Patents by Inventor Hyung Mo BAE

Hyung Mo BAE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240318940
    Abstract: A multiple and broadband stealth structure comprises a radar absorption unit that absorbs broadband microwave, a low-frequency transmission filter unit that is stacked on an upper portion of the radar absorption unit, and an infrared radiation unit that is combined with the low-frequency transmission filter unit to selectively emit infrared ray, thereby selectively controlling the infrared emissivity of the surface to emit infrared radiation only through an atmospheric absorption window with a low infrared transmittance and to avoid the infrared detection system.
    Type: Application
    Filed: March 6, 2024
    Publication date: September 26, 2024
    Inventors: Hyung Hee CHO, Nam Kyu LEE, Joon Soo LIM, In Joong CHANG, Hyung Mo BAE, Ju Yeong NAM
  • Patent number: 12062833
    Abstract: A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad. In an example, the conductive pillar structure can extend from the first package body surface to the second package body surface, the elongated conductive beam structure can be disposed adjoining the first package body surface and can be electrically connected to the conductive pillar structure, and a portion of the elongated conductive beam structure can be exposed outside of the package body.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: August 13, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Mo Kim, Young Ju Lee
  • Publication number: 20230314677
    Abstract: Proposed is a 3-dimensional resonant structure-based infrared selective emitter capable of maximizing the infrared selective radiation function by broadening the emissivity in the non-detection bands with resonance phenomena between multiple resonator units at the same time as securing infrared camouflage and energy dissipation-resultant surface thermal stability by reducing the emissivity significantly in the infrared detection band and selectively dissipating energy to the non-detection bands.
    Type: Application
    Filed: April 5, 2023
    Publication date: October 5, 2023
    Inventors: Hyung Hee CHO, Nam Kyu LEE, Joon-Soo LIM, In Joong CHANG, Ju Yeong NAM, Hyung Mo BAE, Ji Hyeok KIM
  • Publication number: 20230221618
    Abstract: The present invention provides an infrared selective emitter in which since infrared energy can be emitted in a desired wavelength band by adjusting a metamaterial having a repeating structure on a plane, infrared camouflage is possible by attaching to the surface of the shape of an object to be camouflaged, and at the same time, the infrared selective emitter has flexible characteristics that can be applied to curved surfaces without limitations on the shape of an object.
    Type: Application
    Filed: December 22, 2022
    Publication date: July 13, 2023
    Applicant: UIF (University Industry Foundation), Yonsei University
    Inventors: Hyung Hee CHO, Namkyu LEE, Joon-Soo LIM, Injoong CHANG, Juyeong NAM, Hyung Mo BAE, Maroosol YUN