Abstract: A method of operating a memory device may include: providing a first power supply voltage to a sense amplifier during a first time interval, the first time interval being between a first time at which a voltage is provided to a first bit line, and a second time at which a pre-charge command is received; and providing a second power supply voltage to the sense amplifier during a second time interval, during which the word line is enabled after the pre-charge command is received. The second power supply voltage may be greater than the first power supply voltage.

Abstract: A semiconductor memory device is provided which includes a sense amplifier, a bit line connected to a plurality of memory cells of a first memory block, a complementary bit line connected to a plurality of memory cells of a second memory block, a first switch configured to connect the bit line to the sense amplifier, and a second switch configured to connect the complementary bit line to the sense amplifier. The first switch is configured to electrically separate the bit line from the sense amplifier when the second memory block performs a refresh operation.

Abstract: A bit-line sense amplifier may include a pull-up driving circuit, a pull-down driving circuit and a latch-type sense amplifier. The pull-up driving circuit including a plurality of PMOS transistors connected between a power supply voltage line and a first driving power supply line, and may be configured to provide a first driving current on the first driving power supply line in response to an up control signal. The pull-down driving circuit may be configured to provide a second driving current on a second driving power supply line in response to a down control signal. The latch-type sense amplifier may be connected between the first driving power supply line and the second driving power supply line, and may be configured to sense and amplify a voltage difference between a bit line and a complementary bit line.

Abstract: A method of operating a memory device may include: providing a first power supply voltage to a sense amplifier during a first time interval, the first time interval being between a first time at which a voltage is provided to a first bit line, and a second time at which a pre-charge command is received; and providing a second power supply voltage to the sense amplifier during a second time interval, during which the word line is enabled after the pre-charge command is received. The second power supply voltage may be greater than the first power supply voltage.

Abstract: A bit-line sense amplifier may include a pull-up driving circuit, a pull-down driving circuit and a latch-type sense amplifier. The pull-up driving circuit including a plurality of PMOS transistors connected between a power supply voltage line and a first driving power supply line, and may be configured to provide a first driving current on the first driving power supply line in response to an up control signal. The pull-down driving circuit may be configured to provide a second driving current on a second driving power supply line in response to a down control signal. The latch-type sense amplifier may be connected between the first driving power supply line and the second driving power supply line, and may be configured to sense and amplify a voltage difference between a bit line and a complementary bit line.

Abstract: A semiconductor memory device is provided which includes a sense amplifier, a bit line connected to a plurality of memory cells of a first memory block, a complementary bit line connected to a plurality of memory cells of a second memory block, a first switch configured to connect the bit line to the sense amplifier, and a second switch configured to connect the complementary bit line to the sense amplifier. The first switch is configured to electrically separate the bit line from the sense amplifier when the second memory block performs a refresh operation.

Abstract: In an embodiment, an improved charge pump circuit is provided to control a threshold voltage increase of a charge transmission transistor during a charge transfer period, and to prevent a latch-up generation during a charge non-transfer period. A charge transmission transistor transmits the voltage of a boosting node to a high voltage generation terminal in response to the voltage of a control node. In a bulk connection switch, during the charge transfer period the high voltage generation terminal is connected to the bulk of the charge transmission transistor and during the charge non-transfer period the bulk is connected to the low voltage, being lower than that of the voltage appearing at the boosting node of the charge transmission transistor or the high voltage generation terminal. Charge transmission efficiency and pumping operation reliability are improved, increasing the reliability of data access operations in a semiconductor memory device, for example.

Abstract: An anti-fuse circuit includes an anti-fuse device and an electric field control unit. The anti-fuse device is formed having a MOS structure including a first junction, a second junction and a gate terminal. The electric field control unit performs a control operation so that an electric field is formed in the anti-fuse device at the time of an anti-fusing operation. Electric fields formed at the first and second junctions of the anti-fuse device are separately controlled, so that breakdown can occur at two points. Further, the gate terminal of the anti-fuse device is implemented in the form of a band-shaped closed circuit.

Abstract: In an embodiment, an improved charge pump circuit is provided to control a threshold voltage increase of a charge transmission transistor during a charge transfer period, and to prevent a latch-up generation during a charge non-transfer period. A charge transmission transistor transmits the voltage of a boosting node to a high voltage generation terminal in response to the voltage of a control node. In a bulk connection switch, during the charge transfer period the high voltage generation terminal is connected to the bulk of the charge transmission transistor and during the charge non-transfer period the bulk is connected to the low voltage, being lower than that of the voltage appearing at the boosting node of the charge transmission transistor or the high voltage generation terminal. Charge transmission efficiency and pumping operation reliability are improved, increasing the reliability of data access operations in a semiconductor memory device, for example.