor memory having a plurality of floating gate type memory cells, program circuit for programming selected memory cells, and program verification circuit for verifying whether or not the selected memory cells are successfully programmed comprises a high voltage generator for generating a program voltage, a trimming circuit for detecting the level of the program voltage to increase sequentially the program voltage within a predetermined voltage range every time the selected memory cells are not successfully programmed, a comparing circuit for comparing the detected voltage level with a reference voltage and then generating a comparing signal, and a high voltage generation control circuit for activating the high voltage generator in response to the comparing signal.

Abstract: An internal power voltage generating circuit of a semiconductor memory device may be constructed with a voltage sensing circuit (100) and a reference voltage controller (300) providing an internal power voltage int. V.sub.CC of a given reference voltage amplitude V.sub.ref and an external power voltage amplitude ext. V.sub.CC. Thus, when a high voltage over an operating voltage of a chip is applied to a pad (10) of the chip, the internal power voltage is raised to the level of the external power voltage. Therefore, when stress is added to the chip during a "burn-in-test", the defective chip is easily detected. Consequently, the reliability of those semiconductor memory devices subjected to post-manufacturing testing can be improved.

Abstract: A circuit for generating an internal voltage to be supplied to memory elements of a semiconductor memory chip during normal operation and for providing an external voltage to the memory elements during a burn-in test operation. The circuit may be constructed with a driver circuit (50) which receives an external voltage and is controlled to generate the internal voltage. A comparator (300) compares the internal voltage to a first reference voltage to produce a control signal G2 to control the driver circuit (50). An external voltage detector (100) compares a second reference voltage to the external voltage to generate control signal B2. A driver control circuit (200) is enabled by control signal B2, if the external voltage is less than the second reference voltage, to pass control signal G2 to the driver circuit and thereby enable generation of the internal voltage to be equal to, or less than, the operating voltage of the semiconductor memory chip.

Abstract: Disclosed is a non-volatile semiconductor memory device and the manufacturing method thereof. The non-volatile semiconductor memory device comprising a semiconductor substrate, and a group of gates electrically isolated from each other and formed on the semiconductor substrate, wherein the group of gates comprises a floating gate formed with a first conductive layer, a control gate formed with a second conductive layer laminated on the floating gate and select gates formed with the first conductive layer and the second conductive layer/formed on both the opposite side of the floating gate and the control gate and with an interposing impurity diffusion region formed on the semiconductor substrate, and wherein the select gates formed with the first conductive layer and the second conductive layer forms contacts on a field oxidation layer, thereby being connected with each other.

Abstract: A data output buffer suitable for use in a semiconductor memory device includes a first input circuit coupled to a first data signal and a first control signal, e.g., an output enable signal, and a second input circuit coupled to a second data signal which is the inverse of the first data signal and the first control signal. The data output buffer also includes a pull-up circuit responsive to the output of the first input circuit for selectively raising the data output node to a high voltage level, e.g., Vcc, and a pull-down circuit responsive to the output of the second input circuit for selectively lowering the data output node to a low voltage level, e.g., Vss. The data output buffer further includes a preset circuit comprised of a first preset control circuit responsive to the output of the first input circuit and a second control signal, e.g., an inverse output enable signal, for selectively raising the data output node from the low voltage level to an intermediate voltage level, e.g.

Abstract: A nonvolatile semiconductor memory device having a page program mode of operation. The device including a data input buffer for receiving program data from a data line and a plurality of program voltage generating circuits each of which is selectively operable for generating a program voltage output having a first and second logic level. The device further including a plurality of first selecting MOS transistors coupled to respective ones of the program voltage generating circuits and alternating ones of bit lines included in the memory device and a plurality of second selecting MOS transistors coupled to respective ones of the program voltage generating circuits and a second sequences of alternating one of the bit lines.

Abstract: An output buffer circuit for a byte wide memory is disclosed, including a circuit for delaying the falling or rising time of the gate voltage of a pull-up transistor of an output driver, located between a p-channel transistor and an n-channel transistor of the pull-up inverter; and a circuit for delaying the rising time of the gate voltage of a pull-down transistor of the output driver, located between a p-channel transistor and an n-channel transistor of the pull-down inverter. The disclosed delay circuits may include a depletion transistor having a gate and a source connected to each other. Through the provision of such delay mechanisms, the noise generations in both the power lines and the ground lines are reduced.

Abstract: A normal decoder and a redundant decoder having address program devices are used for the replacement of bad cells. The number of address program devices is one more than the number of input address bits for selecting a normal row or column. The input signals of the additional program device are complementary to the input signals of one of the other program devices. The program of the program devices have two steps to repair the faulty cells. To increase the reliability of redundancy, a nonvolatile memory element used in the program devices is a bridge connected four cell FLOTOX type nonvolatile memory device.