Patents by Inventor Hyung Sik Chung

Hyung Sik Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070187006
    Abstract: Disclosed is an elementally mixed Al—Cu—Zn base powder blend for a sintered Al base alloy. The powder blend includes more than 5.6 wt % and less than 9 wt % Cu, 1˜5 wt % Zn, and a balance Al. With the powder blend, an article of a sintered Al base alloy having higher wear resistance as well as higher tensile strength can be fabricated.
    Type: Application
    Filed: February 2, 2007
    Publication date: August 16, 2007
    Applicant: AJOU UNIVERSITY INDUSTRY COOPERATION FOUNDATION
    Inventors: HYUNG SIK CHUNG, JAE HWAN AHN, SUNG KYU LEE, MOON TAE KIM, JUNG HO CHOI
  • Patent number: 6346181
    Abstract: Disclosed is an Ni-plated layer of biaxial texture, which is formed by electroplating. In the Ni-plated layer,peaks measured on a &thgr;-rocking curve have a FWHM of 7° or less in terms of the misorientation on the c-axis; and peaks measured on &phgr;-scan have a FWHM of 21° or less in terms of the misorientation on the plane formed by the a-axis and the b-axis. Also, a process of electroplating a Ni layer are disclosed. The process comprises forming a Ni-plated layer of biaxial texture under a magnetic field by electroplating and subjecting the Ni-plated layer to thermal treatment to develop the biaxial texture. This electroplating process is expected to give a significant contribution to the development of the electroplating technology and to replace the vacuum deposition used for the preparation of thin film magnetic materials or thin film piezoelectric materials.
    Type: Grant
    Filed: May 16, 2000
    Date of Patent: February 12, 2002
    Assignee: Korea Institute of Machinery and Materials
    Inventors: Kyu Hwan Lee, Hyung-Sik Chung, Sang Ro Lee, Doyon Chang, Yongsoo Jeong, Jaimoo Yoo, Jae-Woong Ko, Hai-Doo Kim
  • Patent number: 6209190
    Abstract: A process for producing Bi-2223 high Tc superconductor in which fine MgO particles (<0.1 &mgr;m) are homogeneously distributed to provide flux pinning centers in Bi-2223 high Tc superconductor in order to give enhanced critical current density under magnetic field, as compared to the Bi-2223 high Tc superconductor without MgO dispersion, when processed under similar conditions. The process comprises mixing partially converted Bi-2223 powder and MgO fine particles, drying to give mixed powder, filling in silver tube, drawing, rolling and heat-treating at a temperature and for a time sufficient to form Bi-2223 high Tc superconductor in which fine MgO particles are homogeneously distributed.
    Type: Grant
    Filed: May 3, 1996
    Date of Patent: April 3, 2001
    Assignee: The Korea Institute of Machinery & Materials
    Inventors: Hyung Sik Chung, Hai Doo Kim, Jae Woong Ko
  • Patent number: 5722037
    Abstract: There is provided a process for producing titanium composite, comprising the steps of: molding titanium powder, titanium alloy powder, or powder comprising titanium into a certain shape by a cold isostatic press or cold press; reacting the shape with hydrocarbon gas at its decomposition temperature or higher, to form TiC therein; and providing the shape with high density by vacuum sintering, hot isostatic pressing, hot forging, hot rolling and/or the combinations thereof. TiC a reinforcing material, is in-situ formed by reacting a cold-pressed body of the powder with hydrocarbon gas and cleaner than the externally added one and distributed more uniformly and finely in the Ti matrix, leading to a significant improvement in wear resistance and high temperature property.
    Type: Grant
    Filed: May 9, 1996
    Date of Patent: February 24, 1998
    Assignee: Korea Institute of Machinery & Materials
    Inventors: Hyung-Sik Chung, Yong-Jin Kim, Byung-Kee Kim, Jian-Qing Jiang