Patents by Inventor Hyunho BAEK

Hyunho BAEK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11283155
    Abstract: An electronic device and an antenna device of an electronic device are provided. The electronic device includes a wafer, a radio frequency integrated circuit (RFIC) fabricated in the wafer, an antenna interposer disposed on a surface of the wafer, an antenna structure fabricated in the antenna interposer, the antenna structure comprising a first conductive pattern with a first electrical length and a second conductive pattern with a second electrical length, a switch formed in the RFIC and electrically connected to at least one of the first conductive pattern or the second conductive pattern based on a frequency band of a signal being transmitted or received by the RFIC, and a through hole formed in at least part of the wafer or the antenna interposer and electrically connecting the RFIC and the antenna structure.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: March 22, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Junho Lee, Hyunho Baek
  • Publication number: 20190386378
    Abstract: An electronic device and an antenna device of an electronic device are provided. The electronic device includes a wafer, a radio frequency integrated circuit (RFIC) fabricated in the wafer, an antenna interposer disposed on a surface of the wafer, an antenna structure fabricated in the antenna interposer, the antenna structure comprising a first conductive pattern with a first electrical length and a second conductive pattern with a second electrical length, a switch formed in the RFIC and electrically connected to at least one of the first conductive pattern or the second conductive pattern based on a frequency band of a signal being transmitted or received by the RFIC, and a through hole formed in at least part of the wafer or the antenna interposer and electrically connecting the RFIC and the antenna structure.
    Type: Application
    Filed: June 13, 2019
    Publication date: December 19, 2019
    Inventors: Junho LEE, Hyunho BAEK
  • Patent number: 10180465
    Abstract: Disclosed is an inspection apparatus for inspecting a chip for noise, including an inspection circuit that is connected to a first power line of the chip and that receives a signal to be inspected, wherein the first voltage is applied to the first power line and the signal to be inspected includes noise having a second voltage, and a voltage doubler that is connected to the first power line and boosts a voltage of driving power having the first voltage, wherein the inspection circuit may be driven by the driving power, the voltage of the driving power is boosted by the voltage doubler, and the inspection circuit inspects the chip for the noise of the signal to be inspected.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: January 15, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventor: Hyunho Baek
  • Publication number: 20160341796
    Abstract: Disclosed is an inspection apparatus for inspecting a chip for noise, including an inspection circuit that is connected to a first power line of the chip and that receives a signal to be inspected, wherein the first voltage is applied to the first power line and the signal to be inspected includes noise having a second voltage, and a voltage doubler that is connected to the first power line and boosts a voltage of driving power having the first voltage, wherein the inspection circuit may be driven by the driving power, the voltage of the driving power is boosted by the voltage doubler, and the inspection circuit inspects the chip for the noise of the signal to be inspected.
    Type: Application
    Filed: May 23, 2016
    Publication date: November 24, 2016
    Inventor: Hyunho BAEK