Abstract: A temperature measuring device using a thermal imaging camera according to an embodiment of the present invention may comprise: a first operation module for obtaining, for the thermal imaging camera, a curve of temperature difference versus output code difference where the X axis represents the output code difference and the Y axis represents the temperature difference indicated by a plurality of measured values; a second operation module for obtaining a function of temperature difference versus output code difference, the function curve-fitted by using the curve of temperature difference versus output code difference; and a third operation module for measuring the temperature of an object by applying the curve-fitted function of temperature difference versus output code difference.

Abstract: A temperature measuring device using a thermal imaging camera according to an embodiment of the present invention may comprise: a first operation module for obtaining, for the thermal imaging camera, a curve of temperature difference versus output code difference where the X axis represents the output code difference and the Y axis represents the temperature difference indicated by a plurality of measured values; a second operation module for obtaining a function of temperature difference versus output code difference, the function curve-fitted by using the curve of temperature difference versus output code difference; and a third operation module for measuring the temperature of an object by applying the curve-fitted function of temperature difference versus output code difference.

Abstract: A micro electro mechanical systems (MEMS) sensor packaging includes a first wafer having a readout integrated circuit (ROIC) formed thereon, a second wafer disposed corresponding to the first wafer and having a concave portion on one side thereof and a MEMS sensor prepared on the concave portion, joint solders formed along a surrounding of the MEMS sensor and sealing the MEMS sensor jointing the first and second wafers, and pad solders formed to electrically connect the ROIC circuit of the first wafer and the MEMS sensor of the second wafer. According to the present disclosure, in joining and packaging a wafer having the ROIC formed thereon and a wafer having the MEMS sensor formed thereon, the size of a package can be reduced and an electric signal can be stably provided by forming internally pad solders for electrically connecting the ROIC and the MEMS sensor.

Abstract: A micro electro mechanical systems (MEMS sensor packaging includes a first wafer having a readout integrated circuit (ROIC) formed thereon., a second wafer disposed corresponding to the first wafer and having a concave portion on one side thereof and a MEMS sensor prepared on the concave portion, joint solders formed along a surrounding of the MEMS sensor and sealing the MEMS sensor jointing the first and second wafers, and pad solders formed to electrically connect the ROIC circuit of the first wafer and the MEMS sensor of the second wafer. According to the present disclosure, in joining and packaging a wafer having the ROIC formed thereon and a wafer having the MEMS sensor formed thereon, the size of a package can be reduced and an electric signal can be stably provided by forming internally pad solders for electrically connecting the ROIC and the MEMS sensor.

Abstract: A soft decision decoding method in a multiple-input multiple-output system which respectively receives two simultaneously transmitted data streams, a first transmitting symbol and a second transmitting symbol, in a first receiving signal and a second receiving signal is provided.

Abstract: An orthogonal frequency division multiplexing (OFDM) system and a method of controlling preamble power of the OFDM system are provided. The method includes detecting a present preamble power of a certain base station among a plurality of base stations and a preamble influence factor of the certain base station; detecting a preamble influence factor of at least one neighboring base station of the certain base station; and determining a new preamble power of the certain base station based on at least one among the present preamble power, the preamble influence factor of the certain base station, and the preamble influence factor of the at least one neighboring base station.

Abstract: An orthogonal frequency division multiplexing (OFDM) system and an inter-cell interference cancelling method performed in the OFDM system are provided. The OFDM system includes a Fourier transformer which transforms a received base band signal into a pilot subcarrier signal and a data subcarrier signal, a Doppler/delay spread estimator which estimates a coherent time and a coherent bandwidth from the pilot subcarrier signal, a pilot block size selector which selects a pilot block including at least one pilot signal, based on the coherent time and the coherent bandwidth, a simultaneous channel estimator which estimates a channel response signal based on the at least one pilot signal located in the pilot block, and a simultaneous symbol extractor which extracts a data symbol from the data subcarrier signal on the basis of the channel response signal.

Abstract: A soft decision decoding method in a multiple-input multiple-output system which respectively receives two simultaneously transmitted data streams, a first transmitting symbol and a second transmitting symbol, in a first receiving signal and a second receiving signal is provided.

Abstract: Disclosed are an exposure apparatus for forming fine patterns of a semiconductor using an electric field and a method for forming fine patterns using the exposure apparatus. The exposure apparatus comprises an electric field generator for generating an electric field to be applied to infiltrate an acid (H+) produced when a photoresist film is exposed into non-exposure regions. Non-exposure regions into which an acid is infiltrated along with exposure regions in a development process can be removed by applying an electric field to the acid produced during exposure of a photoresist film such that the acid is infiltrated into the non-exposure regions.

Abstract: A process of repairing defects in linked list memories including selecting one of a group of the linked list memories and an additional memory, as a defect marking memory, detecting faults in rows of the defect marking memory, and storing row addresses having at least one fault in defect address registers. The method detects faults in rows of other linked list memories, where the other linked list memories are the linked list memories other than the defect marking memory, and stores a marking code for each row address of the other linked list memories in the defect marking memory. The defect address registers and the defect marking memory are searched when addresses of the linked list memories are linked and row addresses having a specific marking code skipped in the linking process.

Abstract: Disclosed are an exposure apparatus for forming fine patterns of a semiconductor using an electric field and a method for forming fine patterns using the exposure apparatus. The exposure apparatus comprises an electric field generator for generating an electric field to be applied to infiltrate an acid (H+) produced when a photoresist film is exposed into non-exposure regions. Non-exposure regions into which an acid is infiltrated along with exposure regions in a development process can be removed by applying an electric field to the acid produced during exposure of a photoresist film such that the acid is infiltrated into the non-exposure regions.

Abstract: A process of repairing defects in linked list memories is disclosed. One of the linked list memories is selected as a defect marking memory and faults in rows of the defect marking memory are detected. Row addresses having at least one fault in defect address registers are stored; when at least one fault in the rows of the defect marking memory is detected. Faults in rows of other linked list memories are detected, where the other linked list memories are the linked list memories other than the defect marking memory and a marking code is stored for each row address of the other linked list memories in the defect marking memory, where a particular marking code indicates whether a particular row address has at least one fault. The defect address registers and the defect marking memory are searched when addresses of the linked list memories are linked and row addresses indicated as having at least one fault are skipped in the linking process.

Abstract: One of a linked list memories is selected as a defect marking memory and faults in rows of the defect marking memory are detected. Row addresses having at least one fault in defect address registers are stored. Faults in rows of other linked list memories are detected, where the other linked list memories are the linked list memories other than the defect marking memory and a marking code is stored for each row address of the other linked list memories in the defect marking memory, where a particular marking code indicates whether a particular row address has at least one fault. The defect address registers and the defect marking memory are searched when addresses of the linked list memories are linked and row addresses indicated as having at least one fault are skipped in the linking process.

Abstract: A process of handling packet data in a packet buffer is disclosed. Free pointers are stored in a plurality of free pointer queues, with each of the plurality free pointer queues in a form of a linked list and the free pointers are retrieved from each of the plurality of free pointer queues and storing in a prefetch memory to provide a throughput of one free pointer per clock cycle. When an initial portion of a data packet is received, two free pointers are retrieved from the prefetch memory. One of the two free pointers is stored in a start pointer register connoting a start of the data packet and one free pointer is supplied for data elements of the data packet. One free pointer per middle data element is supplied, while no new pointer is needed for the end of packet data element.

Abstract: A process of repairing defects in linked list memories is disclosed. One of the linked list memories is selected as a defect marking memory and faults in rows of the defect marking memory are detected. Row addresses having at least one fault in defect address registers are stored; when at least one fault in the rows of the defect marking memory is detected. Faults in rows of other linked list memories are detected, where the other linked list memories are the linked list memories other than the defect marking memory and a marking code is stored for each row address of the other linked list memories in the defect marking memory, where a particular marking code indicates whether a particular row address has at least one fault. The defect address registers and the defect marking memory are searched when addresses of the linked list memories are linked and row addresses indicated as having at least one fault are skipped in the linking process.

Abstract: A process of handling packet data in a packet buffer is disclosed. Free pointers are stored in a plurality of free pointer queues, with each of the plurality free pointer queues in a form of a linked list and the free pointers are retrieved from each of the plurality of free pointer queues and storing in a prefetch memory to provide a throughput of one free pointer per clock cycle. When an initial portion of a data packet is received, two free pointers are retrieved from the prefetch memory. One of the two free pointers is stored in a start pointer register connoting a start of the data packet and one free pointer is supplied for data elements of the data packet. One free pointer per middle data element is supplied, while no new pointer is needed for the end of packet data element.