Abstract: A semiconductor package includes a substrate, an electronic component mounted on an upper surface of the substrate so that a lower surface of the electronic component faces the upper surface of the substrate, a heat slug disposed on an upper surface of the electronic component so that a lower surface of the heat slug faces the upper surface of the electronic component, a bonding material bonding the heat slug to the upper surface of the electronic component, and an encapsulant in which the heat slug and the electronic component are embedded. A side surface of the heat slug extending between an edge of the lower surface of the heat slug and an edge of an upper surface of the heat slug forms a recess with the upper surface of the electronic component.

Abstract: A semiconductor package includes a substrate, an electronic component mounted on an upper surface of the substrate so that a lower surface of the electronic component faces the upper surface of the substrate, a heat slug disposed on an upper surface of the electronic component so that a lower surface of the heat slug faces the upper surface of the electronic component, a bonding material bonding the heat slug to the upper surface of the electronic component, and an encapsulant in which the heat slug and the electronic component are embedded. A side surface of the heat slug extending between an edge of the lower surface of the heat slug and an edge of an upper surface of the heat slug forms a recess with the upper surface of the electronic component.

Abstract: A biomarker composition includes, as an active ingredient, one or at least two polypeptides having 5 to 120 consecutive amino acids that are selected from the group consisting of an amino acid in which serine (S) at the 56th position is substituted with leucine (L), an amino acid in which serine (S) at the 8th position is substituted with asparagines (N), an amino acid in which threonine (T) at the 81st position is substituted with alanine (A), an amino acid in which valine (V) at the 88th position is substituted with alanine (A), an amino acid in which glycine (G) at the 117th position is substituted with asparatic acid (D), and an amino acid in which glutamic acid (E) at the 119th position is substituted with lysine (K), within an amino acid sequence of VHSV represented by SEQ ID NO: 1.

Abstract: A semiconductor package includes a substrate including at least one mounted electronic device; a sealer disposed to seal the electronic device; and a conductive blocking film disposed on a surface of the sealer and a side surface of the substrate, wherein the substrate includes a spacer formed along an outer edge of a lower surface of the substrate to space the side surface of the substrate and the lower surface of the substrate to be apart from each other.

Abstract: A biomarker composition includes, as an active ingredient, one or at least two polypeptides having 5 to 120 consecutive amino acids that are selected from the group consisting of an amino acid in which serine (S) at the 56th position is substituted with leucine (L), an amino acid in which serine (S) at the 8th position is substituted with asparagines (N), an amino acid in which threonine (T) at the 81st position is substituted with alanine (A), an amino acid in which valine (V) at the 88th position is substituted with alanine (A), an amino acid in which glycine (G) at the 117th position is substituted with asparatic acid (D), and an amino acid in which glutamic acid (E) at the 119th position is substituted with lysine (K), within an amino acid sequence of VHSV represented by SEQ ID NO: 1.

Abstract: A semiconductor package includes a substrate including at least one mounted electronic device; a sealer disposed to seal the electronic device; and a conductive blocking film disposed on a surface of the sealer and a side surface of the substrate, wherein the substrate includes a spacer formed along an outer edge of a lower surface of the substrate to space the side surface of the substrate and the lower surface of the substrate to be apart from each other.

Abstract: A package module includes first and second components, a conductive wall, and a molding portion. The first component and the second component are disposed on a substrate. The conductive wall is disposed between the first component and the second component. The molding portion is disposed on the first component, the second component, and the conductive wall, and has a slot defining a cavity above an upper portion of the conductive wall.