Abstract: A semiconductor package includes a semiconductor chip comprising a first surface and a second surface, a redistribution layer on the first surface of the semiconductor chip, an under bump metal (UBM) layer on the redistribution layer, and a solder bump on the UBM layer, and the solder bump covers both outer side surfaces of the UBM layer.

Abstract: A semiconductor package includes a semiconductor chip comprising a first surface and a second surface, a redistribution layer on the first surface of the semiconductor chip, an under bump metal (UBM) layer on the redistribution layer, and a solder bump on the UBM layer, and the solder bump covers both outer side surfaces of the UBM layer.

Abstract: The present disclosure relates to an omnidirectional sensor fusion system and method and a vehicle including the same. The omnidirectional sensor fusion system includes a sensor track processing unit configured to receive recognition information from one or more sensors to generate a sensor track, a sensor track association determination unit configured to determine, based on the generated sensor track being located at an overlapping point of sensing regions of the one or more sensors, an association between a previous sensor fusion track and the sensor track, the sensor track association determination unit further configured to change sensor track information in response to the determined association and output a sensor fusion track, a sensor fusion track tracing unit configured to trace the output sensor fusion track, and a sensor fusion track maintenance unit configured to maintain the traced sensor fusion track.

Abstract: The present disclosure provides an apparatus for associating sensor data in a vehicle. The apparatus includes a plurality of sensors configured to sense an external object and a processor configured to be electrically connected with the plurality of sensors. The processor is configured to obtain a sensor data set for a target located around the vehicle using the plurality of sensors, select at least a portion of sensor data included in the sensor data set based on at least one of target information, a curvature of a road where the vehicle or the target is traveling, or a type of a sensor configured to sense the target, and generate track data for the target by associating at least the portion of the sensor data.

Abstract: Disclosed are an occupancy distance map (ODM) information reliability determination system and method and a vehicle using the same. The system includes a signal conversion unit configured to receive a plurality of sensing signals and to perform signal processing, a calculation unit configured to calculate state information of a nearby vehicle detected from processed signals, a sensor fusion track output unit configured to output sensor fusion track information based on the calculated state information of the nearby vehicle, an ODM output unit configured to output ODM information based on the calculated state information of the nearby vehicle, an ODM fusion unit configured to generate sensor fusion ODM information by performing sensor fusion with respect to the ODM information, and an ODM information reliability determination unit configured to determine reliability of the sensor fusion ODM information by confirming association between the sensor fusion track information and the sensor fusion ODM information.

Abstract: An apparatus and method for identifying a short cut-in vehicle, and a vehicle using the same are disclosed. The apparatus includes a signal conversion unit configured to receive and signal-process a plurality of sensing signals, a computation unit configured to compute state information of a surrounding vehicle detected from the signal-processed signal, a sensor fusion track output unit configured to output a sensor fusion track based on the computed state information of the surrounding vehicle, an occupancy distance map (ODM) output unit configured to output ODM information including a grid map corresponding to a vehicle detection region and an ODM object including a plurality of detection points based on the computed state information of the surrounding vehicle, and a cut-in vehicle identification unit configured to identify a cut-in vehicle based on the output sensor fusion track and ODM information.

Abstract: Disclosed are a vehicle and an engine control method for more conveniently restarting an engine in the state in which a function of automatically turning off the engine is activated during braking for improving fuel efficiency. The engine control method includes turning off an engine through an idle stop and go (ISG) system during braking due to manipulation of a brake pedal, determining whether at least one preset starting condition is satisfied based on information on a forward environment, and turning on the engine irrespective of whether manipulation of the brake pedal is released when any one of the at least one starting condition is satisfied.

Abstract: Disclosed are a vehicle and an engine control method for more conveniently restarting an engine in the state in which a function of automatically turning off the engine is activated during braking for improving fuel efficiency. The engine control method includes turning off an engine through an idle stop and go (ISG) system during braking due to manipulation of a brake pedal, determining whether at least one preset starting condition is satisfied based on information on a forward environment, and turning on the engine irrespective of whether manipulation of the brake pedal is released when any one of the at least one starting condition is satisfied.

Abstract: A semiconductor package includes a semiconductor chip comprising a first surface and a second surface, a redistribution layer on the first surface of the semiconductor chip, an under bump metal (UBM) layer on the redistribution layer, and a solder bump on the UBM layer, and the solder bump covers both outer side surfaces of the UBM layer.

Abstract: A semiconductor package includes a semiconductor chip comprising a first surface and a second surface, a redistribution layer on the first surface of the semiconductor chip, an under bump metal (UBM) layer on the redistribution layer, and a solder bump on the UBM layer, and the solder bump covers both outer side surfaces of the UBM layer.

Abstract: A semiconductor package includes a semiconductor chip comprising a first surface and a second surface, a redistribution layer on the first surface of the semiconductor chip, an under bump metal (UBM) layer on the redistribution layer, and a solder bump on the UBM layer, and the solder bump covers both outer side surfaces of the UBM layer.

Abstract: Disclosed are an occupancy distance map (ODM) information reliability determination system and method and a vehicle using the same. The system includes a signal conversion unit configured to receive a plurality of sensing signals and to perform signal processing, a calculation unit configured to calculate state information of a nearby vehicle detected from processed signals, a sensor fusion track output unit configured to output sensor fusion track information based on the calculated state information of the nearby vehicle, an ODM output unit configured to output ODM information based on the calculated state information of the nearby vehicle, an ODM fusion unit configured to generate sensor fusion ODM information by performing sensor fusion with respect to the ODM information, and an ODM information reliability determination unit configured to determine reliability of the sensor fusion ODM information by confirming association between the sensor fusion track information and the sensor fusion ODM information.

Abstract: An apparatus and method for identifying a short cut-in vehicle, and a vehicle using the same are disclosed. The apparatus includes a signal conversion unit configured to receive and signal-process a plurality of sensing signals, a computation unit configured to compute state information of a surrounding vehicle detected from the signal-processed signal, a sensor fusion track output unit configured to output a sensor fusion track based on the computed state information of the surrounding vehicle, an occupancy distance map (ODM) output unit configured to output ODM information including a grid map corresponding to a vehicle detection region and an ODM object including a plurality of detection points based on the computed state information of the surrounding vehicle, and a cut-in vehicle identification unit configured to identify a cut-in vehicle based on the output sensor fusion track and ODM information.

Abstract: The present disclosure relates to an omnidirectional sensor fusion system and method and a vehicle including the same. The omnidirectional sensor fusion system includes a sensor track processing unit configured to receive recognition information from one or more sensors to generate a sensor track, a sensor track association determination unit configured to determine, based on the generated sensor track being located at an overlapping point of sensing regions of the one or more sensors, an association between a previous sensor fusion track and the sensor track, the sensor track association determination unit further configured to change sensor track information in response to the determined association and output a sensor fusion track, a sensor fusion track tracing unit configured to trace the output sensor fusion track, and a sensor fusion track maintenance unit configured to maintain the traced sensor fusion track.

Abstract: A semiconductor package includes a semiconductor chip comprising a first surface and a second surface, a redistribution layer on the first surface of the semiconductor chip, an under bump metal (UBM) layer on the redistribution layer, and a solder bump on the UBM layer, and the solder bump covers both outer side surfaces of the UBM layer.

Abstract: An apparatus and a method are capable of accurately deciding a maneuver of a surrounding vehicle. The apparatus includes a first surrounding vehicle information detector configured to obtain first surrounding vehicle information for a surrounding vehicle of a vehicle by using a front radar device. The apparatus further includes a second surrounding vehicle information detector configured to obtain second surrounding vehicle information for the surrounding vehicle by using a corner radar device. The apparatus also includes a processor configured to decide a motion of the surrounding vehicle by using the first surrounding vehicle information and the second surrounding vehicle information. The processor is also configured to decide a maneuver of the surrounding vehicle by using maneuver decision logic derived by a mechanical training technique. The processor is further configured to decide a final maneuver of the surrounding vehicle by using the two decision results.

Abstract: An apparatus and a method are capable of accurately deciding a maneuver of a surrounding vehicle. The apparatus includes a first surrounding vehicle information detector configured to obtain first surrounding vehicle information for a surrounding vehicle of a vehicle by using a front radar device. The apparatus further includes a second surrounding vehicle information detector configured to obtain second surrounding vehicle information for the surrounding vehicle by using a corner radar device. The apparatus also includes a processor configured to decide a motion of the surrounding vehicle by using the first surrounding vehicle information and the second surrounding vehicle information. The processor is also configured to decide a maneuver of the surrounding vehicle by using maneuver decision logic derived by a mechanical training technique. The processor is further configured to decide a final maneuver of the surrounding vehicle by using the two decision results.

Abstract: The present disclosure provides an apparatus for associating sensor data in a vehicle. The apparatus includes a plurality of sensors configured to sense an external object and a processor configured to be electrically connected with the plurality of sensors. The processor is configured to obtain a sensor data set for a target located around the vehicle using the plurality of sensors, select at least a portion of sensor data included in the sensor data set based on at least one of target information, a curvature of a road where the vehicle or the target is traveling, or a type of a sensor configured to sense the target, and generate track data for the target by associating at least the portion of the sensor data.

Abstract: Provided are a semiconductor package and method for manufacturing the same. The semiconductor package includes a first semiconductor chip. A first mold layer is disposed on sidewalls of the first semiconductor chip. A second mold layer is disposed on an upper surface of the first mold layer. A first lower via hole penetrates the first mold layer. A first upper via hole penetrates the second mold layer. A first metal pad is disposed between the first upper via hole and the first lower via hole.

Abstract: A semiconductor package and a method for manufacturing the same are provided. The semiconductor package includes a semiconductor chip having a first surface, a second surface and a pixel area, first adhesion patterns disposed on the first surface, second adhesion patterns disposed between the first adhesion patterns and the pixel area and disposed on the first surface, and external connection terminals disposed on the second surface, wherein the second adhesion patterns and the external connection terminals are disposed to overlap each other.