Abstract: A semiconductor package is provided that includes: a package substrate; an interposer mounted on the package substrate; a first semiconductor chip mounted on the interposer; a plurality of second semiconductor chips mounted on the interposer to surround at least a portion of the first semiconductor chip; a heat radiation member arranged on the first semiconductor chip and the plurality of second semiconductor chips; and a heat blocking member extending from a portion of the heat radiation member and arranged in at least one space among a first space between the first semiconductor chip and at least one of the plurality of second semiconductor chips and a second space between at least two of the plurality of second semiconductor chips.

Abstract: This invention is a video line encapsulation protocol which allows multiple low definition video streams to be combined into a single super frame of high definition video data. Each super frame is formed of individual lines from plural lower definition video input signals. The high definition video frames include meta data in each line identifying the video input source, line and frame. This meta data enables the super frames to be separated into their component input signals within a video processing digital signal processor.

Abstract: This invention is a video line encapsulation protocol which allows multiple low definition video streams to be combined into a single super frame of high definition video data. Each super frame is formed of individual lines from plural lower definition video input signals. The high definition video frames include meta data in each line identifying the video input source, line and frame. This meta data enables the super frames to be separated into their component input signals within a video processing digital signal processor.