Abstract: A semiconductor package includes a package substrate that includes a substrate base and a lower solder resist layer that covers a lower surface of the substrate base, where the lower solder resist layer includes a ponding recess that extends from a lower surface toward an upper surface of the lower solder resist layer, a semiconductor chip attached to an upper surface of the package substrate, an auxiliary chip attached to a lower surface of the package substrate adjacent to the ponding recess through a plurality of chip terminals, where the auxiliary chip includes a first side and a second side opposite to each other in a plane, and an underfill layer that fills a space between the package substrate and the auxiliary chip, surrounds the plurality of chip terminals, and fills the ponding recess.

Abstract: A semiconductor package device may include a first package substrate, a first semiconductor chip on the first package substrate, an interposer on the first semiconductor chip, a warpage prevention member on the interposer, a molding member on the interposer and the first package substrate, and a second package substrate on the molding member. At least a portion of a top surface of the molding member may be spaced apart from a bottom surface of the second package substrate.

Abstract: A semiconductor package device may include a first package substrate, a first semiconductor chip on the first package substrate, an interposer on the first semiconductor chip, a warpage prevention member on the interposer, a molding member on the interposer and the first package substrate, and a second package substrate on the molding member. At least a portion of a top surface of the molding member may be spaced apart from a bottom surface of the second package substrate.