Patents by Inventor Hyungwoo Yoon

Hyungwoo Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11962960
    Abstract: A sound component assembly includes: a sealing portion provided in a sound passage connected to a sound hole of an electronic device to surround a portion of the sound passage and contact at least a portion of a printed circuit board (PCB) having a sound module mounted thereon; and a cover portion disposed to face the PCB outside the sealing portion, wherein the sealing portion may include a first material, the cover portion may include a second material, and the second material may have a greater hardness than a hardness of the first material.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyungwoo Lee, Jongchun Wee, Byounguk Yoon
  • Patent number: D718279
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: November 25, 2014
    Assignee: Harman International Industries, Incorporated
    Inventors: Hyungwoo Yoon, Robert Lange
  • Patent number: D718280
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: November 25, 2014
    Assignee: Harman International Industries, Incorporated
    Inventor: Hyungwoo Yoon
  • Patent number: D722595
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: February 17, 2015
    Assignee: Harman International Industries, Incorporated
    Inventors: Damian Mackiewicz, Alexander Demin, Hyungwoo Yoon
  • Patent number: D726686
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: April 14, 2015
    Assignee: Harman International Industries, Incorporated
    Inventor: Hyungwoo Yoon
  • Patent number: D748076
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: January 26, 2016
    Assignee: Harman International Industries, Incorporated
    Inventor: Hyungwoo Yoon
  • Patent number: D754092
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: April 19, 2016
    Assignee: Harman International Industries, Incorporated
    Inventors: Damian Mackiewicz, Alexander Demin, Hyungwoo Yoon
  • Patent number: D754104
    Type: Grant
    Filed: January 2, 2015
    Date of Patent: April 19, 2016
    Assignee: Harman International Industries, Incorporated
    Inventors: Hyungwoo Yoon, Alexander Demin
  • Patent number: D765617
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: September 6, 2016
    Assignee: Harman International Industries, Incorporated
    Inventors: Damian Mackiewicz, Alexander Demin, Hyungwoo Yoon
  • Patent number: D766214
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: September 13, 2016
    Assignee: Harman International Industries, Incorporated
    Inventors: Damian Mackiewicz, Alexander Demin, Hyungwoo Yoon
  • Patent number: D766215
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: September 13, 2016
    Assignee: Harman International Industries, Incorporated
    Inventors: Damian Mackiewicz, Alexander Demin, Hyungwoo Yoon
  • Patent number: D789323
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: June 13, 2017
    Assignee: Harman International Industries, Incorporated
    Inventors: Damian Mackiewicz, Alexander Demin, Hyungwoo Yoon
  • Patent number: D999802
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: September 26, 2023
    Assignee: Shenzhen Oceanwing Smart Innovations Technology Co., Ltd
    Inventors: Kebi Ding, Hyungwoo Yoon