Abstract: An adaptor structure includes a main adaptor, a first sub-adaptor, a second sub-adaptor and a first driving mechanism. The main adaptor is over a socket. The main adaptor has an opening. The first sub-adaptor is movably received in the opening of the main adaptor in a first direction. The first sub-adaptor is configured to support a first side surface of the semiconductor package. The second sub-adaptor is movably received in the opening of the main adaptor in the first direction and a second direction. The second sub-adaptor faces the first sub-adaptor to support a second side surface of the semiconductor package. The first driving mechanism is configured to move the second sub-adaptor in the second direction. Thus, the adaptor structure can guide the semiconductor packages having different sizes to the socket.

Abstract: An adaptor structure includes a main adaptor, a first sub-adaptor, a second sub-adaptor and a first driving mechanism. The main adaptor is over a socket. The main adaptor has an opening. The first sub-adaptor is movably received in the opening of the main adaptor in a first direction. The first sub-adaptor is configured to support a first side surface of the semiconductor package. The second sub-adaptor is movably received in the opening of the main adaptor in the first direction and a second direction. The second sub-adaptor faces the first sub-adaptor to support a second side surface of the semiconductor package. The first driving mechanism is configured to move the second sub-adaptor in the second direction. Thus, the adaptor structure can guide the semiconductor packages having different sizes to the socket.

Abstract: A socket contact for testing a semiconductor. The socket contact includes a first contact portion, a second contact portion, and first and second body portions connecting the first contact portion and the second contact portion, wherein each of the first and second body portions has a first end, a second end opposite to the first end, and a connecting portion between the first and second ends, the first end of the first body portion and the first end of the second body portion contact the first contact portion, the second end of the first body portion and the second end of the second body portion contact the second contact portion, and the connecting portion of the first body portion and the connecting portion of the second body portion are spaced apart from each other.

Abstract: A semiconductor package is tested while being inserted into a test socket installed at a test board. The test socket includes a base accommodating a semiconductor package and a contact sheet where a plurality of contact terminals are formed. The contact sheet is fixed to the base through an insert slot formed at one side of the base. The base includes an adaptor installed at a socket body fixed to a test board and fixing a contact sheet. The insert slot is formed between the top of the socket body and the bottom of the adaptor. The contact sheet has a plurality of fix holes. A plurality of stoppers are formed at a bottom surface of the adaptor and inserted into the fix holes, respectively. The adaptor exhibits the shape of a quadrangular ring. An inclined surface is formed at an inner wall of the adaptor to guide a position of the semiconductor package.

Abstract: A test kit for a semiconductor package and a method of testing a semiconductor package using the same are provided. The test kit may include a pick-and-place tool for loading/unloading a semiconductor package, a head assembly for guiding a semiconductor package released from the pick-and-place tool, and a socket for receiving the semiconductor package from the pick-and-place tool. The method may include performing pre-alignment by inserting one or more slide posts of an alignment tool into a socket, releasing a semiconductor package through a package guider, and attaching the semiconductor package onto a socket.