Abstract: A wafer cleaning apparatus and a semiconductor manufacturing process are provided.

Abstract: A cleaner includes a body portion including a groove recessed toward inside of the body portion, a first inclined portion extending from the body portion, connected to the groove, and forming a first inclined angle that is an obtuse angle with a ground, and a second inclined portion connected to the first inclined portion and forming a second inclined angle with the ground, the second inclined angle being smaller than the first inclined angle. The cleaner planarizes an upper surface of a conductive material used in a bonding process.

Abstract: A method of fabricating a display panel includes forming light-emitting elements on a base substrate, initially transferring the light-emitting elements to a first film, securing the first film on which the light-emitting elements are arranged, elongating the first film by pressurizing the first film with gas, and secondarily transferring the light-emitting elements, which are rearranged by elongating the first film, to a second film secured to a stage.

Abstract: The present disclosure relates to a manufacturing method of a continuous sheet for circuit board production providing reel type laminates in a roll-to-roll continuous process without a belt press by connecting at least two or more sheet type metal laminates using an adhesion substrate which includes a reinforcement film and a conductor, the manufacturing method providing improved mechanical properties, and excellent chemical resistance and productivity, and the continuous sheet for circuit board production manufactured therefrom.

Abstract: A bonding device includes a stage supporting a bonding target, a lower transmission member adjacent to the stage in a first direction, an upper transmission member spaced apart from the lower transmission member in the first direction, a chamber between the lower transmission member and the upper transmission member, and partially defining an internal space for accommodating air, a thin film between the chamber and the lower transmission member, defining the internal space together with the chamber, and configured to be deformed according to expansion of the internal space as the air is introduced, and a vertical movement member configured to move the lower transmission member in the first direction, and separable from the lower transmission member.

Abstract: A cylinder head, a transfer and bonding system and a method of driving the same to produce a display device that includes light emitting elements provides uniform pressure to light emitting elements during a transfer and bonding process. The cylinder head may include a first bracket accommodating the first transmissive portion; a second transmissive portion spaced apart from the first transmissive portion in a direction by an air layer; a second bracket accommodating the second transmissive portion; and an elastic member surrounding side surfaces of the first bracket and the second bracket, wherein one of the first bracket and the second bracket includes an air path that extends to the air layer.

Abstract: A semiconductor device including: a substrate; a via which penetrates the substrate; a via insulating film formed along an inner wall of the via; and a core plug which fills the via, wherein a residual stress of the via insulating film is 60 MPa to ?100 MPa.

Abstract: A semiconductor manufacturing apparatus includes a wafer stage, a wafer table including main body supported by the wafer stage and a protrusion protruding from a sidewall of the main body in a first direction, a position module on an upper surface of the wafer table and configured to move in the first direction and a second direction intersecting the first direction, an electrostatic chuck on an upper surface of the position module, a first cable connected to the position module, the first cable extending in the first direction and configured to move the position module in the first direction, a second cable between a bottom surface of the protrusion and a lower wall of the wafer stage, the second cable extending in the second direction and configured to move the position module in the second direction, and a cable connecting member connecting the first cable and the second cable.

Abstract: A coating device includes: a stage transfer part including a first long shaft extending in a first direction and a second long shaft extending in a second direction intersecting the first direction; a stage tilting part disposed on the stage transfer part, where the stage tiling part swings about a first swing axis; a stage rotating part disposed on the stage tilting part, where the stage rotating part rotates about a first rotating axis intersecting the first swing axis; a stage aligning part disposed on the stage rotating part, where the stage aligning part includes a first short shaft extending in the first direction and a second short shaft extending in the second direction; and a stage disposed on the stage aligning part, wherein a coating target is seated on the stage, where the stage includes a monitoring camera disposed in a camera seating space defined inside the stage.

Abstract: A system and method for managing medical information with enhanced personal information protection are disclosed. The system and method may generate a distributed key including a user key, an agent key, and a backup key, and manage medical data of a user, using a user agent assigned to each user and the distributed key, to prevent personal information of the user from being directly accessed from outside.

Abstract: The disclosure provides a pressure detection method of a bonding device and a bonding system. The pressure detection method of a bonding device includes forming a backplane substrate including a light emitting element, disposing a pressure detection sheet on the backplane substrate, transferring the backplane substrate and the pressure detection sheet into a chamber, bonding the light emitting element by pressurizing the pressure detection sheet, photographing the pressure detection sheet, and detecting a color developing area of the pressure detection sheet. In the pressure detection method of the bonding device and the bonding system, it can be inspected whether uniform pressure is applied to a pressure detection sheet.

Abstract: The present disclosure provides a display panel and a display panel bonding temperature measurement device. The display panel includes: a substrate having a display area and a non-display area; a pixel electrode in the display area; a first light emitting element bonded to the pixel electrode; a first dummy electrode in the non-display area and adjacent to the pixel electrode; a second light emitting element bonded to the first dummy electrode; and a second dummy electrode connected to the first dummy electrode and in the non-display area.

Abstract: A coating device includes: a stage transfer part including a first long shaft extending in a first direction and a second long shaft extending in a second direction intersecting the first direction; a stage tilting part disposed on the stage transfer part, where the stage tiling part swings about a first swing axis; a stage rotating part disposed on the stage tilting part, where the stage rotating part rotates about a first rotating axis intersecting the first swing axis; a stage aligning part disposed on the stage rotating part, where the stage aligning part includes a first short shaft extending in the first direction and a second short shaft extending in the second direction; and a stage disposed on the stage aligning part, wherein a coating target is seated on the stage, where the stage includes a monitoring camera disposed in a camera seating space defined inside the stage.

Abstract: A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

Abstract: An apparatus for manufacturing a display device includes: a stage unit; and a suction unit located above the stage unit, wherein the suction unit includes: a main body including an outer box with top and bottom openings and an inner cup disposed in the outer box; a first air blower disposed above the main body and including a first main pipe extending in a first direction and a second air blower including a second main pipe extending in a second direction intersecting the first direction; a lower plate coupled to a lower end of the outer box and including a through hole; and a suction inlet defined by an inner end of the lower plate defining the through hole and a lower end of the inner cup, wherein the suction inlet is opened downward.

Abstract: A method for transmitting specific data whose data format is unknown at a relay from a first blockchain network to a second blockchain network via the relay is provided. The method includes steps of: the relay (a) in response to detecting that a blockchain communication message for transmitting the specific data from the first blockchain network following a first data format to the second blockchain network following a second data format is generated, generating a relay message including the blockchain communication message and verification information; and (b) transmitting the relay message to the second blockchain network, thereby instructing the second blockchain network to (i) verify the relay message by using the verification information included in the relay message and (ii) convert the specific data included in the relay message into the second data format to generate converted specific data and then transmit the converted specific data to a receiving party.

Abstract: A wafer polishing method is provided for semiconductor fabrication. The wafer polishing method includes calculating a wear profile of a polishing pad using operation parameters of a pad conditioner, generating a regression model for the wear profile of the polishing pad, and controlling the pad conditioner to condition the polishing pad based on the regression model.

Abstract: A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

Abstract: A method for providing a personal data storage service between a first user who is a data provider and a second user who is a data requester by using a smart contract based on a first layer and a privacy layer and a storage layer based on a second layer is provided. The method has an effect of generating encoded subject data made by encoding subject data by using a random key as an encryption key generated through a data provider terminal, to thereby prevent the personal storage service provider from decoding the subject data. Further, the method has another effect of saving the storage for use in PDS service, since there is no need to generate each of encoded encryption key and encoded subject data in line with each of data requester even if the number of data requesters increase by implementing using a proxy re-encryption technology.

Abstract: A method for transmitting specific data whose data format is unknown at a relay from a first blockchain network to a second blockchain network via the relay is provided. The method includes steps of: the relay (a) in response to detecting that a blockchain communication message for transmitting the specific data from the first blockchain network following a first data format to the second blockchain network following a second data format is generated, generating a relay message including the blockchain communication message and verification information; and (b) transmitting the relay message to the second blockchain network, thereby instructing the second blockchain network to (i) verify the relay message by using the verification information included in the relay message and (ii) convert the specific data included in the relay message into the second data format to generate converted specific data and then transmit the converted specific data to a receiving party.