Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.

Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.

Abstract: It is an aspect of the present disclosure to provide a display apparatus having an optical clear adhesive (OCA) layer provided such that a permittivity of the OCA layer is changed when a pressure is applied and a method of controlling the same. In accordance with one aspect of the present disclosure, a display apparatus includes: a touch panel; a cover glass disposed at an upper side of the touch panel; a display disposed at a lower side of the touch panel; and an optical clear adhesive (OCA) layer disposed between the touch panel and the cover glass to bond the touch panel and the cover glass, wherein the OCA layer is provided such that a permittivity of the OCA layer is changed when a pressure is applied.

Abstract: A thermoplastic resin composition includes a thermoplastic resin comprising a polycarbonate resin; inorganic fillers; and a sulfonate represented by Formula 1: wherein R1 is a C6 to C30 hydrocarbon group. The thermoplastic resin composition can have excellent impact resistance, rigidity, flame retardance, physical property balance therebetween, and the like.

Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.

Abstract: A silane compound is represented by Formula 1: wherein each R1 is independently a single bond, an ether group, a carbonyl group, a thioether group, a sulfone group, or a substituted or unsubstituted C1 to C20 hydrocarbon group, R2 and R3 are each independently a substituted or unsubstituted C1 to C20 hydrocarbon group, each R4 is independently hydrogen or a C1 to C5 hydrocarbon group, each X is independently halogen, a hydroxyl group, C1 to C20 alkoxy, or C6 to C20 aryloxy, each Y is independently a single bond, an amide group, a thioester group, a hydroxyethylene group, a carbonyl group, an aromatic group or an ester group, a and b are each independently an integer from 1 to 3, a+b is 4, no is an integer from 0 to 5, n is an integer from 5 to 50, and p and q are each independently an integer from 0 to 4.

Abstract: A thermoplastic resin composition includes a thermoplastic resin comprising a polycarbonate resin; inorganic fillers; and a sulfonate represented by Formula 1: wherein R1 is a C6 to C30 hydrocarbon group. The thermoplastic resin composition can have excellent impact resistance, rigidity, flame retardance, physical property balance therebetween, and the like.

Abstract: A polycarbonate resin composition includes a polycarbonate resin; an inorganic filler, wherein the inorganic filler includes talc; and a novel silane compound represented by Formula 1: wherein R1 is C6 to C30 alkyl, R2 is a C6 to C30 hydrocarbon group, R3 is hydrogen or C1 to C5 alkyl, and n has an average value from about 0.1 to about 3. The polycarbonate resin composition can have excellent impact resistance with minimal or no reduction in molecular weight of the polycarbonate resin.

Abstract: A silane compound is represented by Formula 1: wherein each R1 is independently a single bond, an ether group, a carbonyl group, a thioether group, a sulfone group, or a substituted or unsubstituted C1 to C20 hydrocarbon group, R2 and R3 are each independently a substituted or unsubstituted C1 to C20 hydrocarbon group, each R4 is independently hydrogen or a C1 to C5 hydrocarbon group, each X is independently halogen, a hydroxyl group, C1 to C20 alkoxy, or C6 to C20 aryloxy, each Y is independently a single bond, an amide group, a thioester group, a hydroxyethylene group, a carbonyl group, an aromatic group or an ester group, a and b are each independently an integer from 1 to 3, a+b is 4, no is an integer from 0 to 5, n is an integer from 5 to 50, and p and q are each independently an integer from 0 to 4.

Abstract: A polycarbonate resin composition includes a polycarbonate resin; an inorganic filler, wherein the inorganic filler includes talc; and a novel silane compound represented by Formula: wherein R1 is C6 to C30 alkyl, R2 is a C6 to C30 hydrocarbon group, R3 is hydrogen or C1 to C5 alkyl, and n has an average value from about 0.1 to about 3. The polycarbonate resin composition can have excellent impact resistance with minimal or no reduction in molecular weight of the polycarbonate resin.

Abstract: A polycarbonate resin composition includes: a polycarbonate resin; inorganic fillers including flake and acicular fillers; and a sulfonate represented by Formula 1, wherein the sulfonate is present in an amount of about 0.1 parts by weight to about 1.0 part by weight based on about 100 parts by weight of the polycarbonate resin. The polycarbonate resin composition can exhibit excellent stiffness, excellent impact resistance, excellent property balance therebetween, and the like. wherein R1 is a C6 to C30 hydrocarbon group; M is an alkali or alkali earth metal; and n is 1 or 2.

Abstract: A silane compound is represented by Formula 1: wherein each R1 is independently a single bond, an ether group, a carbonyl group, a thioether group, a sulfone group, or a substituted or unsubstituted C1 to C20 hydrocarbon group, R2 and R3 are each independently a substituted or unsubstituted C1 to C20 hydrocarbon group, each R4 is independently hydrogen or a C1 to C5 hydrocarbon group, each X is independently halogen, a hydroxyl group, or C1 to C20 alkoxy, each Y is independently a single bond, an amide group, a thioester group, a hydroxyethylene group, a carbonyl group, an aromatic group or an ester group, a and b are each independently an integer from 1 to 3, a+b is 4, m is an integer from 0 to 5, n is an integer from 5 to 50, and p and q are each independently an integer from 0 to 4.

Abstract: Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature.

Abstract: Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature.

Abstract: An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.

Abstract: A printed circuit board (PCB) assembly is disclosed, which includes a first PCB on which a plurality of first electrode terminals are arranged at intervals from one another; a second PCB on which a plurality of second electrode terminals respectively connected with the first electrode terminals are arranged at intervals from one another; and separation preventing member which prevents the first and the second electrode terminals from deviating from their correct positions when the first and the second electrode terminals are ultrasonically-welded to each other. Accordingly, lateral movement of the first and the second PCBs relative to each other is restricted owing to the separation preventing member, the plurality of first electrode terminals and second electrode terminals can be bonded to each other without deviating from their correct positions.

Abstract: An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.