Patents by Inventor Hyung Won JUNG

Hyung Won JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11995587
    Abstract: Disclosed are a method and device for managing a project by using data merging. A project is efficiently operated by dividing a project based on a minimum unit task and designing a plurality of child projects connected in sequential order such that a plurality of child projects proceed in order.
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: May 28, 2024
    Assignee: CROWDWORKS, INC.
    Inventors: Min Woo Park, Jeong Sik Jang, Ku Young Jung, Hyung Joon Seo, Uiho Choi, Dongbeom Won
  • Publication number: 20240170764
    Abstract: An energy storage device is equipped with an intake and exhaust integrated duct. The intake and exhaust integrated duct is capable of achieving a uniform cooling effect in a plurality of battery modules by distributing air to each cell module of a battery.
    Type: Application
    Filed: November 17, 2023
    Publication date: May 23, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, Duck Yang Industry Co., Ltd.
    Inventors: Sun Jun Kim, Hyung Seok Choi, Hee Jun Do, In Mook Park, Jae Yong Lee, Ki Won Jung
  • Publication number: 20240081404
    Abstract: Provided is a heater for an aerosol-generating device including a first electrically conductive pattern configured to perform heating and a second electrically conductive pattern arranged in parallel with the first electrically conductive pattern. The first electrically conductive pattern and/or the second electrically conductive pattern may include a material having a relatively small resistance temperature coefficient. Accordingly, a temperature increase rate of the heater may be greatly improved.
    Type: Application
    Filed: January 13, 2022
    Publication date: March 14, 2024
    Applicant: KT&G CORPORATION
    Inventors: Jong Seong JEONG, Gyoung Min GO, Hyung Jin BAE, Jang Won SEO, Chul Ho JANG, Min Seok JEONG, Jin Chul JUNG
  • Publication number: 20240071896
    Abstract: A semiconductor package includes a redistribution substrate having a first side and an opposite second side. A plurality of redistribution patterns are in the redistribution substrate, and a semiconductor chip is on the first side of the redistribution substrate. A plurality of metal pillars are positioned around and spaced apart from a periphery of the semiconductor chip and are connected to the redistribution patterns. A plurality of solder balls are on the second side of the redistribution substrate. Each of the metal pillars includes a third side facing the first side of the redistribution substrate, and an opposite fourth side. The fourth side has a square or octagonal shape in plan view.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 29, 2024
    Inventors: Jin Won CHAE, Moon Gil JUNG, Kwang-Bae KIM, So Yoen PARK, Hyung Jun CHOI
  • Publication number: 20090024308
    Abstract: A device, computer program product and method for providing path information and a device using the method are disclosed. A method for providing path information comprises receiving broadcast signals comprising traffic information and cost information, extracting and storing traffic information and cost information from received broadcast signals, requesting information about navigation path after receiving a first position and a second position, and searching for paths leading to the second position from the first position and calculating cost required to reach the second position from the first position based on traffic information and cost information of each searched path and displaying the cost.
    Type: Application
    Filed: June 18, 2008
    Publication date: January 22, 2009
    Inventor: Hyung Won JUNG