Abstract: Disclosed herein is a breaking apparatus for glass substrates. The breaking apparatus includes a breaking bar connected to a linear driver, a plurality of linear bushes longitudinally mounted on the breaking bar and each including an outer barrel, a plurality of buffer cylinders longitudinally mounted on the breaking bar, and a breaking tip extending in one direction and having a bar shape with a predetermined width. Each of the buffer cylinders includes a hollow cylinder body generating pressure therein, a piston received in the cylinder body, and a piston rod connected to the piston. The breaking tip is disposed in a longitudinal direction of the breaking bar beneath the breaking bar and connected to the piston rods and the shafts to be brought into contact with a glass substrate.

Abstract: A glass substrate laser cutting device according to the invention includes: a working table that has a plurality of vacuum absorbing grooves; a laser cutter; a pressure sensor that measures a pressure sensor when suctioning the glass substrate in a vacuum state; a calculation processing unit that compares the vacuum pressure measured by the pressure sensor with a predetermined threshold pressure and determines whether the glass substrate is broken; a laser cutter that includes a leaser head moving along the cutting direction of the glass substrate and emitting a laser beam; and an optical sensor that is attached to the laser head so as to move together and is disposed at a point in front of the laser beam emitted to the outside so as to detect the breakage of the glass substrate.

Abstract: Disclosed herein is a breaking apparatus for glass substrates. The breaking apparatus includes a breaking bar connected to a linear driver, a plurality of linear bushes longitudinally mounted on the breaking bar and each including an outer barrel, a plurality of buffer cylinders longitudinally mounted on the breaking bar, and a breaking tip extending in one direction and having a bar shape with a predetermined width. Each of the buffer cylinders includes a hollow cylinder body generating pressure therein, a piston received in the cylinder body, and a piston rod connected to the piston. The breaking tip is disposed in a longitudinal direction of the breaking bar beneath the breaking bar and connected to the piston rods and the shafts to be brought into contact with a glass substrate.

Abstract: A glass substrate laser cutting device according to the invention includes: a working table that has a plurality of vacuum absorbing grooves; a laser cutter; a pressure sensor that measures a pressure sensor when suctioning the glass substrate in a vacuum state; a calculation processing unit that compares the vacuum pressure measured by the pressure sensor with a predetermined threshold pressure and determines whether the glass substrate is broken; a laser cutter that includes a leaser head moving along the cutting direction of the glass substrate and emitting a laser beam; and an optical sensor that is attached to the laser head so as to move together and is disposed at a point in front of the laser beam emitted to the outside so as to detect the breakage of the glass substrate.

Abstract: Glass substrate cutting apparatuses using lasers are disclosed, where a laser cutting head is moved. A glass substrate cutting apparatus includes two parts for a laser cutting head: heavy laser beam generators fixed to respective ends of a gantry structure moving in parallel along two gantry stages located on either side of a cutting table, and relatively lightweight laser irradiation heads moving horizontally in parallel with the gantry structure. The glass substrate cutting apparatus includes a cutting table for maintaining a glass substrate in a horizontal state; biaxial gantry stages for moving a gantry structure along the cutting table; the gantry structure moving in between an upper part of the biaxial gantry stages; laser beam generators fixed to respective ends of the gantry structure for oscillating the laser; and laser irradiation heads that move horizontally on respective ends of the gantry structure and irradiate the laser upon the glass substrate.

Abstract: Disclosed herein are apparatuses for breaking a glass panel unified with a process table which break the glass panel formed with scribing lines along the scribing lines by irradiating laser beams. The apparatuses for breaking a glass panel unified with a process table to conduct breaking operations of the glass panel after scribing work of the glass panel as one body with the process table are installed on both sides of the process table included in a transfer-type cutting head laser cutting device. Each apparatus for breaking the glass panel unified with the process table comprises: breaking bars for cutting the glass panel by applying pressure to cutting sections of the glass panel; rotating devices for rotating the breaking bars by combining with both ends of the breaking bars; and a support equipped with cylinders for vertically moving the rotating devices in both sections.

Abstract: Disclosed herein are apparatuses for breaking a glass panel unified with a process table which break the glass panel formed with scribing lines along the scribing lines by irradiating laser beams. The apparatuses for breaking a glass panel unified with a process table to conduct breaking operations of the glass panel after scribing work of the glass panel as one body with the process table are installed on both sides of the process table included in a transfer-type cutting head laser cutting device. Each apparatus for breaking the glass panel unified with the process table comprises: breaking bars for cutting the glass panel by applying pressure to cutting sections of the glass panel; rotating devices for rotating the breaking bars by combining with both ends of the breaking bars; and a support equipped with cylinders for vertically moving the rotating devices in both sections.

Abstract: Glass substrate cutting apparatuses using lasers are disclosed, where a laser cutting head is moved. A glass substrate cutting apparatus includes two parts for a laser cutting head: heavy laser oscillation parts fixed to respective ends of a gantry structure moving in parallel along two gantry stages located on either side of a cutting table, and relatively lightweight laser irradiation heads moving horizontally in parallel with the gantry structure. The glass substrate cutting apparatus includes a cutting table for maintaining a glass substrate in a horizontal state; biaxial gantry stages for moving a gantry structure along the cutting table; the gantry structure moving in between an upper part of the biaxial gantry stages; laser oscillation parts fixed to respective ends of the gantry structure for oscillating the laser; and laser irradiation heads that move horizontally on respective ends of the gantry structure and irradiate the laser upon the glass substrate.