Abstract: The present disclosure relates to a printed circuit board, including: a plurality of insulating layers having a through-portion; a plurality of wiring layers respectively disposed on or in the plurality of insulating layers; a plurality of via layers respectively penetrating through at least a portion of at least one of the plurality of insulating layers and respectively connected to at least one of the plurality of wiring layers; an electronic component at least partially disposed in the through-portion, and embedded in at least one of the plurality of insulating layers; and an insulating film disposed in the plurality of insulating layers, and covering at least a portion of a side surface of the electronic component and at least a portion of a wall surface of the through-portion.

Abstract: A method of manufacturing a stacked structure includes forming a first metal buffer layer including crystal grains on a base substrate, forming a second metal buffer material layer on the first metal buffer layer, and crystallizing the second metal buffer material layer to form a second metal buffer layer, wherein the second metal buffer material layer includes crystal grains, and a density of the crystal grains of the second metal buffer material layer is lower than a density of the crystal grains of the first metal buffer layer.

Abstract: A semiconductor package includes: a package board; a first semiconductor chip disposed on the package board, and having a first recess portion adjacent to a first front surface of the first semiconductor chip facing the package board; a second semiconductor chip disposed side by side with the first semiconductor chip on the package board, and having a second recess portion adjacent to a second front surface of the second semiconductor chip facing the package board; and an interconnect bridge disposed on the first and second front surfaces, and at least partially disposed in each of the first and second recess portions.

Abstract: A memory device includes a base die configured to transmit transmission data that are driven to a first voltage range through a transmission line based on base data, and a core die configured to generate core data by shifting a voltage level of the transmission data received through the transmission line to a second voltage range.

Abstract: The present invention relates to a humanized antibody specific to a Bacillus anthracis protective antigen and a preparation method thereof. An antibody library is created by obtaining a Bacillus anthracis protective antigen antibody of a monkey from immune cells obtained by immunizing a Bacillus anthracis protective antigen, an antibody specific to the Bacillus anthracis protective antigen is selected from the created antibody library, and, on the basis of the antibody, a humanized antibody specific to the Bacillus anthracis protective antigen is finally selected by creating a humanized antibody library against a Bacillus anthracis protective antigen.

Abstract: A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.

Abstract: A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.

Abstract: A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.

Abstract: An NFV cloud for providing a vCPE service by using a single Internet line may comprise: a vCPE service having a virtual LAN interface, a virtual WAN interface, and a virtual management interface; a virtual LAN network, a virtual WAN network, and a virtual management network connected to the virtual LAN interface, the virtual WAN interface, and the virtual management interface, respectively; a physical LAN interface for providing customer traffic to the virtual LAN network; a physical WAN interface for connecting the virtual management network to the outside in order to output, to the outside, traffic which has been output from the virtual WAN network and passed through the vCPE service, or to provide a management function for the vCPE service or the NFV cloud; and an interface agent for controlling a connection between the physical WAN interface and the virtual WAN network or the virtual management network.

Abstract: An NFV cloud for providing a vCPE service by using a single Internet line may comprise: a vCPE service having a virtual LAN interface, a virtual WAN interface, and a virtual management interface; a virtual LAN network, a virtual WAN network, and a virtual management network connected to the virtual LAN interface, the virtual WAN interface, and the virtual management interface, respectively; a physical LAN interface for providing customer traffic to the virtual LAN network; a physical WAN interface for connecting the virtual management network to the outside in order to output, to the outside, traffic which has been output from the virtual WAN network and passed through the vCPE service, or to provide a management function for the vCPE service or the NFV cloud; and an interface agent for controlling a connection between the physical WAN interface and the virtual WAN network or the virtual management network.

Abstract: A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.

Abstract: The disclosure is related to monitoring data traffic of user equipment through a monitoring node. A monitoring node may receive a data packet from user equipment registered for a monitoring service through a secure channel. The monitoring node may perform a monitoring operation on the received data packet and determine whether the received data packet is a malicious packet or a non-malicious packet. When the received data packet is a non-malicious packet, the monitoring node may transmit the data packet to a destination through a communication network.

Abstract: Described embodiments provide an apparatus for providing a digital image by embedding recovery feature. The apparatus may include an input unit, an extraction unit, an embedding unit, and an output unit. The input unit may be configured to receive a digital image. The extraction unit may be configured to extract recovery feature from the received digital image using quad-tree decomposition. The recovery feature may be binary data that represents unique characteristics of the received digital image. The embedding unit may be configured to embed the extracted recovery feature into the received digital image. The output unit may be configured to output the digital image embedded with the recovery feature as a feature hidden image.

Abstract: The disclosure is related to monitoring data traffic of user equipment through a monitoring node. A monitoring node may receive a data packet from user equipment registered for a monitoring service through a secure channel. The monitoring node may perform a monitoring operation on the received data packet and determine whether the received data packet is a malicious packet or a non-malicious packet. When the received data packet is a non-malicious packet, the monitoring node may transmit the data packet to a destination through a communication network.

Abstract: A sound signal processor and a method for processing a sound signal using the same enables the elimination of a plop noise generated in the course of a sound mode checking operation. The sound signal processor receives a sound intermediate frequency (SIF) signal and includes a channel mode discriminator for determining a current sound mode of the received SIF signal; a mode transition checker for performing a checking operation to determine whether the current sound mode has resulted from a transition from a first sound mode to a second sound mode; an amplitude measurement circuit for measuring an amplitude of the received SIF signal; and a controller for controlling a drive of the mode transition checker according to the measured amplitude. If the sound channel mode of a currently input sound signal is a mono channel mode, the amplitude of the input sound signal is measured, and the measured amplitude is compared to a reference level.

Abstract: In order to identify an optical cable for optical communication from a remote place, a Sagnac interferometer including two strands of an optical fiber is formed in the optical cable, and a worker in the remote place applies a disturbance of a popping sound to an optical cable to be identified. The disturbance applied by the worker is detected and regenerated in the form of a sound. The optical cable can be easily identified by comparing the regenerated signal and the disturbed signal in the remote place to thereby prevent an incorrect optical cable from being cut. In addition, the optical cable can be more precisely identified by selecting a different light detecting frequency component in accordance with environment conditions.

Abstract: In order to identify an optical cable for optical communication from a remote place, a Sagnac interferometer including two strands of an optical fiber is formed in the optical cable, and a worker in the remote place applies a disturbance of a popping sound to an optical cable to be identified. The disturbance applied by the worker is detected and regenerated in the form of a sound. The optical cable can be easily identified by comparing the regenerated signal and the disturbed signal in the remote place to thereby prevent an incorrect optical cable from being cut. In addition, the optical cable can be more precisely identified by selecting a different light detecting frequency component in accordance with environment conditions.