Patents by Inventor Hyungsuk Yu

Hyungsuk Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11568949
    Abstract: A method of testing a semiconductor package including a plurality of semiconductor chips includes sensing electrical signals respectively output from a plurality of semiconductor chip groups each representing a combination of at least two semiconductor chips among the plurality of semiconductor chips, obtaining amplitudes of electrical signals respectively output from the plurality of semiconductor chips based on the plurality of sensed electrical signals, and outputting a test result for the semiconductor package by using the plurality of obtained electrical signals.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: January 31, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyungsuk Yu, Hyukje Kwon, Jisoo Choi
  • Publication number: 20210265000
    Abstract: A method of testing a semiconductor package including a plurality of semiconductor chips includes sensing electrical signals respectively output from a plurality of semiconductor chip groups each representing a combination of at least two semiconductor chips among the plurality of semiconductor chips, obtaining amplitudes of electrical signals respectively output from the plurality of semiconductor chips based on the plurality of sensed electrical signals, and outputting a test result for the semiconductor package by using the plurality of obtained electrical signals.
    Type: Application
    Filed: September 11, 2020
    Publication date: August 26, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hyungsuk Yu, Hyukje Kwon, Jisoo Choi