Patents by Inventor Hyung Soo Yoon
Hyung Soo Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11942162Abstract: A method for operating a memory device is provided. The method includes providing a high voltage signal to a memory cell array including a plurality of memory cells using a first wiring, providing a logic signal to the memory cell array using a second wiring, and providing a shielding signal to the memory cell array using a third wiring arranged between the first wiring and the second wiring. A highest voltage level of the logic signal is lower than a highest voltage level of the high voltage signal, and the shielding signal includes a negative first voltage level in a first mode and a positive second voltage level in a second mode.Type: GrantFiled: May 4, 2022Date of Patent: March 26, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyung Soo Kim, Dae Han Kim, Jong Min Kim, Myoung Won Yoon
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Patent number: 11466838Abstract: Provided are a multi-flexible display device having improved image discontinuity at a panel boundary, and a method of manufacturing a double-sided reflector therefor. An image discontinuity phenomenon at a boundary between panels of a multi-flexible display device manufactured by tiling a plurality of flexible displays including a bendable panel may be easily and simply ameliorated using a double-sided reflector capable of being manufactured through a simple process and at low cost.Type: GrantFiled: February 4, 2020Date of Patent: October 11, 2022Assignee: Seoul National University R&DB FoundationInventors: Yongtaek Hong, Seung Hwan Lee, Hyung Soo Yoon, Byoung Ho Lee, Chan Hyung Yoo, Dong Yeon Kim
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Publication number: 20200331220Abstract: The present invention relates to a method for manufacturing an aspherical optical member. Compared with conventional cutting-type or drawing-type optical member manufacturing technology, the present invention can mass-produce an aspherical optical member at a low cost by using a simple stacking method, and can manufacture the aspherical optical member without changing a conventional process line.Type: ApplicationFiled: March 29, 2018Publication date: October 22, 2020Applicant: Seoul National University R&DB FoundationInventors: Yong Taek HONG, Byoung Ho LEE, Seung Jae LEE, Chan Hyung YOO, Hyung Soo YOON, Seung Hwan LEE
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Publication number: 20200271835Abstract: Provided are a multi-flexible display device having improved image discontinuity at a panel boundary, and a method of manufacturing a double-sided reflector therefor. An image discontinuity phenomenon at a boundary between panels of a multi-flexible display device manufactured by tiling a plurality of flexible displays including a bendable panel may be easily and simply ameliorated using a double-sided reflector capable of being manufactured through a simple process and at low cost.Type: ApplicationFiled: February 4, 2020Publication date: August 27, 2020Applicant: Seoul National University R&DB FoundationInventors: Yongtaek HONG, Seung Hwan LEE, Hyung Soo YOON, Byoung Ho LEE, Chan Hyung YOO, Dong Yeon KIM
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Patent number: 8643029Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.Type: GrantFiled: March 29, 2011Date of Patent: February 4, 2014Assignee: Seoul Opto Device Co., Ltd.Inventors: Chung Hoon Lee, Lacroix Yves, Hyung Soo Yoon, Young Ju Lee
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Patent number: 8536612Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.Type: GrantFiled: June 3, 2011Date of Patent: September 17, 2013Assignee: Seoul Opto Device Co., Ltd.Inventors: Chung Hoon Lee, Lacroix Yves, Hyung Soo Yoon, Young Ju Lee
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Patent number: 8227272Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.Type: GrantFiled: June 10, 2009Date of Patent: July 24, 2012Assignee: Seoul Opto Device Co., Ltd.Inventors: Chung Hoon Lee, Lacroix Yves, Hyung Soo Yoon, Young Ju Lee
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Patent number: 8183592Abstract: A light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.Type: GrantFiled: September 21, 2011Date of Patent: May 22, 2012Assignee: Seoul Opto Device Co., Ltd.Inventors: Chung Hoon Lee, Lacroix Yves, Hyung Soo Yoon, Young Ju Lee
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Publication number: 20120091478Abstract: A light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.Type: ApplicationFiled: September 21, 2011Publication date: April 19, 2012Applicant: SEOUL OPTO DEVICE CO., LTD.Inventors: Chung Hoon LEE, Lacroix YVES, Hyung Soo YOON, Young Ju LEE
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Publication number: 20110233574Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.Type: ApplicationFiled: June 3, 2011Publication date: September 29, 2011Applicant: SEOUL OPTO DEVICE CO., LTD.Inventors: Chung Hoon LEE, Lacroix YVES, Hyung Soo YOON, Young Ju LEE
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Publication number: 20110175129Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.Type: ApplicationFiled: March 29, 2011Publication date: July 21, 2011Applicant: SEOUL OPTO DEVICE CO., LTD.Inventors: Chung Hoon LEE, Lacroix YVES, Hyung Soo YOON, Young Ju LEE
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Patent number: 7842959Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.Type: GrantFiled: June 18, 2010Date of Patent: November 30, 2010Assignee: Seoul Opto Device Co., Ltd.Inventors: Chung Hoon Lee, Lacroix Yves, Hyung Soo Yoon, Young Ju Lee
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Patent number: 7838891Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.Type: GrantFiled: April 23, 2010Date of Patent: November 23, 2010Assignee: Seoul Opto Device Co., Ltd.Inventors: Chung Hoon Lee, Lacroix Yves, Hyung Soo Yoon, Young Ju Lee
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Publication number: 20100244060Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.Type: ApplicationFiled: June 18, 2010Publication date: September 30, 2010Applicant: Seoul Opto Device Co., Ltd.Inventors: Chung Hoon LEE, Lacroix Yves, Hyung Soo Yoon, Young Ju Lee
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Publication number: 20100193808Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.Type: ApplicationFiled: April 23, 2010Publication date: August 5, 2010Applicant: Seoul Opto Device Co., Ltd.Inventors: Chung Hoon LEE, Lacroix Yves, Hyung Soo Yoon, Young Ju Lee
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Patent number: 7723736Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.Type: GrantFiled: October 25, 2005Date of Patent: May 25, 2010Assignee: Seoul Opto Device Co., Ltd.Inventors: Chung Hoon Lee, Lacroix Yves, Hyung Soo Yoon, Young Ju Lee
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Publication number: 20090272971Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.Type: ApplicationFiled: June 10, 2009Publication date: November 5, 2009Applicant: SEOUL OPTO DEVICE CO., LTD.Inventors: Chung Hoon LEE, Lacroix Yves, Hyung Soo Yoon, Young Ju Lee
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Publication number: 20080087902Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.Type: ApplicationFiled: October 25, 2005Publication date: April 17, 2008Applicant: SEOUL OPTO DEVICE CO., LTD.Inventors: Chung Hoon Lee, Lacroix Yves, Hyung Soo Yoon, Young Ju Lee