Patents by Inventor Hyung Won Kim

Hyung Won Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11972574
    Abstract: Disclosed is an image segmentation device. The image segmentation device may include: a storage unit storing a segmentation model learned so as to segment at least one predetermined object; and at least one processor inputting input data into the segmentation model and segmenting at least one predetermined object in the input data, in which the segmentation model may include an encoder including at least one dimension reduction block reducing a dimension of the input data, a decoder including at least one dimension increase block increasing the dimension of output data output from the encoder by using data output from at least one dimension reduction block, and an auxiliary classification model receiving the output data and recognizing whether a specific object is included in the output data.
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: April 30, 2024
    Assignee: DOTTER CO., LTD.
    Inventors: Hyeong-Soo Nam, Aleksandr Dolgov, Sang-Won Lee, Sogi Choi, Hong-Ki Yoo, Hyung-Il Kim
  • Publication number: 20240128915
    Abstract: Disclosed is a motor driving apparatus including: a motor; an inverter including a switching element for driving the motor; a controller for controlling the switching element; a resolver including an excitation winding and a detection winding; and a resolver chip applying an excitation signal to the excitation winding by inputting a periodic signal from the controller, and receiving a feedback signal from the detection winding, wherein the resolver chip determines the number of rotations of the motor based on a change in a pulse width of a detection signal resulting from a comparison between a voltage of the feedback signal and a preset voltage, and output a signal to the inverter for setting an inertial driving control mode according to the number of rotations of the motor in a failure state of the controller.
    Type: Application
    Filed: October 17, 2023
    Publication date: April 18, 2024
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: Tae Hwan KANG, Hyung Min PARK, Joo Won PARK, Beom Cheol CHO, Yun Ho CHOI, Yeon Ho KIM, Won Hee JO
  • Publication number: 20240113854
    Abstract: Internal phase shifting is achieved by adding a feedback divider to a feedback loop of a phase locked loop circuit configured to determine a transmission frequency of a wireless transmission terminal and adding a phase adjustment current to a loop current. Since the phase adjustment current is applied to an adder circuit, a phase difference is maintained even when the feedback loop is in a stable state, and accordingly, an output of the feedback divider maintains the phase difference with a reference frequency as intended by the phase adjustment current applied to the adder circuit.
    Type: Application
    Filed: February 21, 2023
    Publication date: April 4, 2024
    Applicants: SKAIChips Co., Ltd., Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Kang Yoon LEE, Hyung Ki HUH, Jong Wan JO, Ho Won KIM
  • Patent number: 11942162
    Abstract: A method for operating a memory device is provided. The method includes providing a high voltage signal to a memory cell array including a plurality of memory cells using a first wiring, providing a logic signal to the memory cell array using a second wiring, and providing a shielding signal to the memory cell array using a third wiring arranged between the first wiring and the second wiring. A highest voltage level of the logic signal is lower than a highest voltage level of the high voltage signal, and the shielding signal includes a negative first voltage level in a first mode and a positive second voltage level in a second mode.
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: March 26, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyung Soo Kim, Dae Han Kim, Jong Min Kim, Myoung Won Yoon
  • Publication number: 20240093401
    Abstract: A method of manufacturing a multilayer metal plate by electroplating includes a first forming operation of forming one of a first metal layer and a second metal layer on a substrate by electroplating, wherein the second metal layer is less recrystallized than the first metal layer, the second metal layer is comprised of nanometer-size grains, and the second metal layer has a higher level of tensile strength than the first metal layer; and a second forming operation of forming, by electroplating, a third metal layer not formed in the first forming operation on a surface of one of the first metal layer and the second metal layer formed in the first forming operation.
    Type: Application
    Filed: September 18, 2023
    Publication date: March 21, 2024
    Applicant: DONG-A UNIVERSITY RESEARCH FOUNDATION FOR INDUSTRY-ACADEMY COOPERATION
    Inventors: Hyun PARK, Sung Jin KIM, Han Kyun SHIN, Hyo Jong LEE, Jong Bae JEON, Jung Han KIM, An Na LEE, Tae Hyun KIM, Hyung Won CHO
  • Publication number: 20240098894
    Abstract: A display device includes a substrate including a display area including pixels and a non-display area around the display area and including a pad area, and a circuit board attached to the pad area. Pad electrodes arranged along a first direction and a first alignment mark located at a side of the pad electrodes in the first direction and protruding more than the pad electrodes are disposed on the substrate in the pad area. The circuit board includes a base portion, and lead electrodes disposed on the base portion and respectively facing the pad electrodes. A first alignment mark hole is defined through the base portion at a side of the lead electrodes in the first direction, the first alignment mark and the first alignment mark hole have a same shape as each other, and the first alignment mark is accommodated in the first alignment mark hole.
    Type: Application
    Filed: May 10, 2023
    Publication date: March 21, 2024
    Inventors: Hyung Jin KIM, Hyang Won MOON, Hyeok Tae KWON, Si Hyung AN, Geun Yeong CHANG
  • Publication number: 20240083362
    Abstract: A baggage loading device for a vehicle includes an auxiliary main body part provided to be drawn out from a sidewall in an interior of the vehicle and formed so that baggage can be selectively loaded when the baggage loading device is in a state of being drawn out.
    Type: Application
    Filed: March 23, 2023
    Publication date: March 14, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, SEOYON E-HWA CO., LTD.
    Inventors: Ji Ah Kim, Ji Seob Park, Jin Ho Hwang, Hyung Won Jin
  • Publication number: 20240088177
    Abstract: An image sensing device is provided to include a pixel array having a plurality of pixels arranged in a matrix shape. Each of the pixels includes: a control node configured to generate a hole current in a substrate; a detection node configured to capture photocharge migrated by the hole current, formed in a shape whose at least part is partially open, and disposed to surround the control node, and a low resistance region including a dielectric layer formed in the substrate, and disposed in the opening on of the detection node. The low resistance region includes an inner low resistance region disposed between the control node and the center of the pixel.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Inventors: Hyung June YOON, Jong Eun KIM, Jong Chae KIM, Jae Won LEE, Jae Hyung JANG, Hoon Moo CHOI
  • Publication number: 20240071896
    Abstract: A semiconductor package includes a redistribution substrate having a first side and an opposite second side. A plurality of redistribution patterns are in the redistribution substrate, and a semiconductor chip is on the first side of the redistribution substrate. A plurality of metal pillars are positioned around and spaced apart from a periphery of the semiconductor chip and are connected to the redistribution patterns. A plurality of solder balls are on the second side of the redistribution substrate. Each of the metal pillars includes a third side facing the first side of the redistribution substrate, and an opposite fourth side. The fourth side has a square or octagonal shape in plan view.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 29, 2024
    Inventors: Jin Won CHAE, Moon Gil JUNG, Kwang-Bae KIM, So Yoen PARK, Hyung Jun CHOI
  • Publication number: 20240070442
    Abstract: A method of programming an activation function is provided. The method includes generating a segment data for segmenting the activation function; segmenting the activation function into a plurality of segments using the segment data; and approximating at least one segment of the plurality of segments to a programmable segment.
    Type: Application
    Filed: October 10, 2023
    Publication date: February 29, 2024
    Applicant: DEEPX CO., LTD.
    Inventors: Lok Won KIM, Ho Seung KIM, Hyung Jin CHUN
  • Publication number: 20240069524
    Abstract: Disclosed is an apparatus for excitation signal generation for a resolver. The apparatus includes a sine wave generator that generates a sine wave based on a square wave, an amplifier that amplifies the sine wave, a differential signal generator that converts, into a differential signal, the amplified sine wave, a driver that inputs the differential signal to a coil, and a processor that generates an excitation signal by increasing a voltage of the sine wave from a start voltage to a target voltage through at least one of the sine wave generator and the amplifier based on a transient current that flows into the coil in a transient response interval.
    Type: Application
    Filed: December 27, 2022
    Publication date: February 29, 2024
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: Yun Ho CHOI, Hyung Min PARK, Joo Won PARK, Yeon Ho KIM, Won Hee JO, Tae Hwan KANG, Beom Cheol CHO
  • Patent number: 11477399
    Abstract: A temperature measuring device using a thermal imaging camera according to an embodiment of the present invention may comprise: a first operation module for obtaining, for the thermal imaging camera, a curve of temperature difference versus output code difference where the X axis represents the output code difference and the Y axis represents the temperature difference indicated by a plurality of measured values; a second operation module for obtaining a function of temperature difference versus output code difference, the function curve-fitted by using the curve of temperature difference versus output code difference; and a third operation module for measuring the temperature of an object by applying the curve-fitted function of temperature difference versus output code difference.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: October 18, 2022
    Assignee: U ELECTRONICS CO., LTD.
    Inventors: Joon Sub Lee, Tae Hwan Eom, Min Kyu Lee, Hyung Won Kim, Mi Sook Ahn
  • Publication number: 20210250524
    Abstract: A temperature measuring device using a thermal imaging camera according to an embodiment of the present invention may comprise: a first operation module for obtaining, for the thermal imaging camera, a curve of temperature difference versus output code difference where the X axis represents the output code difference and the Y axis represents the temperature difference indicated by a plurality of measured values; a second operation module for obtaining a function of temperature difference versus output code difference, the function curve-fitted by using the curve of temperature difference versus output code difference; and a third operation module for measuring the temperature of an object by applying the curve-fitted function of temperature difference versus output code difference.
    Type: Application
    Filed: February 11, 2020
    Publication date: August 12, 2021
    Inventors: Joon Sub Lee, Tae Hwan Eom, Min Kyu Lee, Hyung Won Kim, Mi Sook Ahn
  • Patent number: 9533875
    Abstract: A micro electro mechanical systems (MEMS) sensor packaging includes a first wafer having a readout integrated circuit (ROIC) formed thereon, a second wafer disposed corresponding to the first wafer and having a concave portion on one side thereof and a MEMS sensor prepared on the concave portion, joint solders formed along a surrounding of the MEMS sensor and sealing the MEMS sensor jointing the first and second wafers, and pad solders formed to electrically connect the ROIC circuit of the first wafer and the MEMS sensor of the second wafer. According to the present disclosure, in joining and packaging a wafer having the ROIC formed thereon and a wafer having the MEMS sensor formed thereon, the size of a package can be reduced and an electric signal can be stably provided by forming internally pad solders for electrically connecting the ROIC and the MEMS sensor.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: January 3, 2017
    Assignee: U Electronics Co., Ltd.
    Inventors: Yong Hee Han, Hyung Won Kim, Mi Sook Ahn
  • Publication number: 20140306312
    Abstract: A micro electro mechanical systems (MEMS sensor packaging includes a first wafer having a readout integrated circuit (ROIC) formed thereon., a second wafer disposed corresponding to the first wafer and having a concave portion on one side thereof and a MEMS sensor prepared on the concave portion, joint solders formed along a surrounding of the MEMS sensor and sealing the MEMS sensor jointing the first and second wafers, and pad solders formed to electrically connect the ROIC circuit of the first wafer and the MEMS sensor of the second wafer. According to the present disclosure, in joining and packaging a wafer having the ROIC formed thereon and a wafer having the MEMS sensor formed thereon, the size of a package can be reduced and an electric signal can be stably provided by forming internally pad solders for electrically connecting the ROIC and the MEMS sensor.
    Type: Application
    Filed: November 9, 2012
    Publication date: October 16, 2014
    Inventors: Yong Hee Han, Hyung Won Kim, Mi Sook Ahn
  • Patent number: 8457238
    Abstract: A soft decision decoding method in a multiple-input multiple-output system which respectively receives two simultaneously transmitted data streams, a first transmitting symbol and a second transmitting symbol, in a first receiving signal and a second receiving signal is provided.
    Type: Grant
    Filed: December 19, 2008
    Date of Patent: June 4, 2013
    Assignee: Xronet Corporation
    Inventors: Seung hyuk Ahn, Hyung won Kim
  • Publication number: 20100284266
    Abstract: An orthogonal frequency division multiplexing (OFDM) system and an inter-cell interference cancelling method performed in the OFDM system are provided. The OFDM system includes a Fourier transformer which transforms a received base band signal into a pilot subcarrier signal and a data subcarrier signal, a Doppler/delay spread estimator which estimates a coherent time and a coherent bandwidth from the pilot subcarrier signal, a pilot block size selector which selects a pilot block including at least one pilot signal, based on the coherent time and the coherent bandwidth, a simultaneous channel estimator which estimates a channel response signal based on the at least one pilot signal located in the pilot block, and a simultaneous symbol extractor which extracts a data symbol from the data subcarrier signal on the basis of the channel response signal.
    Type: Application
    Filed: December 12, 2008
    Publication date: November 11, 2010
    Applicant: XRONET CORPORATION
    Inventors: Han yong Jang, Hyung Won Kim
  • Publication number: 20100285829
    Abstract: An orthogonal frequency division multiplexing (OFDM) system and a method of controlling preamble power of the OFDM system are provided. The method includes detecting a present preamble power of a certain base station among a plurality of base stations and a preamble influence factor of the certain base station; detecting a preamble influence factor of at least one neighboring base station of the certain base station; and determining a new preamble power of the certain base station based on at least one among the present preamble power, the preamble influence factor of the certain base station, and the preamble influence factor of the at least one neighboring base station.
    Type: Application
    Filed: December 22, 2008
    Publication date: November 11, 2010
    Applicant: XRONET CORPORATION
    Inventors: Keun Moo Lee, Hyung Won Kim
  • Publication number: 20100272200
    Abstract: A soft decision decoding method in a multiple-input multiple-output system which respectively receives two simultaneously transmitted data streams, a first transmitting symbol and a second transmitting symbol, in a first receiving signal and a second receiving signal is provided.
    Type: Application
    Filed: December 19, 2008
    Publication date: October 28, 2010
    Applicant: XRONET CORPORATION
    Inventors: Seung hyuk Ahn, Hyung won Kim
  • Patent number: 7318997
    Abstract: Disclosed are an exposure apparatus for forming fine patterns of a semiconductor using an electric field and a method for forming fine patterns using the exposure apparatus. The exposure apparatus comprises an electric field generator for generating an electric field to be applied to infiltrate an acid (H+) produced when a photoresist film is exposed into non-exposure regions. Non-exposure regions into which an acid is infiltrated along with exposure regions in a development process can be removed by applying an electric field to the acid produced during exposure of a photoresist film such that the acid is infiltrated into the non-exposure regions.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: January 15, 2008
    Assignee: Dongbu Electronics Co., Ltd.
    Inventors: Hyung-Won Kim, Seung-Won Baek