Patents by Inventor Hyung Jun CHOI
Hyung Jun CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250100340Abstract: Disclosed are a mount control system and method for vehicles in which a camera of an electronically controlled suspension system with road preview photographs a road surface condition of a road ahead of a vehicle, a suspension controller determines a road surface state of the road based on photographed information of the camera, and a mount controller controls semi-active mounts to be in an on state or in an off state based on road surface state determination information transmitted from the suspension controller and values detected by wheel acceleration sensors mounted on wheels of the vehicle, so as to improve not only NVH performance but also driving vibration damping performance depending on the road surface state.Type: ApplicationFiled: January 10, 2024Publication date: March 27, 2025Inventors: Jin Hyun KIM, Jang Ho KIM, Dong Wook LEE, Hyung Jin KIM, Eun Suk YOO, Jong Hoon CHOI, Sang Hyun PARK, Seong Eun HONG, Young Jae KIM, Hyeon Jun KIM, In Yong JUNG, Chang Beom KIM
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Patent number: 12255022Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface and disposed to extend to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a fluorine-based organic material.Type: GrantFiled: September 20, 2022Date of Patent: March 18, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Yeun Won, Jong Ho Lee, Yoo Jeong Lee, Hyung Jong Choi, Chung Yeol Lee, So Jung An, Woo Kyung Sung, Myung Jun Park
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Patent number: 12249461Abstract: A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion onto a portion of the first surface, and a third band portion extending from the first connection portion onto a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer including a silicone-based resin and disposed on the first and second connection portions.Type: GrantFiled: September 1, 2022Date of Patent: March 11, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: So Jung An, Hyung Jong Choi, Yoo Jeong Lee, Chung Yeol Lee, Kwang Yeun Won, Woo Kyung Sung, Myung Jun Park, Jong Ho Lee
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Patent number: 12224127Abstract: An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.Type: GrantFiled: October 25, 2022Date of Patent: February 11, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chung Yeol Lee, Yoo Jeong Lee, Hyung Jong Choi, Kwang Yeun Won, So Jung An, Woo Kyung Sung, Kang Ha Lee, Myung Jun Park, Jong Ho Lee, Jun Hyeong Kim
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Patent number: 12224126Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction.Type: GrantFiled: October 6, 2022Date of Patent: February 11, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong Choi, Yoo Jeong Lee, Chung Yeol Lee, Kwang Yeun Won, So Jung An, Woo Kyung Sung, Myung Jun Park, Jong Ho Lee
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Publication number: 20250025360Abstract: Disclosed is a mobile negative pressure chamber, that includes a bed, a main cover separably coupled to the bed, and having a main cavity, an auxiliary cover coupled to one side of the bed to be separable, that seals the main cavity while being engaged with the main cover, and having an auxiliary cavity, in which a lower body of the surgical recipient is located in an interior thereof, a main treatment part provided in at least one of the main cover and the auxiliary cover, and provided with a glove mounted on an arm of the surgical operator, and an auxiliary treatment part provided in at least one of the main cover and the auxiliary cover, and into and from which the arm of the surgical operator or a medical instrument is inserted and extracted.Type: ApplicationFiled: October 27, 2023Publication date: January 23, 2025Applicants: SOONCHUNHYANG UNIVERSITY INDUSTRY ACADEMY COOPERATION FOUNDATION, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Seong Jun CHOI, Jung Wan PARK, Su Ha HAN, Hyung Soo KIM, Hae Won PARK, Sung Jin PARK, Ji Hye PARK
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Publication number: 20240071896Abstract: A semiconductor package includes a redistribution substrate having a first side and an opposite second side. A plurality of redistribution patterns are in the redistribution substrate, and a semiconductor chip is on the first side of the redistribution substrate. A plurality of metal pillars are positioned around and spaced apart from a periphery of the semiconductor chip and are connected to the redistribution patterns. A plurality of solder balls are on the second side of the redistribution substrate. Each of the metal pillars includes a third side facing the first side of the redistribution substrate, and an opposite fourth side. The fourth side has a square or octagonal shape in plan view.Type: ApplicationFiled: July 28, 2023Publication date: February 29, 2024Inventors: Jin Won CHAE, Moon Gil JUNG, Kwang-Bae KIM, So Yoen PARK, Hyung Jun CHOI
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Publication number: 20230420285Abstract: A substrate processing apparatus includes: a stage including a first region and a second region surrounding the first region, the stage configured to receive a substrate; and a plurality of pins in or on the stage and configured to adsorb the substrate with negative pressure. The plurality of pins include a plurality of first pins in the first region and are configured to be elevated at the same time, and a plurality of second pins in the second region and are configured to be elevated at the same time. In operation, the first pins are elevated and adsorb the substrate first, and then, the second pins are elevated and adsorb the substrate.Type: ApplicationFiled: May 10, 2023Publication date: December 28, 2023Inventors: Hyung Jun Choi, Tae Hong Min
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Patent number: 11351082Abstract: Proposed is a seating-type gait rehabilitation robot improved in entry characteristics, and more particularly to a seating-type gait rehabilitation robot improved in entry characteristics, of which a structure is concise and simple, and in which a footrest on which a trainee can put his/her foot has the minimum height to allow the trainee to easily enter and readily use the robot without any separate entry means for entry of the trainee and is placed at an entry side for the trainee to raise a gait training effect and reduce a collision risk.Type: GrantFiled: February 11, 2020Date of Patent: June 7, 2022Assignee: CUREXO, INC.Inventors: Young Hwan Kim, Hyung Jun Choi
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Publication number: 20220040024Abstract: Proposed is a seating-type gait rehabilitation robot improved in entry characteristics, and more particularly to a seating-type gait rehabilitation robot improved in entry characteristics, of which a structure is concise and simple, and in which a footrest on which a trainee can put his/her foot has the minimum height to allow the trainee to easily enter and readily use the robot without any separate entry means for entry of the trainee and is placed at an entry side for the trainee to raise a gait training effect and reduce a collision risk.Type: ApplicationFiled: February 11, 2020Publication date: February 10, 2022Inventors: Young Hwan KIM, Hyung Jun CHOI