Abstract: A digital exposure system according to an exemplary embodiment of the present invention includes a light source that radiates light onto a substrate, a digital mirror device that forms a two-dimensional pattern image by selectively transmitting light emitted from the light source, an optical system that modulates the two-dimensional pattern image into a one-dimensional pattern image, and a substrate scanner that adjusts the position of the substrate to continuously project the one-dimensional pattern image onto a photosensitive layer on the substrate for scan exposure, and the two-dimensional pattern image has a uniform image in a direction parallel with a scan direction for the substrate and has an image of a target pattern in a direction perpendicular to the scan direction for the substrate.

Abstract: A method for laser-cutting and post-treating a UTG having a partial coating film formed thereon according to the present invention includes a step (S1) of coating an entire front surface of a thin-film mother glass (1) with a coating solution for preventing chemical contact, and then drying the resulting product to form a coating film, a step (S2) of forming, on a rear surface of the thin-film mother glass (1), a partial coating film (2) which is the same shape as the shape of a cell-unit thin-film glass (3) to be cut from the thin-film mother glass (1), and a step (S3) of irradiating the rear surface of the thin-film mother glass (1) with a laser beam to cut the coating film, formed on a front surface of the thin-film mother glass (1), and the thin-film mother glass (1), wherein the laser beam is applied along a cut guiding line (6) formed a predetermined distance away from an outer edge line of the partial coating film (2) and in the shape of the cell-unit thin-film glass (3), to cut and then separate the c

Abstract: A method for ablating a coating film, cutting glass, and performing post-treatment by using a laser according to the present invention includes coating one side or both sides of thin mother glass with a coating solution for preventing chemical contact in order to proceed with selective chemical treatment, drying the coating solution to form a coating film on one side or both sides of the thin mother glass, obtaining thin-film glasses in cell units applied to electrical and electronic products from the thin mother glass, healing a laser-cut surface of the cut thin-film glasses in cell units through selective chemical treatment of the cut thin-film glasses in cell units, cleaning the thin-film glasses in cell units, and then ablating all of a coating film formed on a surface of the thin-film glasses in cell units, and cleaning the thin-film glasses in cell units from which all of the coating film has been ablated and then chemically healing the surface of the thin-film glasses in cell units in order to eliminat

Abstract: A potassium nitrate level detection sensing module M in a strengthening furnace according to the present invention includes a level detection means, which is installed inside a glass strengthening furnace, installed at a height equal to a level line of strengthening liquid to be filled in the strengthening furnace F, and generates an electrical signal having a set threshold or more or an electrical signal having the set threshold or less when it comes into contact with the strengthening liquid and detects that the strengthening liquid filled in the glass strengthening furnace F has reached a set strengthening liquid level line. The potassium nitrate level detection sensing module in the strengthening furnace according to the present invention having such a configuration can automatically identify that potassium nitrate in a liquid state, which is melted in the strengthening furnace, has reached the set level line in the strengthening furnace.

Abstract: A potassium nitrate level detection sensing module M in a strengthening furnace according to the present invention includes a level detection means, which is installed inside a glass strengthening furnace, installed at a height equal to a level line of strengthening liquid to be filled in the strengthening furnace F, and generates an electrical signal having a set threshold or more or an electrical signal having the set threshold or less when it comes into contact with the strengthening liquid and detects that the strengthening liquid filled in the glass strengthening furnace F has reached a set strengthening liquid level line. The potassium nitrate level detection sensing module in the strengthening furnace according to the present invention having such a configuration can automatically identify that potassium nitrate in a liquid state, which is melted in the strengthening furnace, has reached the set level line in the strengthening furnace.

Abstract: An electro-optic device and a method for manufacturing the same. The method includes forming a bottom electrode on a substrate, forming a first insulation film crossing over the bottom electrode, forming an organic film on the substrate, forming a top electrode film on the organic film, and forming a top electrode that crosses the bottom electrode by laser-scribing the top electrode film. Herein, forming the top electrode by laser-scribing may position a bottom edge of the top electrode along an upper side of the first insulation film. Therefore, processing required for separately forming the top electrodes may be reduced, thereby simplifying manufacturing processes and saving manufacturing cost. Furthermore, since the insulation film is formed under the top electrode edge, leakage current and device malfunction caused by deformation of the top electrode can be prevented, even though the top electrode edge is damaged during laser-scribing. Thus, electro-optic device reliability can be improved.

Abstract: A method of distributing mainframe software and data using PC-based data media is disclosed, comprising a mainframe program for converting a mainframe sequential dataset or all or part of a mainframe library of texts or load modules to a sequential dataset of fixed length records and for reverting these converted records to its original form in the same or another mainframe data center, and procedures for downloading the converted mainframe data to a PC and uploading the PC file to a mainframe. The converted mainframe data downloaded to a PC can be delivered to another mainframe data center using floppy diskettes, recordable CD-ROM, Internet Website, TCP/IP FTP, or email attachment, as an alternative to magnetic tapes. The PC hard disk is used as a backup storage of the mainframe libraries, and a mainframe text library downloaded to a PC can be edited on a local or remote stand-alone PC.

Abstract: Provided are a gas injector and a film deposition apparatus having the same. The gas injector includes a body, a supply hole, an injection hole, and a distribution plate. The body is configured to provide an inner space therein. The supply hole is formed in an upper surface of the body to communicate with the inner space and receive a raw material. The injection hole is formed in a lower surface of the body to communicate with the inner space and inject the raw material. The distribution plate is disposed in the inner space of the body. A through hole is formed in the distribution plate. The distribution plate is disposed to be inclined at a predetermined angle with respect to a horizontal plane. The gas injector can uniformly inject the raw material and improve vaporization efficiency of the raw material having a powder form.

Abstract: An electro-optic device and a method for manufacturing the same. The method includes forming a bottom electrode on a substrate, forming a first insulation film crossing over the bottom electrode, forming an organic film on the substrate, forming a top electrode film on the organic film, and forming a top electrode that crosses the bottom electrode by laser-scribing the top electrode film. Herein, forming the top electrode by laser-scribing may position a bottom edge of the top electrode along an upper side of the first insulation film. Therefore, processing required for separately forming the top electrodes may be reduced, thereby simplifying manufacturing processes and saving manufacturing cost. Furthermore, since the insulation film is formed under the top electrode edge, leakage current and device malfunction caused by deformation of the top electrode can be prevented, even though the top electrode edge is damaged during laser-scribing. Thus, electro-optic device reliability can be improved.

Abstract: The present invention provides an apparatus for supplying a source and an apparatus for depositing a thin film having the same. The apparatus for supplying a source includes a horizontal channel extending in one direction; pumping and transfer ports extending to pass through the horizontal channel, the pumping and transfer ports being spaced apart from each other; a transfer shaft inserted into the horizontal channel to reciprocate therein; and a storage room connected to one side of the pumping port, the storage room storing and supplying a powder source, wherein the transfer shaft comprises at least one transfer hole for allowing the powder source supplied through the pumping port to be filled therein and to be transferred to an external apparatus through the transfer port.

Abstract: Provided are an electro-optic device and a method for manufacturing the same. The method includes forming a bottom electrode on a substrate, forming a first insulation film to cross over the bottom electrode forming an organic film on the substrate where the bottom electrode and the first insulation film are formed, forming a top electrode film on the organic film, and forming a top electrode to cross the bottom electrode by removing a portion of the top electrode film through a laser-scribing process. Herein, in the forming of the top electrode through the laser-scribing process, an edge region of a bottom surface of the top electrode may be positioned corresponding to an upper side of the first insulation film. Therefore, it is possible to reduce the number of processing apparatuses and steps required for separately forming the plurality of top electrodes, thereby simplifying manufacturing processes and saving manufacturing cost.

Abstract: A method and apparatus of fabricating a thin film transistor is disclosed, which patterns an ohmic contact layer by a laser patterning process so that it is capable of preventing a semiconductor layer from being damaged, and reducing fabrication time, wherein the method comprises forming a gate electrode pattern on a substrate; forming a gate insulating layer on the gate electrode pattern; sequentially forming a semiconductor layer pattern and an ohmic contact layer pattern on the gate insulating layer; forming source and drain electrode patterns on the ohmic contact layer pattern, wherein the source and drain electrode patterns are provided at a fixed interval therebetween; and removing the ohmic contact layer pattern exposed between the source and drain electrode patterns through the use of laser.

Abstract: A method and apparatus of fabricating a thin film transistor array substrate is disclosed, which is capable of reducing fabrication time owing to a simplified fabrication process, wherein at least one of steps for forming a gate pattern, forming a semiconductor pattern, forming a data pattern, removing an ohmic contact layer pattern exposed between source and drain electrode patterns, and forming a conductive layer pattern is performed by a laser scribing process.

Abstract: Provided are a method for manufacturing a transparent electrode pattern and a method for manufacturing an electro-optic device having the transparent electrode pattern. The method for manufacturing the transparent electrode pattern includes forming a transparent electrode on a light-transmissive substrate, patterning the transparent electrode by removing a portion of the transparent electrode, and forming an insulating protective layer in an edge region of the patterned transparent electrode through a printing process. In accordance with the method, the insulating protective layer is formed in the edge region of the patterned transparent electrode through the printing process so that an apparatus and method for manufacturing the insulating protective layer can be simplified, resulting in a decrease in manufacturing cost.

Abstract: Provided are a method for manufacturing a transparent electrode pattern and a method for manufacturing an electro-optic device having the transparent electrode pattern. The method for manufacturing the transparent electrode pattern includes forming a transparent electrode on a light-transmissive substrate, patterning the transparent electrode by removing a portion of the transparent electrode, and forming an insulating protective layer in an edge region of the patterned transparent electrode through a printing process. In accordance with the method, the insulating protective layer is formed in the edge region of the patterned transparent electrode through the printing process so that an apparatus and method for manufacturing the insulating protective layer can be simplified, resulting in a decrease in manufacturing cost.

Abstract: A method and apparatus of fabricating a thin film transistor array substrate is disclosed, which is capable of reducing fabrication time owing to a simplified fabrication process, wherein at least one of steps for forming a gate pattern, forming a semiconductor pattern, forming a data pattern, removing an ohmic contact layer pattern exposed between source and drain electrode patterns, and forming a conductive layer pattern is performed by a laser scribing process.

Abstract: A method and apparatus of fabricating a thin film transistor is disclosed, which patterns an ohmic contact layer by a laser patterning process so that it is capable of preventing a semiconductor layer from being damaged, and reducing fabrication time, wherein the method comprises forming a gate electrode pattern on a substrate; forming a gate insulating layer on the gate electrode pattern; sequentially forming a semiconductor layer pattern and an ohmic contact layer pattern on the gate insulating layer; forming source and drain electrode patterns on the ohmic contact layer pattern, wherein the source and drain electrode patterns are provided at a fixed interval therebetween; and removing the ohmic contact layer pattern exposed between the source and drain electrode patterns through the use of laser.

Abstract: Provided are an organic light emitting device and a method for manufacturing the same. The organic light emitting device includes: a substrate; an organic light emitting device layer on the substrate; an encapsulation layer on the organic light emitting device, the encapsulation layer comprising at least one first layer and at least one second layer on the first layer, the first layer having a different refractive index from the second layer; and a moisture transmission layer on the encapsulation layer, the moisture transmission layer being configured to prevent moisture from permeating the encapsulation layer. The encapsulation layer is formed by stacking material layers having different refractive indexes to protect the organic light emitting device layer. Thus, light emitted to lateral surfaces of the organic light emitting device which is a surface emitting device can be directed toward a front surface to improve optical radiation efficiency.

Abstract: An insulative paste and a method for manufacturing an organic light emitting device using the same are provided. The insulative paste is adapted to form an insulating layer in an electro-optical device by printing, and includes: a liquid phase organic insulating material having a viscosity; and a solid particle included in the liquid phase organic insulating material, wherein the solid particle has a positive curvature with respect to a horizontal plane of the insulating layer. Thus, by adding the solid particle to the liquid phase organic insulating material to prepare the insulative paste and patterning the insulating paste, a fine insulating layer pattern can be formed.

Abstract: Provided are an electro-optic device and a method for manufacturing the same. The method includes forming a bottom electrode on a substrate, forming a first insulation film to cross over the bottom electrode forming an organic film on the substrate where the bottom electrode and the first insulation film are formed, forming a top electrode film on the organic film, and forming a top electrode to cross the bottom electrode by removing a portion of the top electrode film through a laser-scribing process. Herein, in the forming of the top electrode through the laser-scribing process, an edge region of a bottom surface of the top electrode may be positioned corresponding to an upper side of the first insulation film. Therefore, it is possible to reduce the number of processing apparatuses and steps required for separately forming the plurality of top electrodes, thereby simplifying manufacturing processes and saving manufacturing cost.