Patents by Inventor Hyun-Seop Kim

Hyun-Seop Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970394
    Abstract: Provided is a method of synthesizing apatite powder by emitting a laser beam to a surface of a substrate immersed in a precursor solution. The method is including immersing a substrate in an apatite-forming precursor solution, emitting a laser beam to a region on a surface of the substrate immersed in the precursor solution, and obtaining apatite powder generated in the precursor solution.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: April 30, 2024
    Assignee: Korea Institute of Science and Technology
    Inventors: Hojeong Jeon, Seung Hoon Um, Yu Chan Kim, Hyung-Seop Han, Myoung-Ryul Ok, Hyunseon Seo, Hyun Kwang Seok
  • Publication number: 20240100690
    Abstract: A gripper includes a body part, a finger base part coupled to the body part to be rotatable, the finger base part including a first finger base part and a second finger base part configured such that when the first finger base part is rotated in a first direction with respect to the body part, the second finger base part is provided to be rotatable in a second direction opposite the first direction with respect to the body part, and a finger part coupled to a first side of the body part or the finger base part to be reciprocal.
    Type: Application
    Filed: February 6, 2023
    Publication date: March 28, 2024
    Inventors: Beom Su Kim, Hyun Seop Lim, Ju Young Yoon, Kyu Jung Kim, Hyo-Joong Kim, Seong Taek Hwang, Ho Jun Kim, Dong Jin Hyun, Min Woong Jeung
  • Publication number: 20240100719
    Abstract: A gripper includes a body part, a finger base part coupled to the body part, and a finger part coupled to a first side of the body part or the finger base part and coupled to the body part or the finger base part to be reciprocal, wherein the finger part comprises a first link structure and a second link structure, sides of which are coupled to the finger base part, respectively, and wherein, in the first link structure and the second link structure, a first support area of the first link structure and a second support area of the second link structure reciprocate in only one of a plurality of directions that cross a direction in which the finger part reciprocates with respect to the finger base part.
    Type: Application
    Filed: February 6, 2023
    Publication date: March 28, 2024
    Inventors: Beom Su Kim, Hyun Seop Lim, Ju Young Yoon, Kyu Jung Kim, Hyo Joong Kim, Seong Taek Hwang, Ho Jun Kim, Dong Jin Hyun, Min Woong Jeung
  • Publication number: 20240083018
    Abstract: An embodiment device includes an input module including a motor configured to generate a rotational force, an output module configured to receive power from the input module to be rotatable, and a connection module having a first side coupled to the input module and a second side, opposite the first side, coupled to the output module, wherein the connection module is configured to transmit the power from the input module to the output module.
    Type: Application
    Filed: February 9, 2023
    Publication date: March 14, 2024
    Inventors: Hyo-Joong Kim, Sang In Park, Ki Hyeon Bae, Ju Young Yoon, Beom Su Kim, Min Woong Jeung, Seong Taek Hwang, Ho Jun Kim, Hyun Seop Lim, Kyu Jung Kim
  • Publication number: 20100184492
    Abstract: A slide mobile phone is provided. The slide mobile phone may include a first main body, a second main body connected to perform a sliding movement while contacting with the first main body, a rail formed along an inner side surface of the first main body, a keypad installed at the first main body and having a projection received in the rail in a side surface, and spring members installed within the first main body for supporting the keypad. The keypad can vertically move by extension and compression of the plurality of spring members when the second main body is moved according to an opening and/or closing movement.
    Type: Application
    Filed: January 15, 2010
    Publication date: July 22, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Bo Ra KIM, Hyun Seop KIM, Chang Hwan HWANG
  • Publication number: 20100133414
    Abstract: A mobile terminal having a supporting member is provided. The mobile terminal includes a main body having a first hinge portion, a first part mounted in the main body, and the supporting member having a second hinge portion connected to the first hinge portion. The supporting member is inserted into the main body and coupled to the main body by rotating about the first hinge portion. By integrally forming the main body of the mobile terminal and the supporting member, a manufacturing cost of the mobile terminal can be reduced and inadvertent loss of the supporting member by a user can be prevented. Further, when the supporting member is stored in a folded position in the main body of the mobile terminal, the supporting member can be used for aesthetic purposes and can provide an enhanced external appearance.
    Type: Application
    Filed: December 1, 2009
    Publication date: June 3, 2010
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kee Moon LEE, Hyun Seop Kim, Chang Hwan Hwang
  • Patent number: D612358
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: March 23, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Woo-Seok Lee, Hyun-Seop Kim, Chang-Hwan Hwang
  • Patent number: D613707
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: April 13, 2010
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Sang-Sik Park, Hyun-Seop Kim, Chang-Soo Lee
  • Patent number: D613708
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: April 13, 2010
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Sang-Sik Park, Hyun-Seop Kim, Chang-Soo Lee
  • Patent number: D613721
    Type: Grant
    Filed: June 5, 2009
    Date of Patent: April 13, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bo-Ra Kim, Hyun-Seop Kim, Chang-Hwan Hwang
  • Patent number: D614155
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: April 20, 2010
    Assignee: LG Electronics Inc.
    Inventors: In Won Jang, Hyun Seop Kim
  • Patent number: D614598
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: April 27, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kee-Moon Lee, Hyun-Seop Kim
  • Patent number: D619554
    Type: Grant
    Filed: July 30, 2008
    Date of Patent: July 13, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yu-Guen Kim, Hyun-Seop Kim, Chang-Soo Lee
  • Patent number: D623163
    Type: Grant
    Filed: December 11, 2009
    Date of Patent: September 7, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Woong Choi, Hyun-Seop Kim, Chang-Hwan Hwang
  • Patent number: D629782
    Type: Grant
    Filed: April 14, 2010
    Date of Patent: December 28, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kang-Moon Kim, Kwan-Eui Hong, Hyun-Seop Kim
  • Patent number: D629783
    Type: Grant
    Filed: April 14, 2010
    Date of Patent: December 28, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kang-Moon Kim, Ha-Youl Jung, Hyun-Seop Kim
  • Patent number: D635539
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: April 5, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chang-Hoon Suk, Hyun-Seop Kim, Chang-Hwan Hwang
  • Patent number: D636368
    Type: Grant
    Filed: October 14, 2010
    Date of Patent: April 19, 2011
    Assignee: LG Electronics Inc.
    Inventor: Hyun Seop Kim
  • Patent number: D640217
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: June 21, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chang-Hoon Suk, Hyun-Seop Kim, Chang-Hwan Hwang
  • Patent number: D670672
    Type: Grant
    Filed: April 5, 2011
    Date of Patent: November 13, 2012
    Assignee: LG Electronics Inc.
    Inventor: Hyun Seop Kim