Abstract: A method of producing a glass structure includes forming a green body having an inner layer of a first powder of a first glass composition in a first organic material matrix and an outer layer of a second powder of a second glass composition in a second organic material matrix, the outer layer covering at least two opposing major surfaces or all surfaces of the inner layer, the first glass composition being different from the second glass composition, the first and second powders having respective first and second sintering temperatures, the second sintering temperature being within 0 to 30° C. of the first sintering temperature; and debinding and sintering the green body to remove the organic materials and to sinter together the first and second glass powders to produce a sintered glass structure having an inner layer of the first glass composition and an outer layer of the second glass composition.

Abstract: A laminate can comprise an oxide disposed over a first major surface of a substrate. The oxide layer can comprise a thickness of about 40 nanometers or less. The oxide layer can comprise oxygen and a first element. The first element can comprise at least one of titanium, tantalum, silicon, or aluminum. The oxide layer can comprise an atomic ratio of oxygen to the another element of about 1.5 or less. The laminate can comprise a peel strength between the substrate and the oxide layer of about 1.3 Newtons per centimeter or more. Methods of making a laminate can comprise providing a substrate comprising a first major surface and depositing an oxide layer over the first major surface of the substrate by sputtering from an elemental target comprising an another element in an oxygen environment.

Abstract: Provided is a glass-glass laminate. The glass-glass laminate includes a lower glass layer, an adhesive layer on the lower glass layer, an upper glass layer on the adhesive layer, and a decoration layer between the lower glass layer and the adhesive layer or between the upper glass layer and the adhesive layer, in which the adhesive layer includes a room-temperature adhesive material.

Abstract: Disclosed are glass-glass laminates. A glass-glass laminate includes: a lower glass layer; an adhesive layer on the lower glass layer; an upper glass layer on the adhesive layer; and a decoration layer between the lower glass layer and the adhesive layer or between the upper glass layer and the adhesive layer, wherein the thickness of the upper glass layer is less than the thickness of the lower glass layer, and the thermal expansion coefficient of the upper glass layer is less than the thermal expansion coefficient of the lower glass layer.

Abstract: A method of producing a glass structure includes forming a green body having an inner layer of a first powder of a first glass composition in a first organic material matrix and an outer layer of a second powder of a second glass composition in a second organic material matrix, the outer layer covering at least two opposing major surfaces or all surfaces of the inner layer, the first glass composition being different from the second glass composition, the first and second powders having respective first and second sintering temperatures, the second sintering temperature being within 0 to 30° C. of the first sintering temperature; and debinding and sintering the green body to remove the organic materials and to sinter together the first and second glass powders to produce a sintered glass structure having an inner layer of the first glass composition and an outer layer of the second glass composition.

Abstract: Disclosed herein are light guide plates (100) comprising a transparent substrate (110) having an edge surface, a light emitting first major surface, and an opposing second major surface; and a polymeric film (120) disposed on the second major surface of the transparent substrate, wherein the polymeric film comprises a plurality of microstructures (130) patterned with a plurality of light extraction features (135). At least one light source may be coupled to the edge surface of the transparent substrate. Display and lighting devices comprising such light guide plates are further disclosed, as well as methods for manufacturing such light guide plates.

Abstract: The present invention relates to a substrate for color conversion, a manufacturing method therefor, and a display device comprising the same and, more specifically, to a substrate for color conversion for not only securing the long-term stability of quantum dots but also exhibiting excellent color conversion efficiency, a manufacturing method therefor, and a display device comprising the same. To this end, the present invention provides a substrate for color conversion, a manufacturing method therefor, and a display device, the substrate for color conversion comprising: a thin plate glass; a coating layer for quantum dots formed on one surface of the thin plate glass; a light guide plate disposed to face the coating layer for quantum dots, a light emitting diode being disposed on the sides thereof; and a sealing material which is formed between the thin plate glass and the light guide plate and which blocks the coating layer for quantum dots from the outside.

Abstract: The present invention relates to a method for manufacturing a light-emitting diode package, and more specifically to a method for manufacturing a light-emitting diode package that does not need an additional color conversion frit heat-treatment process and cutting process after bonding between the color conversion frit and a light-emitting diode chip. To this end, the present invention provides a method for manufacturing a light-emitting diode package characterized in that the present invention comprises: a color conversion frit formation step for forming a color conversion frit in which phosphor is included on a substrate; a color conversion frit transcription step for transcribing the color conversion frit formed on the substrate from the substrate to a transcription film; and a color conversion frit bonding step for bonding the color conversion frit transcribed on the transcription film onto a light-emitting diode package.

Abstract: The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-conversion substrate of a light-emitting diode capable of completely protecting the quantum dots (QDs) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate.

Abstract: The present invention relates to a substrate for an integrated circuit package and, more specifically, to a substrate for an integrated circuit package, which reduces mismatch of coefficients of thermal expansion with a semiconductor chip, thereby preventing or minimizing warpage during a reflow process.

Abstract: The present invention relates to a substrate for changing the color of a light emitting diode and a method for producing same and, more particularly, to a substrate for changing the color of a light emitting diode and a method for producing same, wherein the substrate may be hermetically sealed so that quantum dots (QD) contained inside may be completely protected from the outside and emission efficiency of the light emitting diode may be enhanced.

Abstract: The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-converting substrate of a light-emitting diode capable of completely protecting the quantum dots (QD) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate.

Abstract: The present invention relates to a substrate for color conversion, a manufacturing method therefor, and a display device comprising the same and, more specifically, to a substrate for color conversion for not only securing the long-term stability of quantum dots but also exhibiting excellent color conversion efficiency, a manufacturing method therefor, and a display device comprising the same. To this end, the present invention provides a substrate for color conversion, a manufacturing method therefor, and a display device, the substrate for color conversion comprising: a thin plate glass; a coating layer for quantum dots formed on one surface of the thin plate glass; a light guide plate disposed to face the coating layer for quantum dots, a light emitting diode being disposed on the sides thereof; and a sealing material which is formed between the thin plate glass and the light guide plate and which blocks the coating layer for quantum dots from the outside.

Abstract: The present invention relates to a substrate for an integrated circuit package and, more specifically, to a substrate for an integrated circuit package, which reduces mismatch of coefficients of thermal expansion with a semiconductor chip, thereby preventing or minimizing warpage during a reflow process.

Abstract: The present invention relates to a substrate for the color conversion of a light-emitting diode and a manufacturing method therefor and, more specifically, to a substrate for the color conversion of a light-emitting diode and a manufacturing method therefor, which enable a quantum dot (QD) and a structure, in which the QD is supported, to have a color conversion function for implementing white light.

Abstract: The present invention relates to a method for manufacturing a light-emitting diode package, and more specifically to a method for manufacturing a light-emitting diode package that does not need an additional colour conversion frit heat-treatment process and cutting process after bonding between the colour conversion frit and a light-emitting diode chip. To this end, the present invention provides a method for manufacturing a light-emitting diode package chatacterized in that the present invention comprises: a colour conversion frit formation step for forming a colour conversion frit in which phosphor is included on a substrate; a colour conversion frit transcription step for transcribing the colour conversion frit formed on the substrate from the substrate to a transcription film; and a colour conversion frit bonding step for bonding the colour conversion frit transcribed on the transcription film onto a light-emitting diode package.

Abstract: The present invention relates to a substrate for changing the color of a light emitting diode and a method for producing same and, more particularly, to a substrate for changing the color of a light emitting diode and a method for producing same, wherein the substrate may be hermetically sealed so that quantum dots (QD) contained inside may be completely protected from the outside and emission efficiency of the light emitting diode may be enhanced. Thus, the present invention provides a substrate for changing the color of a light emitting diode, and a method for producing same, wherein the substrate is characterized by including: a first glass substrate disposed on the light emitting diode; a second glass substrate formed opposite to the first substrate; a structure which is disposed between the first substrate and the second substrate, has hollows, and includes a material having a coefficient of thermal expansion (CTE) of 30-80×10?7/° C.

Abstract: The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-conversion substrate of a light-emitting diode capable of completely protecting the quantum dots (QDs) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate.

Abstract: The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-converting substrate of a light-emitting diode capable of completely protecting the quantum dots (QD) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate.