Abstract: The disclosure is related to controlling electronic devices in a target control area based on a footstep pattern of a registered member. Such controlling may be performed through identifying a person detected by a sensor based on footstep information received from the sensor, obtaining control information associated with the identified registered member, and controlling target devices in the target control area based on the obtained control information.

Abstract: Plasma processing methods of a semiconductor manufacturing apparatus which can minimize the amount of impurities adhered to the surface of a wafer, when a desired process using plasma is performed. According to the plasma processing methods of the semiconductor manufacturing apparatus, after the desired process is completed, the plasma generated over the wafer is diffused, and then the wafer is de-chucked.

Abstract: A plasma shielding member may include a body having a first surface and a second surface that are opposite to each other, and a plurality of through holes each extending from the first surface to the second surface; a narrower portion of a respective through hole formed at one end of each of the through holes; and/or a wider portion of the respective through hole formed at another end of each of the through holes. A plasma shielding member may include a body including a plurality of through holes that extends from a first surface of the body toward a second surface of the body. Each of the through holes may be defined by a narrower portion of the body at a first end of the respective through hole, and by a wider portion of the body at a second end of the respective through hole.

Abstract: The disclosure is related to controlling electronic devices in a target control area based on a footstep pattern of a registered member. Such controlling may be performed through identifying a person detected by a sensor based on footstep information received from the sensor, obtaining control information associated with the identified registered member, and controlling target devices in the target control area based on the obtained control information.

Abstract: A semiconductor apparatus and an image sensor package. The image sensor package includes a semiconductor apparatus including a body having a first surface and a second surface which face each other, a first trench formed in the first surface of the body, a second trench formed in the second surface of the body, a third trench formed in a bottom surface of the second trench, and an aperture connecting the first trench to the third trench, a transparent member placed in the third trench and covering the aperture, a mounting board placed under the second surface of the body, and an image sensor chip placed between the mounting board and the transparent member and surrounded by the second trench.

Abstract: An image data test unit includes a data acquisition unit configured to acquire image data having individual frames, an image data temporary storage unit configured to receive the acquired image data from the data acquisition unit to store a certain amount of the image data, and a test calculation unit configured to sequentially receive the image data from the image data temporary storage unit to store a certain amount of the image data, and compare the stored image data with pre-set test elements. In addition, an image apparatus having the image data test unit and a method of testing image data using the image data test unit are also provided.

Abstract: A cleaning method for cleaning a semiconductor manufacturing apparatus may include generating plasma from a cleaning gas. The semiconductor manufacturing apparatus may be cleaned with the plasma. A positive direct-current voltage may be applied to an ESC of the semiconductor manufacturing apparatus during a cleaning of the semiconductor manufacturing apparatus. A negative direct-current voltage may be applied to the ESC during the cleaning of the semiconductor manufacturing apparatus. Also, a wall of the process chamber may be cleaned by applying the positive direct-current voltage to the ESC.

Abstract: An image data test unit includes a data acquisition unit configured to acquire image data having individual frames, an image data temporary storage unit configured to receive the acquired image data from the data acquisition unit to store a certain amount of the image data, and a test calculation unit configured to sequentially receive the image data from the image data temporary storage unit to store a certain amount of the image data, and compare the stored image data with pre-set test elements. In addition, an image apparatus having the image data test unit and a method of testing image data using the image data test unit are also provided.

Abstract: An image data test unit includes a data acquisition unit configured to acquire image data having individual frames, an image data temporary storage unit configured to receive the acquired image data from the data acquisition unit to store a certain amount of the image data, and a test calculation unit configured to sequentially receive the image data from the image data temporary storage unit to store a certain amount of the image data, and compare the stored image data with pre-set test elements. In addition, an image apparatus having the image data test unit and a method of testing image data using the image data test unit are also provided.

Abstract: Plasma processing methods of a semiconductor manufacturing apparatus which can minimize the amount of impurities adhered to the surface of a wafer, when a desired process using plasma is performed. According to the plasma processing methods of the semiconductor manufacturing apparatus, after the desired process is completed, the plasma generated over the wafer is diffused, and then the wafer is de-chucked.

Abstract: An image data test unit includes a data acquisition unit configured to acquire image data having individual frames, an image data temporary storage unit configured to receive the acquired image data from the data acquisition unit to store a certain amount of the image data, and a test calculation unit configured to sequentially receive the image data from the image data temporary storage unit to store a certain amount of the image data, and compare the stored image data with pre-set test elements. In addition, an image apparatus having the image data test unit and a method of testing image data using the image data test unit are also provided.