Patents by Inventor Hyung Ho SEO
Hyung Ho SEO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240120323Abstract: The present disclosure relates to an apparatus for fabricating a display panel including: an attachment member having a fixing portion in a pressurization direction to which a pressurization header is fixed, an attachment driving member configured to move the attachment member and the pressurization header in the pressurization direction or a detachment direction through a fixing frame of the attachment member, a first pressure sensing module between the pressurization header and the attachment member and configured to generate first pressure detection signals according to pressure applied to the pressurization header, a gradient setting module configured to set a gradient of the pressurization header based on magnitudes of the first pressure detection signals, and a gradient control module configured to adjust gradients of the pressurization header, the attachment member, and the fixing frame according to control of the gradient setting module.Type: ApplicationFiled: September 6, 2023Publication date: April 11, 2024Inventors: Tae Hee LEE, Sung Kook PARK, Kyung Ho KIM, Young Seok SEO, Jae Gwang UM, Sang Hyun LEE, Hyung Suk HWANG
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Publication number: 20240081404Abstract: Provided is a heater for an aerosol-generating device including a first electrically conductive pattern configured to perform heating and a second electrically conductive pattern arranged in parallel with the first electrically conductive pattern. The first electrically conductive pattern and/or the second electrically conductive pattern may include a material having a relatively small resistance temperature coefficient. Accordingly, a temperature increase rate of the heater may be greatly improved.Type: ApplicationFiled: January 13, 2022Publication date: March 14, 2024Applicant: KT&G CORPORATIONInventors: Jong Seong JEONG, Gyoung Min GO, Hyung Jin BAE, Jang Won SEO, Chul Ho JANG, Min Seok JEONG, Jin Chul JUNG
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Patent number: 11923609Abstract: Disclosed is a radar antenna including an antenna body including a first plate and a second plate; a slot radiation part and a slot reception part formed in the first plate; a transmission port and a reception port formed in the second plate; and a waveguide formed by assembling the first and second plates. The slot radiation part includes a first slot radiation part configured to radiate a radio wave in a first detection range, and a second slot radiation part configured to radiate radio waves in a second detection range having a larger width and distance than the first detection range.Type: GrantFiled: May 27, 2020Date of Patent: March 5, 2024Assignee: AMOTECH CO., LTD.Inventors: Hyun Joo Park, Kyung Hyun Ryu, Yun Sik Seo, Se Ho Lee, Jeong Geun Heo, Han Ju Do, Hyung Ii Baek
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Patent number: 11888212Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.Type: GrantFiled: June 24, 2021Date of Patent: January 30, 2024Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung Kang, Shin Haeng Heo, Hyung Ho Seo
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Patent number: 11670870Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.Type: GrantFiled: September 2, 2021Date of Patent: June 6, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung Kang, Gil Ha Lee, Shin Haeng Heo, Hyung Ho Seo, Hong Cheol Kim
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Patent number: 11228118Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.Type: GrantFiled: October 22, 2019Date of Patent: January 18, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung Kang, Gil Ha Lee, Shin Haeng Heo, Hyung Ho Seo, Hong Cheol Kim
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Publication number: 20210399436Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.Type: ApplicationFiled: September 2, 2021Publication date: December 23, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung KANG, Gil Ha LEE, Shin Haeng HEO, Hyung Ho SEO, Hong Cheol KIM
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Publication number: 20210320398Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.Type: ApplicationFiled: June 24, 2021Publication date: October 14, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung KANG, Shin Haeng HEO, Hyung Ho SEO
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Patent number: 11128030Abstract: An antenna module includes an integrated circuit (IC) package, a first antenna package, a second antenna package, and a connection member. The IC package includes an IC and mounting electrical connection structures. The first antenna package includes a first patch antenna pattern, a first feed via connected to the first patch antenna pattern, and a first antenna dielectric layer surrounding at least a portion of the first feed via. The second antenna package includes a second patch antenna pattern, a second feed via connected to the second patch antenna pattern, and a second antenna dielectric layer surrounding at least a portion of the second feed via, and disposed to be spaced apart from the first antenna package. The connection member, connecting the IC to the first feed via and the second feed via, connects to the mounting electrical connection structures, and having a stacked structure.Type: GrantFiled: July 8, 2019Date of Patent: September 21, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hong In Kim, Hyung Ho Seo, Young Kyoon Im, Kyu Bum Han, Jeong Ki Ryoo
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Publication number: 20210143530Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.Type: ApplicationFiled: January 19, 2021Publication date: May 13, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung KANG, Shin Haeng HEO, Hyung Ho SEO
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Patent number: 10931000Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.Type: GrantFiled: January 14, 2020Date of Patent: February 23, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung Kang, Shin Haeng Heo, Hyung Ho Seo
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Publication number: 20210044001Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.Type: ApplicationFiled: January 14, 2020Publication date: February 11, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung KANG, Shin Haeng HEO, Hyung Ho SEO
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Publication number: 20200403321Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.Type: ApplicationFiled: October 22, 2019Publication date: December 24, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung KANG, Gil Ha LEE, Shin Haeng HEO, Hyung Ho SEO, Hong Cheol KIM
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Publication number: 20200112081Abstract: An antenna module includes an integrated circuit (IC) package, a first antenna package, a second antenna package, and a connection member. The IC package includes an IC and mounting electrical connection structures. The first antenna package includes a first patch antenna pattern, a first feed via connected to the first patch antenna pattern, and a first antenna dielectric layer surrounding at least a portion of the first feed via. The second antenna package includes a second patch antenna pattern, a second feed via connected to the second patch antenna pattern, and a second antenna dielectric layer surrounding at least a portion of the second feed via, and disposed to be spaced apart from the first antenna package. The connection member, connecting the IC to the first feed via and the second feed via, connects to the mounting electrical connection structures, and having a stacked structure.Type: ApplicationFiled: July 8, 2019Publication date: April 9, 2020Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hong In KIM, Hyung Ho SEO, Young Kyoon IM, Kyu Bum HAN, Jeong Ki RYOO